SJ/T 11091-1996 General technical conditions for tinned round leads for electronic devices SJ/T11091-1996 Standard download decompression password: www.bzxz.net

UDC621.315.51
National Standard of the People's Republic of China
GB12061--89
Downgraded to SJ/T11091-96
General specification for lead-tinned fonelectronic components and devices1989-12-29
Implemented on 1990-07-01
Published by the State Administration of Technical Supervision
TTTKKAca
National Standard of the People's Republic of China
General specification for lead-tinned forelectronic components and devices devices1 Subject content and scope of application
GB12061-89
This standard specifies the general technical conditions for tinned round leads for electronic components (hereinafter referred to as tinned leads). This standard is applicable to the tinned leads required for the manufacture of external leads of electronic components such as resistors, capacitors, mid-circuit transformers, and inductors. 2 Reference standards
GB469 Lead ingots
GB728 Tin ingots
GB2423.28 Electricity
GB2423.32
GB2424.21
3 Product classification
3.1 Product varieties
Basic environmental test regulations for electrical and electronic products Test T Soldering test method Basic environmental test regulations for electrical and electronic products Wetting weighing method Solderability test method Basic environmental test regulations for electrical and electronic products Wetting weighing method Solderability test guide Wire and cable Metal conductor material resistivity test method Bare wire test method Dimension measurement
Bare wire test method Tensile test
Bare wire test method Bending test Repeated bending Tinned leads include the following varieties: tinned round copper wire, tinned round copper clad steel wire, tinned round nickel wire, tinned round iron-nickel alloy wire, tinned round steel wire, etc.
3.2 Product Model
The model of tinned lead wire is divided according to the following characteristics of the product: a.
Base metal material;
Coating metal material;
Coating thickness grade,
Coating coating process (electroplating or hot-dip plating); d.
Wire state (soft, semi-hard, hard). e.
3.3 Product Code
3.3.1 Products are represented by model, specification and corresponding product standard number. 3.3.2 Product model indication method:
3.3.2.1 Base metal material
Steel - G
Approved by the State Administration of Technical Supervision on December 29, 1989 YYKAONYKCa
Implemented on July 1, 1990
Copper clad steel - GT
Nickel - N
Nickel-iron alloy - Nt
3 .3.2.2 Coating metal material
Pure tin—1
Tin infiltration A small amount of added elements—2
Tin (95±3)%, lead balance
Tin (60±3)%, lead balance—
Tin (30±3)%, lead balance—5
GB12061—89
The ratio of tin and lead and their codes can also be agreed upon by both the supplier and the buyer. 3.3.2.3 Coating thickness h grade
The coating thickness h grade shall comply with the requirements of Table 1. Table 1
3.3.2.4 Plating process
Hot dip plating—
Hot dip plating plus electroplating mixed method——HbzxZ.net
3.3.2.5 Wire state
Soft state——R
Semi-hard state——1/2Y
Hard state——
3.3.2.6 Order of arrangement of model components Plating thickness h
9
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