SJ 3262-1989 General technical requirements for electronic packaging materials SJ3262-1989 standard download decompression password: www.bzxz.net

Ministry of Machinery and Electronics Industry of the People's Republic of China Standard SJ3262-89
General Technical Conditions for Electronic Component Encapsulation Materials 1989-03-20 Issued
1989-03-25 Implementation
Ministry of Machinery and Electronics Industry of the People's Republic of China Issued 1
Ministry of Machinery and Electronics Industry of the People's Republic of China Standard General Technical Conditions for Electronic Component Encapsulation Materials Subject Content and Scope of Application
1.1 Subject Content
This standard specifies the general technical requirements for electronic component encapsulation materials. SJ3262-89
This standard is the common basis for the design, production and use of electronic component encapsulation materials. It is also the basis for the formulation of standards for such products. Product standards should comply with the relevant provisions of this standard. Special technical requirements shall be separately specified in the product standards. 1.2 Scope of Application
This standard applies to the preparation of product standards for electronic component encapsulation materials. 2
Cited standards
Test methods for physical properties of electronic component encapsulation materialsTest methods for average linear expansion coefficient of electronic component encapsulation materialsTest methods for hardness of electronic component encapsulation materialsTest methods for compressive strength and static bending strength of electronic component encapsulation materials3
Test methods for electrical properties of electronic component encapsulation materials4
Classification and model naming
Material classification and application form
Encapsulation materials are classified according to the material system. The classification shall comply with the provisions of Table 1. The application form shall comply with the provisions of Table 2.
Material system
Letter code
Silicon
The Ministry of Machinery and Electronics Industry of the People's Republic of China approved on March 20, 1989Polyester
Polybutadiene
Implemented on March 25, 1989
Application form
School code
SJ3262-89
Hot-melt powder
The working temperature of the material is stipulated as the following three levels: 85℃, 125℃, 155℃. Model naming and marking
Working temperature level
Application form
Material system
Main code
a. Local code: Indicated by the letter "B". Represents the encapsulation material of electronic components. b. Material system code: The letters in Table 1 are used to indicate the material system of the encapsulation material. c Application form: The application form of the encapsulation material is indicated by the letters in Table 2. Transfer molding
d. T. Operating temperature code: The temperature grade of the material is indicated by Arabic numerals according to the .1. Operating temperature grade specified in Article 3.2.
3.4 ​​Marking method
Electronic component encapsulation materials are composed of model and product number in technical documents and packaging. Example: The material system is phenolic and the application form is dip coating. The electronic component encapsulation material with a working temperature of 85℃ should be marked as:
BFQ-85SJ
4 Technical requirements
4.1 Appearance
4.1.1 Requirements
The encapsulation material should be uniform in color, without lumps, gel particles, sundries and other impurities that may affect the use effect.
4.1.2 Inspection method
Observe with the naked eye under bright but indirect natural light. 4.2 Physical properties bZxz.net
Encapsulation materials should be prepared and used according to the manufacturer's instructions. After curing, they should meet the physical property requirements of this standard. Special requirements are specified in the product standard. 4.2.1 Average linear expansion coefficient
4.2.1.1 Requirements
The average linear expansion coefficient of the encapsulation material after curing should be less than 30×10-5mm/℃. 4.2.1.2 Inspection method
4.2.2 Hardness
4.2.2.1 Requirements
, 1. The hardness of the encapsulation material after curing should be greater than the hardness value of 60 Shore hardness. 4.2.2.2 Inspection method
4.3 Mechanical properties
.2.
The encapsulation material is prepared according to the manufacturer's instructions and made into a sample strip according to the provisions of the inspection method standard. After complete curing, its mechanical properties shall meet the requirements of this standard, and special technical requirements may be specified in the product standard.
4.3.1 Compressive strength
The compressive strength of the encapsulation material after curing shall be greater than 25×106Pa. 4.3.2 Static flexural strength
The static flexural strength of the encapsulation material after curing shall be greater than 8×10°Pa. 4.3.3 Inspection method
The compressive strength and static flexural strength shall be inspected in accordance with the provisions of ST
4.4 Electrical properties
, 3.
The encapsulation material is prepared and used according to the manufacturer's instructions. After complete curing, it shall meet the technical requirements of electrical properties in this standard, and special requirements may be specified in the product standard. 4.4.1 Dielectric constant 8
The dielectric constant 6 is 3~8 at 106Hz.
4.4.2 Volume resistivity P
4.4.2.1 Normal volume resistivity
The normal volume resistivity shall not be less than 1x10142cm. 4.4.2.2 Volume resistivity after moisture resistance
The cured encapsulation material is tested after 1000h treatment at a temperature of 40℃ and a humidity of 95% to 90% RH. Its volume resistivity shall not be less than 1x1012Q·cm. 4.4.3 Dielectric loss tangent tg8
4.4.3.1105Hz dielectric loss tangent
10\Hz dielectric loss tangent tg8 shall not be greater than 1×10-2.3
SJ3262-89
4.4.3.2 10°Hz dielectric loss tangent after moisture resistance The cured encapsulation material shall be treated according to the environmental conditions in 4.4.2.2. After 1000h, its dielectric loss tangent tgs at 10°Hz shall not be greater than 5×10-2.4.4.4 Dielectric strength
The dielectric strength of the cured encapsulation material shall be not less than 6kV/mm in normal test. 4.5 Inspection method
The electrical properties of the encapsulation material shall be inspected according to the provisions of SJ
4.6 Applicable period
.4.
The encapsulating material shall be prepared according to the manufacturer's instructions for use, and its applicable period shall be specified separately in the product standard. 4.7 Safety performance
The safety performance of the encapsulating material shall be specified separately in the product standard with reference to the safety technical requirements for electronic components. 5 Inspection rules
5.1 The quality of the encapsulating material shall be guaranteed by the quality assurance system, and the product shall be inspected and qualified by the quality inspection department of the manufacturer before it can be shipped. The shipped products shall be accompanied by a product quality certificate or certification mark. 5.2 The product shall be inspected and delivered in accordance with regulations. Product inspection is divided into routine test (T) and delivery inspection (S). 5.3 Routine inspection of encapsulating materials shall be carried out no less than once a year, and all items of routine inspection shall be inspected according to the technical requirements in the product standard. The conditions and rules of routine inspection shall be carried out in accordance with the provisions in the corresponding test method standards. 1~2 samples for routine inspection shall be randomly selected from the qualified products that have been delivered. Routine inspections should generally be conducted in any of the following situations: a: After formal production, if there are significant changes in structure, materials, and technology that may affect product performance; b: During normal production, regular inspections should be conducted after a certain amount of production has been accumulated; c. When the product is resumed after a long period of suspension; d. When the results of the acceptance inspection are significantly different from those of the last routine inspection; e. When the relevant quality supervision agency requires inspections. When the routine inspection items are unqualified, double sampling should be conducted for the unqualified items for a second inspection. If they are still unqualified, the batch of products is determined to be an unqualified batch. Products that have been delivered but not yet shipped will be returned to the manufacturing workshop, and the products should be stopped immediately. The first batch of products produced should be subjected to routine inspections after the causes of the unqualified items are identified and improved. They will be allowed to leave the factory only after all inspection items are qualified. Products that have left the factory before the first routine inspection will be resolved through negotiation between the supply and demand parties.
5.4 Delivery inspection (factory inspection) and sampling Packaging materials with the same raw materials and the same process are considered as a batch. Delivery inspection is carried out once per batch. 3% of the total number of packages in each batch is sampled, and the minimum number of packages shall not be less than three. Delivery inspection items are in addition to those in 4.4.2.2 and 4.4.3 of this standard.2 items are not inspected (these two items should be carried out in routine inspections and guaranteed by the manufacturer. The rest are inspected according to the technical requirements in the product standards. The delivery inspection items can also be determined by negotiation between the supply and demand parties. SJ3262-89
The conditions and rules of the delivery test shall be carried out in accordance with the corresponding test method standards. If the inspection result of the delivery inspection item is unqualified, double sampling should be carried out on the unqualified item for a second inspection. If it is still unqualified, the batch of products is judged to be an unqualified batch. Return to the manufacturing workshop, and the products that have been shipped shall be resolved by negotiation between the supply and demand parties. 5.5 Product packaging shall be routinely inspected every three months. 6 Marking, packaging, transportation, purchase and storage
6.1 Each outer package of the packaging material shall be affixed with a label. The label shall indicate: a. Product name and trademark:
b. Product model:
c. Net weight, kg:
d. Product standard number:| |tt||e: Date of manufacture and name of manufacturer
f. Mark of inspector.
6.2 Powdered encapsulating materials should be first placed in polyethylene or polypropylene plastic bags, heat-sealed, and then placed in outer packaging (fiberboard barrel or wooden barrel). The barrel should be accompanied by a product certificate, and the outer packaging should be marked with the words "moisture-proof" and "handle with care".
6.3 Encapsulating materials should be stored in a dry and ventilated warehouse and should avoid direct contact with chemicals and organic solvents.
6.4 The packaging of encapsulating materials should ensure that they can be transported by any means of transportation under the condition of avoiding direct rain and snow intrusion and mechanical operation.
Additional remarks:
This standard was proposed by the Electronic Standardization Research Institute of the Ministry of Machinery and Electronics Industry. This standard was drafted by the Electronic Standardization Research Institute of the Ministry of Machinery and Electronics Industry and the State-owned No. 798 Factory. The main drafters of this standard are: Li Weigang, Wang Yongming, and Cai Huiqing.
Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.