SJ 20162-1992 Semiconductor Integrated Circuit JT54LS283 LS-TTL Four-bit Binary Carry-lookahead Full Adder Detailed Specification SJ20162-1992 Standard Download Decompression Password: www.bzxz.net

FL5962, Military Standard for Electronic Industry of the People's Republic of China
Semiconductor Integrated Circuits
SJ20162--92
Detail specification for types JT54LS283 4-bit binary FULLADDERS with fast carry of LS-TTL semiconductor integratedcircuits
Published on 1992-11-19
Implemented on 1993-05-01
Approved by the Ministry of Electronics Industry of the People's Republic of China Military Standard for Electronic Industry of the People's Republic of China Semiconductor Integrated Circuits JT54LS283 4-bitbinary FULL ADDERS with fast carry ofLS-TTL semiconductor integratedcircuits circuits1Scope
1.1Subject content
SJ20162—92
This specification specifies the detailed requirements for the conductor integrated circuit JT54LS283 type 1S-TTL4-bit binary carry-lookahead full adder (hereinafter referred to as the device).
1.2Scope of application
This specification applies to the development, production and procurement of devices. 1.3Classification
The devices given in this specification are classified according to device model, device grade, packaging form, rated value and recommended operating conditions. 1.3.1Device number
The device number should be in accordance with Article 3.6.2 of OJB597 "General Specification for Microtun Circuits". 1.3.1.1 Device model
The device model is as follows:
Device modelbZxz.net
JT54LS283
1.3.1.2 Device grade
Device name
4-bit binary carry-lookahead full adder
The device grade should be Grade B as specified in Article 3.4 of GJB597 and Grade B, as specified in this specification. 1.3.1.3 Package form
The package form is as follows:
Package shape (GB7092 "Semiconductor Integrated Circuit Outline Dimensions") C2UP3 (ceramic leadless lifting carrier package) D16S3 (ceramic dual-inline package)
F16X2 (ceramic flat package)
H16X2 (ceramic sealed flat package)
JI6S3 (ceramic sealed dual-inline package)
The Ministry of Electronics Industry of the People's Republic of China issued it on November 19, 1992 and implemented it on May 1993
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t.3.2 Absolute maximum ratings
The absolute maximum ratings are as follows:
Power supply voltage
Input voltage
European storage temperature
Lead soldering resistance temperature
(10 s)
SJ 20162-92
Note: 1) The device should be able to withstand the increased power consumption when the output short-circuit current (os) is tested. 1.3.3 Recommended operating conditions
The recommended operating conditions are as follows:
Power supply voltage range
Input high-level voltage
Input low-level voltage
Ambient operating temperature
2 Reference documents
Specification value
GB3431.1—82 Conductor integrated circuit symbol Electrical parameter symbol GB3431.2—86 Semiconductor integrated circuit symbol Pin function symbol GB343 9--82 Basic principles of semiconductor integrated circuit TTL circuit test methods GB4590--84 Mechanical and climatic test methods for semiconductor integrated circuits GB4728.12--85 Graphic symbols for electrical diagrams Binary logic units GB7092--93 Outline dimensions of semiconductor integrated circuits GJB548-88 Test methods and procedures for microelectronic devices GJB597-88 General specification for microcircuits
GJB1649-93 Outline for anti-static discharge control of electronic products 3 Requirements
3.1 Detailed requirements
All requirements shall be in accordance with the provisions of GJB597 and this specification. 2
Comply with the logic symbol
Logic diagram
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D, F, R, J type
Pin-out arrangement
5 10111213
Figure 1 Logic symbol, logic diagram and pin-out arrangement3
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3.2 Design, structure and external dimensions
The design, structure and external dimensions shall comply with the provisions of GJB597 and this specification. 3.2.1 Logic symbol, logic diagram and pin-out arrangement The logic symbol, logic diagram and pin-out arrangement shall comply with the provisions of Figure 1. The pin-out arrangement is a top view. 3.2.2 Function table
The function table is as follows:
In the circuit, H is high level and L is low level. First, the input conditions of A, B1, Az, B, Clo determine the values ​​of FI, F, and H
internal position Co,; then the values ​​of Co2, Ag, A4, B, determine F, Fg, and Cof. 3.2.3 Electrical schematic diagram
The manufacturer shall submit the electrical schematic diagram to the appraisal agency before appraisal. The electrical schematic diagram shall be filed by the appraisal agency for future reference. 3.2.4 Package form
The package form shall comply with the provisions of Article 1.3.1.3 of this specification. 3.3 Lead material and coating
The lead material and coating shall comply with the provisions of Article 3.5.6 of GJB597. 4
3.4 ​​Electrical characteristics
The electrical characteristics shall comply with the provisions of Table 1.
Output high level voltage
Output low level
Input bit voltage
At maximum input voltage
Input current
Input high level
Input low level
Output short circuit current
Power supply current
Transmission delay time
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Table 1 Electrical characteristics
Unless otherwise specified
55 C≤T≤125 C
Vcc-4.5V,fou=-400μA
Vh=2.0 V. V,-0.7 V
Vcc-4.5 V, Ior-4 mA
Vr-2.0 V, V.=0.7 V
Vec4.5 V, Iik--18 mA
TA-25 ℃
Vec=5.$ V
Yec-5.5 V
VIH-2.7 V
Vcc=5.5 V
Vec=5.5 V
Yec=5.0 V
Gj=15 pF
Ri-2 kn2
Vcc=5.0 V
C=15 pF
R,=560
Note: 1) The complete test conditions are listed in Table 3. 2) Only one output terminal can be short-circuited at a time.
3.5 Electrical test requirements
A,~A+ B,~-B.
A,~A4, B,~B,
A,-~A, B,~R
Vcc-5.5 V
All inputs grounded
All B terminals groundedOthers
All inputs
CIo→Ren—F
A, B→F
Ag, B,+F
Clo-+Co4
A. B,-Cua
Specification value
—100
The electrical test requirements for devices at all levels should be the relevant groups specified in Table 2. The electrical tests for each group shall be as specified in 5
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of Table 3.
GJB548 test method
Intermediate (before aging) electrical test
Intermediate (after aging) electrical test
Final electrical test
Group A inspection requirements
Group C endpoint electrical test
Group C inspection added electrical grouping
Group D endpoint electrical test (Method 5005)
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Table 2 Electrical test requirements
Class B devices
A2, A3. A7,A9
Group (see Table 3)
AI. A2, A3, A7, A9, A10, A11A1, A2, A3
Not required
A1,A2,A3
Note: 1) This grouping requires PDA calculation (see Section 4.2). Table 3 JT54LS283 electrical test
Reference standard
GB3439
(If there is no other provision, T,=25C)
Vcc=4.5V, all inputs Vm-2.0V, measured output LoH-400 uA
Vcc=4.5V, all inputs Vn=0.7V,
measured output 1α=4mA
Vc=4.5V, measured input Ik=--18mA
Vec-5.5V, measured input V=7.0V, the rest
all inputs y-oV
Vec=5.5V, measured input V=2.7 V. The rest
all inputs X=0 V
Yee-5.5V, input V=0.4V, all other inputs V=4.5 v
Vcc=5.5V, all inputs V㎡4.5V, output under test grounded
all inputs F=0 V
Vcc-5.5 V
all B terminals V=IV,
other inputs Y=4.sV
all inputs V=4.5V
B, devices
A2,A3,A7,A9
A1, A2,A3,A7, A9
A1、A2, A3
A10,A11
AI,A2,A3
Specification value
Load line
Reference standard
GB3439
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Continued Table 3
(If otherwise specified, T=25C)
Specification value
Minimum maximum
T,=125℃, except that Vk is not tested, the parameters, conditions, and specification value requirements are the same as those of A1 group T,=-S5C, except that Vx is not tested, the parameters, conditions, and specification value requirements are the same as those of A1 group Vec-s.0V, tested according to the function table
Pcc-5.0 V,
Figure 2 of this specification
TA-125 C,
Vce=5.0 V,
See Figure 2 of this specification
CIa->Ren-F
Clo-→-Co4
A, B,-→C04
A2, B2-F2
A4, B4→F2
Clo-→Ren-F
Cfo-Co4
Ay B,-→>Co4
A2, B2-→F2
A4, B4-→F2
Except for T=-55℃, the parameters, conditions and specification values ​​are the same as those of A10 group test point Ygc
Output 1%
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Waveform
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Note:① Input waveform: FIMHz, <15ns, t6ns, l≤0.5uS.①R=2kQ±5% (measure F1~F4 output): R,=5602±5% (measure C04 input): C-15pF (including probe and fixture capacitance), diode is 2CK76 or its equivalent model. Figure 2 Load line and waveform diagram
3.6 Marking
Marking should be in accordance with the provisions of Article 3.6 of G597.
3.7 Division of microcircuit groups
The devices involved in this specification are the 11th microcircuit group (see Appendix E of GJB597). 4 Quality assurance regulations
4.1 Sampling and inspection
Except as otherwise specified in this specification, the sampling and inspection procedures shall be in accordance with the provisions of GJB597 and GJB548 Method 5005. 4.2 Screening
Before the identification test and quality consistency test, all devices shall be screened according to the provisions of Table 4 of GJB548 Method 5004.
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4 Screening Procedure
If there is no other provision, the method used in the table refers to the test method of GJB548. Conditions and requirements
Internal visual inspection
(before capping)
Stability baking (do not
end electrical test)
Chill cycling
Constant acceleration
Intermediate (before aging)
Electrical test
Intermediate (after aging)
Electrical test
Permitted nonconformance
Product yield (PDA)
Final electrical test
Fine leak check
Gross leak check
External visual inspection
Test sample extraction for qualification or quality
Conformity test
Class B devices
Test condition B
Test condition C
(150 ,24h)
Test condition C
Test condition E,
YI Fangwen.
This specification A, group
Test condition D
(125 . 160 h)
This specification A, group
5%: This specification A1 group, when
the defective rate does not exceed 10%,
can be fumigated and submitted for aging, only
times.
A2,
A3, A9
Article 3.5
B, grade devices
Test strip B
Test condition C
(150 ℃, 24 h)
Test condition C
Test condition D,
Y, direction
A, group of this specification
Test condition D
(125 C, 160 h)
A, group of this specification
10%, A1 group of this specification,
When the defective rate does not exceed 20%, it can be resubmitted for aging, but only
once is allowed.
Article 3.5 of A2,
A3,
A9
of this specification
can be replaced
by||Method 1011 test
Part A
and can be performed
after the "seal" screening. Failures are caused by lead breakage, shell cracking, and cover falling off.
It is also decided by the manufacturer whether to perform
this screening.
All batches are
adopted
circuit 3 of this specification.
If the intermediate electrical test
is not performed before aging, the failure of the intermediate
(after aging) electrical test AI sub-test
should also be counted as PDA.
After this screening, if the lead coating
is changed or returned, the AI ​​group test should be performed again.
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4.3 Identification inspection
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Identification inspection shall be carried out in accordance with the provisions of GJB597. The inspection carried out shall comply with the provisions of GJB548 Method 5005 and the group A, B, C and D inspections of this specification (see the provisions of Articles 4.4.1 to 4.4.4 of this specification). 4.4 Quality consistency inspection
Quality consistency inspection shall be carried out in accordance with the provisions of GJB597. The inspection carried out shall comply with the provisions of GJB548 Method 5005 and the group A, B, C and D inspections of this specification (see the provisions of Articles 4.4.1 to 4.4.4 of this specification). 4.4.1 Group A inspection
Group A inspection shall be in accordance with the provisions of Table 5 of this specification. The electrical test requirements shall be in accordance with the provisions of Table 2 of this specification, and the electrical tests of each group shall be in accordance with the provisions of Table 3 of this specification. The test of each group may be carried out with one sample. When the required sample size exceeds the batch size, 100% inspection is allowed.
The maximum number of qualified judgments (c) is 2.
5A group inspection
A1 group (static test at 25℃)
A2 group (static test at 125℃）
A3 group (static test at -55℃）
A7 group (functional test at 25℃）
A9 group (parallel test at 25℃）
A10 group (switch test at 125℃）
A11 group (switch test at -55℃)
White-level devices
BI-level devices
Not required
Not required
Note: Φ input signal
f-100 kHz, g=50 %.
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②R=1 ketS%, R,=102±5%R,=27 Q±5%. Figure 3
4.4.2 Group B inspection
Aging and life test circuit
Group B inspection shall be in accordance with the provisions of Table 6 of this specification
Groups B1 to B5 can be used, and devices with unqualified electrical performance in the same inspection batch are used as samples. Table 6 Group B inspection
If there are no other provisions, the methods used in the table refer to the test methods, conditions and requirements of GB548
Group B1
Group B2
Solubility resistance
Group B3
Internal weldability
Group B4
Internal visual inspection
And mechanical properties
BS Group
Bond strength
(1) Hot pressure welding
(2) Ultrasonic welding
Group B8
(a) Electrical parameters
(b) Electrostatic discharge
Electrical sensitivity
w(c) Electrical parameters
B-grade devices
Welding temperature 245℃
2022 or】
GJB1649
Test conditions C or D
A1 group
Al group
B1-grade devices
2022 or
Welding temperature 245℃
Test conditions C or D
Not required
Number of samples
(Number of acceptances)
15/(0)
LTPD is for the number of leads
. The number of devices under test
should be more than 3.
This test can be performed by randomly selecting samples after internal visual inspection before the packaging process.
This test is only performed during initial identification or product re-testing.
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