This section specification applies to film integrated circuits and hybrid film integrated circuits manufactured as standard products or customized products, whose quality is assessed on the basis of identification and approval. GB 11498-1989 Sectional specification for film integrated circuits and hybrid film integrated circuits (using identification and approval procedures) (for certification) GB11498-1989 standard download decompression password: www.bzxz.net

National Standard of the People's Republic of ChinabZxz.net
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure (available for certification)
1 Scope and purpose
1.1 Scope
UDC621.3.049.774
GB 11498-89
This section specification applies to film integrated circuits and hybrid film integrated circuits manufactured as standard products or customized products, whose quality is evaluated on the basis of qualification approval.
1.2 Purpose
The purpose of this specification is to provide priority values ​​for rated values ​​and characteristics, select appropriate test and measurement methods from the general specification, and give general performance requirements for use in the detailed specifications of film integrated circuits and hybrid film integrated circuits developed in accordance with this specification. The test severity and requirements specified in the detailed specifications developed in reference to this section specification shall be equal to or higher than the performance level of the section specification. Lower performance levels are not allowed.
One or more blank detailed specifications are associated with this specification, each blank detailed specification is numbered. Filling in the blank detailed specification in accordance with the provisions of 2.3 of this specification constitutes a detailed specification. According to the IECQ system, such detailed specifications can be used for the granting of identification and approval of membrane integrated circuits and hybrid membrane integrated circuits and quality consistency inspection. 2 General, preferred characteristics, ratings and environmental test severity 2.1 Related documents
GB2471 Nominal resistance series of resistors and nominal capacitance series of fixed capacitors for electronic equipment and their allowable deviation series GB8976 General specification for membrane integrated circuits and hybrid membrane integrated circuits 2.2 Preferred ratings and characteristics
The preferred values ​​of voltage and current are given in IEC747-1; the preferred values ​​of resistors and capacitors are given in IEC63; custom circuits can choose any value and error. 2.3 Information given in the detailed specification
The detailed specification is formulated based on the relevant blank detailed specification. The severity specified in the detailed specification shall not be lower than the severity specified in the general specification or the sub-specification. If more stringent requirements are included, they should be included in the detailed specification and indicated in the test table, such as with an "asterisk". Note: For convenience, data on dimensions, characteristics and ratings can be in tabular form. Each detailed specification should give the following information, and the referenced values ​​should be selected from the applicable clauses of this sub-specification in priority. Each detailed specification should specify the various tests and measurements required for batch inspection and periodic testing. At least the relevant tests and their methods and severity given in this specification should be included.
Approved by the Ministry of Machinery and Electronics Industry on March 18, 1989 and implemented on April 1, 1990
2.3.1 Outline drawings and dimensions
GB11498-89
There should be a diagram of the circuit for easy identification and comparison with other circuits. The detailed specification should specify those dimensions that affect interchangeability and installation and their associated tolerances. All dimensions are expressed in millimeters. In general, the length, width and height of the shell and the distance between the lead terminals should be given; for cylindrical shapes, the diameter, length and diameter of the shell and the lead terminal should be given.
When necessary, for example when a detail specification covers more than one package, the dimensions and their associated tolerances shall be listed in a table below the figure.
When the construction differs from that described above, the detail specification shall specify those dimensional data which adequately describe the circuit. 2.3.2 Mounting
The detail specification shall specify the mounting method used for the circuit in normal use and in vibration, bump or shock tests. The use of the circuit sometimes requires the circuit to be designed with special mounting fixtures. In this case, the detail specification shall specify the mounting fixtures and these fixtures shall be used when performing vibration, bump or shock tests.
2.3.3 Severity of environmental tests
The detail specification shall specify the appropriate test methods and severities selected from Chapter 4 of the general specification. 2.3.4 Marking
The detail specification shall specify the marking content on the circuit and the outer packaging. Inconsistencies with 2.6 of the general specification shall be clearly stated. 2.3.5 Ordering Information
The detailed specification shall specify the following information required when ordering the circuit: (1) Type of circuit (e.g. hybrid thick film integrated circuit), (2) Number of the detailed specification and the product code and evaluation level (where applicable); (3) Function of the circuit (where applicable);
(4) Basic functional characteristics and their deviations (where applicable). 2.3.6 Additional Information (not for inspection)
The detailed specification may include information not normally required for verification by the inspection procedure, such as circuit diagrams, curves, graphs and annotations required for illustration.
3 Qualification and Approval Procedure
See 3.5 of the general specification and the following details:
3.1 Structural Similarity
If the test of a representative type of circuit gives at least the same level of quality for other types grouped together, the evaluation test may be carried out using structural similarity. The Chief Inspector shall declare the means of implementing the "structural similarity" program within the manufacturer and determine representative models for each structurally similar group to the satisfaction of the National Surveillance Inspection Agency (NSI). For the purpose of the qualification approval procedure, two or more circuits are considered to be structurally similar when they have the same circuit function type and use the same design rules, materials, processes and methods (for example, a series of T-type thick film attenuators using the same paste; thin film D/A converters made of the same external components using the same film material and from the same supplier). The samples required for each test should be taken from this combination product.
For the visual inspection, marking, dimensions, sealing, solderability and terminal strength of the circuit, only the same housing is required, and empty packages and (or) electrical non-conforming products may be used.
3.2 Qualification Approval
Qualification approval tests and procedures are given in 3.5 of the general specification. The blank detailed specification should be based on the qualification approval test tables based on batch and periodic tests given in Tables 2 and 3. Table 1 gives the qualification approval procedure based on a fixed sample size table. GB 11498-89
Qualification approval forms (fixed sample size forms) and quality consistency checks (batch-by-batch and periodic tests) together define the minimum testing procedures for finished circuits.
Manufacturing units may voluntarily choose to use assessment levels K, L or M, but may only release products as follows: Assessment level
Release assessment level
K, L or M
Manufacturing units may change their approved assessment levels by completing the relevant tests. If no further periodic tests are performed by the expiration of the test interval date, During testing, the manufacturer may downgrade with the consent of the NSI. Additional tests required for specific applications shall be specified in the detailed specifications.
The post-test electrical limit values ​​for the relevant environmental tests shall be specified in the detailed specifications. 3.2.1 Qualification Approval (Fixed Sample Size Procedure) 3.2.1.1 Sampling
The sample shall be representative of the range of circuits for which approval is sought. The sample size and the number of qualified decisions depend on the specified assessment level and are specified in Table 2.
When additional groups are introduced in the test table, the number of circuits required for group "0" shall also be It shall be increased by a number equal to the number required for the additional group. 3.2.1.2 Tests
For the qualification and approval of circuits covered by a detailed specification, all the tests specified in Table 1 shall be carried out. Each group of tests shall be carried out in the order given.
All samples shall be subjected to the tests of group "0" and then allocated to the other groups. Circuits found to be unqualified in the tests of group "0" shall not be used in other groups. When a circuit fails to meet all or part of the tests of a group, it shall be counted as "a defective product". When the number of defective products does not exceed the number specified for each group (or subgroup), ) The approval is granted when the number of nonconforming products allowed and the total number of nonconforming products allowed are met. Table 1 Test table for identification approval
In Table 2, the sample size and the number of qualified judgments are specified in detail according to the evaluation level. The clause number is quoted from Chapter 4 of the general specification.
Clause number, test and test procedure
01 Group
4.3.1 Visual inspection before sealing
02a Group
4.3.2 External visual inspection and marking inspection
02b Group
4.3.3 Dimensions
03 Group?
4.5.16 Flammability
(For reference only)
Test conditions
Clause number, test and test procedure
04 Group 1
4.5.9 Sealing
05 Group
Main static and dynamic electrical characteristics at room temperature
06 Group
Main static and dynamic electrical characteristics at extreme working temperature
1 Group order 1).2)
Initial measurement
4.5.6 Vibration, scanning frequency
4.5.7 Steady-state acceleration
or 3)
4.5.5 Shock
4.5.7 Steady-state acceleration
Final measurement
2 Group order
Initial measurement
4.5.11 Resistance to soldering heat
4.5.15.2 Resistance to flux 7)
4.5.8 Temperature change
4.5.3 Steady-state damp heat 4
Final measurement
3 Group sequence
4.5.10 Solderability
4.5.12.1 Pull force
Final measurement
Bending (round lead or ribbon lead)
or 3)
Solderability
4.5.12.1 Pull force
Bending (whole row)
4.5.12.2 Push force
GB 1149889
Continued Table 1
Test conditions
4.4.11:05 Grouping
4.5.9: Sealing
4.4.11:05 Grouping
4.4.11:05 Grouping
4.5.9 Sealing
4.4.11:05 Grouping
4.3.2: External visual inspection and
Marking inspection
4.5.9: Sealing 1)
Performance requirements
Clause number, test and test procedure
Final measurement
4 Group sequence
Initial measurement
4.5.2 Low temperature
4.5.1 High temperature storage
Final Measurement
Initial measurement
4.5.14 Durability
Durability:
2000h6)
Final measurement
Notes in Table 1 and Table 3B:
1) Instrument for empty packaged circuits;
2) Installation conditions are as specified in the detailed specifications:
3》Select as specified in the detailed specifications
GB11498-89
Continued Table 1
4) For non-sealed circuits, the damp heat test can be omitted in the detailed specifications: 5) It is allowed to use products with unqualified electrical properties after all processing; 6) In the assessment level K: after 1000h, provisional approval; after 2000h, formal approval;
7) Applicable to products sealed with organic materials. 3.2.2 Quality-Conformity Inspection
3.2.2.1 Composition of Inspection Lot
Test Conditions
4.5.9: Sealing1)
4.5.11:05
5 Groups
Temperature: ℃
Temperature: ℃
4.4.11:05 Groups
4.4.11:05 Groups
4.4.11:05 Groups
4.4.11:05 Groups
Each inspection lot shall consist of circuits with similar structures (see 3.1). When required, all circuits to be released to the user shall be screened. Performance Requirements
For Group A and Group B tests, samples shall be drawn from products produced within one week, or from products manufactured in other cycles declared by the manufacturer, but the longest cycle shall not exceed one month. 3.2.2.2 Tests
The tables of batch tests and periodic tests shall be specified in the relevant blank detail specification. In order to maintain the qualification approval of the circuits covered by a detail specification, all the specified tests shall be carried out. Each group of tests shall be carried out in the order given.
When a circuit fails to meet all or part of a group of tests, it is counted as "a nonconforming product". Approval may be maintained when the number of nonconforming products does not exceed the specified number of nonconforming products allowed per group and the total number of nonconforming products allowed. 3.3 Assessment levels
The assessment levels used for qualification approval (see Table 1) and quality consistency inspection (see the relevant blank detail specification) shall be selected from the following Tables 2 and 3.
In the table: n-
a sample size;
GB 11498-89
Table 2 Assessment levels and acceptance criteria for qualification approval-acceptance criteria (allowable number of nonconforming products). C
Test group or subgroup in Table 1
03 (for reference only)
5(1000h)
(2000h)
Note: 1) When a group test is not required, the circuit can be reduced by the corresponding number of circuits that do not need to be tested. 2) For each specified latent agent, a minimum of 4 circuits are tested n
Table 3 Assessment levels and acceptance judgment numbers for quality consistency inspection (see Table 3A and Table 3B) IL-inspection level in the table;
Table 3A Batch test based on sampling AQL-acceptable quality level;
Clause number is quoted from Chapter 4 of the general specification.
Inspection group or group
Screening (see Table 4)
Group A1
4.3.2 External visual inspection and marking inspection
Group A2
Group A3
Main static and dynamic electrical characteristics at room temperatureMain static and dynamic electrical characteristics at extreme working temperature4.4.11
Inspection group or group
Group B1
Weldability
Group B2
4.3.3 Dimensions
In the table: P—cycle (month);
Sample size:
GB11498—89
Continued Table 3A
Number of qualified judgments for periodic tests based on sampling (number of unqualified products allowed). Clause number is quoted from Chapter 4 of the General Specification.
Inspection group or group
C1 group
Main static and dynamic electrical characteristics at extreme operating temperature
C2 group order1).2)
4.5.6 Vibration, scanning frequency
Steady-state acceleration
or3)
4.5.5 Shock
4.5.7 Steady-state acceleration
C3 group order
4.5.11 Resistance to welding heat
4.5.15.2 Resistance to solvent7)|| tt||4.5.8 Temperature change
4.5.3 Steady-state damp heat 4
C4 Grouping order
High temperature storage
D1 grouping
Durability:
D2 grouping order 5)
Inspection group or group
Bending (round lead or strip
lead)
or 3)
Bending (whole row)
Flammability
(for reference only) 7)
For the notes to this table, see the notes to Table 1.
The screening order should be in accordance with Table 4.
Inspection or test
Visual inspection before sealing
High temperature storage
Temperature change
Steady-state acceleration
Electrical measurement
(Before aging)
Electrical measurement
Before screening)
General specification
Clause number
GB11498-89
Continued Table 3B
Table 4 Screening
Detailed specifications and conditions
Under consideration||t t||24h at maximum storage temperature
10 cycles
Tstgmin
Tstgmax
In the most stringent direction, the acceleration level shall be as specified in the detailed specification
Select parameters
Remove defective products
As specified in the detailed specification
Remove defective products as specified in 6. If the number of rainbow defects exceeds 10%, the batch shall be rejected
Note: 1) Screening is generally carried out before Group A, Group B and Group C inspection. When screening is carried out after passing the Group A, Group B and Group C inspection requirements, the solderability, sealing and Group A tests must be repeated.
As specified in the blank detailed specification. Additional post-screening tests may be required. a. Unless otherwise specified in the detailed specification, it is generally not applicable to non-blank sealed devices. b. Unless otherwise specified in the detailed specification, the measurement results should be recorded. 3.4 Resubmission of rejected batches (for batch-by-batch inspection) GB 11498-89
Any rejected batch after electrical testing shall be returned to the production line for reprocessing or rescreening for identified defects. No new circuits shall be included in the batch.
Then, the batch shall be resubmitted and inspected under tightened inspection conditions. The batch shall retain the same batch number and the details of the resubmission shall be recorded. The same batch shall not be submitted more than three times. 3.5 The manufacturing stage of approved manufacturers in non-IEC member countries is allowed to apply for extended manufacturer approval for membrane integrated circuits and hybrid membrane integrated circuits included in this specification if the conditions of 3.2 of the general specification are met.
4 Test and measurement procedures
This chapter includes all test and measurement procedures typically applied to membrane integrated circuits and hybrid membrane integrated circuits, which are not specified in Chapter 4 of the general specification.
Each detailed specification shall specify all test and measurement procedures required for batch-by-batch inspection and periodic testing. At a minimum, it shall include the relevant tests and the methods and severities specified in this specification. Additional Notes:
This standard was proposed by the National Technical Committee for Integrated Circuit Standardization. This standard was drafted by the 43rd Institute of the Ministry of Machinery and Electronics Industry. The main drafter of this standard was Feng Youmin.
Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.