Some standard content:
National Standard of the People's Republic of China
Mould-proof packaging
1 Subject content and scope of application
This standard specifies the anti-mildew grade, technical requirements and environmental conditions of anti-mildew packaging for packaging. GB/T 4768--1995
Replaces GB4768-84
This standard applies to packaging of mechanical, electrical, electronic, instrument and meter products to prevent mold invasion during circulation. This standard does not apply to packaging of food, medicine and other products to prevent cystic fungus invasion during circulation. 2 Reference standards
GB191 Packaging storage and transportation pictorial symbols
GB4122 General terms for packaging
GB4797.3 Natural environmental conditions for electrical and electronic products Biological GB4798.2 Application environmental conditions for electrical and electronic products Transportation GB/T4857.21 Packaging and transportation Test methods for mildew prevention of packaging GB5048 Moisture-proof packaging
3 Terms
The terms in this standard conform to the definitions in GB4122 and are supplemented by the following terms. 3.1 Fungicide
Chemical substances that inhibit or kill the growth and development of molds. There are two types of fungicide commonly used in industry: residual fungicide and volatile fungicide.
3.2 Mould
It belongs to the fungi, has a filamentous body, can produce spores in various forms, is saprophytic, and has many species. Common ones include Penicillium, Aspergillus and incomplete fungi. It can be used in the industry to produce industrial raw materials. Some molds can harm humans, animals, plants, and industrial products and raw materials. 3.3 Spores Spores are the reproductive bodies of fungi, which are generally very small. Due to the differences in their properties, occurrence processes and structures, they have various names, such as asexual spores (conidia, sporangiospores, etc.) and sexual spores (conjugated spores, ascospores, etc.). Spores that are directly formed by nutrient cells through thickening of cell walls and accumulation of nutrients and can resist adverse environmental conditions are called "thick-walled spores" and "dormant spores". 3.4 Medium medium can provide nutrients for the growth of molds, generally containing nitrogen, carbohydrates, mineral salts (including trace elements) and water. According to the different raw materials used, it is divided into natural culture medium and synthetic culture medium. 3.5 Imitation item
Since the mold test is a destructive test, the valuable and complex packaging cannot be used after the test, or the test sample is too large and large test equipment cannot be provided, the test sample that can represent the material composition and manufacturing process of the product or packaging is used for the test. This sample is called a simulation item.
Approved by the State Administration of Technical Supervision on October 18, 1995 and implemented on April 1, 1996
4 Anti-mildew packaging level
GB/T 4768--1995
4.1 When a product requires anti-mildew packaging, the anti-mildew packaging level requirements of the product must be specified in the product technical documents. 4.2 The anti-mildew packaging level of the package should be determined based on the product's anti-mildew erosion ability, the environmental conditions involved in transportation and storage, the structure of the package, the anti-mildew performance of the selected packaging materials, and the results of the package mold test. 4.3 The anti-mildew packaging level is divided into level 1 packaging, level 2 packaging, level 3 packaging and level 4 packaging. The four levels are detailed in Table 1. Table 1 Anti-mildew packaging level
Packaging level
Level 1 packaging
Level 2 packaging
Level 3 packaging
Level 4 packaging
5 Technical requirements for anti-mildew packaging
5.1 Quality requirements
Inner and outer packaging materials and packaging surfaces, according to GB/T4857.21, 28-day toxic fungus test, no mold growth was found. Level 1 packaging is packaging that is often in the B4 area specified in GB4797.3 or under corresponding environmental conditions (such as the seaside, tunnels, etc.) within two years. During transportation, it is often in the aB1 area specified in GB 4798.2 or the aB2 and aB3 areas with toxic fungus growth conditions, but the packaging has taken anti-mildew measures. After the 28-day toxic fungus test, the inner packaging is sealed intact, and no zero bacteria growth is found on the product surface, and there is no zero bacteria growth on the surface of the inner packaging film. The outer packaging (made of natural materials) has toxic fungi growing in some areas, and the growth area shall not exceed 10% of the entire packaging, but the growth shall not affect the performance of the packaging. Products with level 2 packaging are packaging that is often in the B2, B3 area specified in GB4797.3 or the environmental conditions corresponding to the B2 and B3 areas. After 28 days of artificial accelerated mold test, the product and the inner and outer packaging have local mold growth. The mold growth area shall not exceed 25% of the total area of the packaging. Level 3 packaging is suitable for packaging in the B1 area specified in GB 4797.3 and the aB1 area specified in GB4798.2 or the corresponding environmental conditions. The packaging itself does not take any anti-toxic measures. After the 28-day mold test, the product packaging has serious mold growth in some or the whole package, and the mold growth area accounts for more than 25% of the total area of the packaging. If the test is extended to 84 days, the mechanical properties of the packaging material will decrease during the test period, and mold spots will be produced, affecting the appearance.
Products with level 4 packaging are not suitable for long-term transportation and storage between B2, B3 and B4 areas specified in GB4797.3 or under corresponding environmental conditions in hot and humid seasons. 5.1.1 Anti-mildew packaging design shall be carried out according to the nature, structure, storage and transportation and loading and unloading conditions of the product, as well as the production process of the product, so that the product packaging meets the requirements of the anti-mildew packaging level corresponding to the packaging requirements within two years after leaving the factory. 5.1.1.1 When using sealed packaging, the relative humidity in the packaging container or inner packaging bag shall be controlled at 60% within two years after leaving the factory, and the relative humidity inspection shall be carried out in accordance with the requirements of GB5048 moisture-proof packaging. 5.1.1.2 Products with non-sealed packaging shall adopt effective anti-mildew measures to ensure that the product meets the requirements of its anti-mildew level within two years after leaving the factory. 5.1.2 Before packaging, the packaged products must be strictly inspected in accordance with relevant regulations to confirm that the products are dry and clean, and there are no signs of bacterial growth on the product appearance, and there is no pollution of organic substances that directly cause mold growth. 5.1.3 When taking corresponding protective measures for product packaging in accordance with the provisions of other professional packaging standards, it should be noted that the measures adopted should not have adverse effects on anti-mildew.
5.1.4 The printed logo of anti-mildew packaging shall adopt the logo specified in GB191, and indicate the packaging date and validity period. 386
5.2 Material requirements
GB/T4768—1995
5.2.1 The materials used should not have long-term rust and long-term stains before product packaging. 5.2.2 The materials used for anti-mildew packaging should be selected with strong mildew resistance. The packaging materials that directly contact the product should not use materials that will seriously grow mildew.
5.2.3 All materials with poor moisture resistance should be treated with moisture and mildew resistance according to the corresponding standards and professional product technical requirements. The treated materials should not have adverse effects such as corrosion on the product.
5.2.4 Product packaging materials should be dried according to relevant regulations before use. Avoid using materials with water absorption and moisture permeability exceeding the requirements. 5.3 Packaging environmental conditions
5.3.1 Product packaging should comply with the requirements of GB5048, especially the relative humidity in the packaging environmental conditions should not exceed the specified range, keep the environment clean, and avoid bringing media that are conducive to mold growth into the packaging box. 5.3.2 Avoid organic pollutants such as hand sweat and grease from contaminating products and packaging during the packaging process. 6 Test method
The anti-dance packaging test shall be carried out in accordance with the provisions of GB/T4857.21. 7 Inspection rules
7.1 The packaging shall be inspected according to the anti-mildew grade requirements specified in the corresponding standards and relevant product technical documents. 7.2 All packaging items in the following situations shall be subject to anti-dance packaging tests: 8. Use newly designed anti-toxic packaging items according to product requirements: b. When there are changes in packaging methods, packaging materials and anti-fogging processes c. For packaging items produced normally, sample packaging items for long dance tests according to the provisions of various professional standards. 7.3 After the test, if the anti-poison packaging test results do not meet the grade requirements specified in the technical documents, the test should be repeated with double sampling. If the test still does not meet the requirements specified in the technical documents after repeated testing, it shall be deemed unqualified. 387
A1 Anti-oxygen packaging design
A1.1 Design principles
GB/T4768--1995
Appendix A
Anti-sleeve packaging design
(reference)
Based on the product technical requirements and the conditions for the growth and development of the fungus, the packaging materials and packaging technology should be reasonably selected to ensure that the packaging meets the requirements of the anti-mildew packaging grade.
A2 Halo orchid growth control
A2.1 Fungus growth factors
A2.1.1. Temperature requirements for fungal growth: The optimum temperature range for the growth and development of the mold used in the test is 24-30℃. Some fungi can still grow at -5-108℃, and some fungi grow well at 37℃, but the mycelium cannot survive under high temperature conditions. A2.1.2. Humidity requirements for mold growth: The suitable range of relative humidity for mold growth is 70%-99%. It is difficult to grow when the relative humidity is below 65%.
A2.1.3. Nutrients for mold growth: Natural organic matter can be used as nutrients for mold. A2.1.4. The presence of harmful bacteria: The spread of spores of the fungus is the main way to cause long dance. There are a certain number of spores in the air of almost any space in nature, which can infect objects, but the corrosion properties of the bacteria that corrode materials are specific. A2.1.5. Other factors affecting growth: Light, wind, oxygen and pH value of natural environmental conditions, as well as microclimate conditions of storage and use, can affect the growth of mold. Www.bzxZ.net
A2.1.6 The influence of the above factors on mold growth is interrelated and mutually restrictive. A2.2 Control of mold
A2.2.1 Any one of the factors that control the growth of mold in the package can prevent or delay the impact of the mold on the package.
A2.2.2 The anti-mold measures to control the growth of mold in the package are an integral part of the packaging process of the package, but the anti-mold measures taken shall not have an adverse effect on other process measures and product performance of the package. A3 Selection of packaging materials
When designing anti-mold packaging, attention should be paid to the selection of materials that are not easily used by mold. The degree of mold resistance of packaging materials can be divided into the following three types. A3.1 Materials: Most of these materials are artificial synthetic materials and inorganic materials, which cannot provide nutrients for bacteria. A3.2 Semi-mold-resistant materials: This type of material is the most widely used, consisting of a mixture of mold-resistant and non-mold substances, and the mold resistance is unstable. Its degree of resistance to dew mainly depends on the constituent materials, additives and production process when mixed, such as hot-pressed plastic parts with wood powder as filler, ring-carrying paint, polyethylene film, vinyl chloride products and artificial synthetic rubber. A3.3 Non-mildew-resistant materials: The degree of mildew growth is serious in the mildew test. Most of these materials are natural organic materials and their products, which can provide nutrients for the growth of cyst fungi, such as paper, wood, cotton textiles, natural rubber, leather and products containing these materials. A4 Control of environmental conditions during the circulation of packages A4.1 Attention should be paid to the packaging environment, civilized production should be implemented, and organic substances and moldy materials should be prevented from mixing into the packages A4.2 During the storage and transportation of packages, dryness and ventilation should be strived for. If mold growth is found, it should be handled in time to avoid infection of other packages. 388
A5 Anti-mold packaging methods
GB/T4768—1995
A5.1 Sealed packaging controls the internal environment of the seal, such as vacuuming, filling with inert gas, deoxidation and using moisture-proof agents. These technological measures should be considered in combination with the moisture and rust prevention of the package. It must be pointed out that the above methods can sometimes only delay or inhibit the growth of bacteria in a short period of time. The correct use of volatile mildew inhibitors can inhibit the growth of mold for a longer period of time. The effects of the above methods are closely related to the reliability of the sealing of the package.
A5.2 Non-sealed packaging: When the mold-proof part of the package is required to be mold-proof according to technical conditions, the mold-proof agent can be used to treat the mold-proof material, but attention should be paid to the selection of appropriate mold inhibitors and anti-mold treatment processes, because the effective time of anti-mold of different processes is different. The existing results show that the difference can reach several months to more than ten years. Strengthening packaging management, strictly implementing relevant standards such as moisture-proof and anti-corrosion, controlling the production and circulation environment, and strictly designing packaging can all prevent the packaging from being affected by cystic fungi and achieve the purpose of prevention. Additional Notes:
This standard was proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Research Institute of the Ministry of Electronics Industry. This standard was drafted by the Fifth Research Institute of the Ministry of Electronics Industry. The main drafters of this standard are Chen Tongshan, Zhang Liming, Zhong Yaoming, Bi Yong, and Wang Zhong. 389
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