SJ/T 11091-1996 General technical conditions for tinned round leads for electronic devices SJ/T11091-1996 Standard download decompression password: www.bzxz.net
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UDC621.315.51 National Standard of the People's Republic of China GB12061--89 Downgraded to SJ/T11091-96 General specification for lead-tinned fonelectronic components and devices1989-12-29 Implemented on 1990-07-01 Published by the State Administration of Technical Supervision TTTKKAca National Standard of the People's Republic of China General specification for lead-tinned forelectronic components and devices devices1 Subject content and scope of application GB12061-89 This standard specifies the general technical conditions for tinned round leads for electronic components (hereinafter referred to as tinned leads). This standard is applicable to the tinned leads required for the manufacture of external leads of electronic components such as resistors, capacitors, mid-circuit transformers, and inductors. 2 Reference standards GB469 Lead ingots GB728 Tin ingots GB2423.28 Electricity GB2423.32 GB2424.21 3 Product classification 3.1 Product varieties Basic environmental test regulations for electrical and electronic products Test T Soldering test method Basic environmental test regulations for electrical and electronic products Wetting weighing method Solderability test method Basic environmental test regulations for electrical and electronic products Wetting weighing method Solderability test guide Wire and cable Metal conductor material resistivity test method Bare wire test method Dimension measurement Bare wire test method Tensile test Bare wire test method Bending test Repeated bending Tinned leads include the following varieties: tinned round copper wire, tinned round copper clad steel wire, tinned round nickel wire, tinned round iron-nickel alloy wire, tinned round steel wire, etc. 3.2 Product Model The model of tinned lead wire is divided according to the following characteristics of the product: a. Base metal material; Coating metal material; Coating thickness grade, Coating coating process (electroplating or hot-dip plating); d. Wire state (soft, semi-hard, hard). e. 3.3 Product Code 3.3.1 Products are represented by model, specification and corresponding product standard number. 3.3.2 Product model indication method: 3.3.2.1 Base metal material Steel - G Approved by the State Administration of Technical Supervision on December 29, 1989 YYKAONYKCa Implemented on July 1, 1990 Copper clad steel - GT Nickel - N Nickel-iron alloy - Nt 3 .3.2.2 Coating metal material Pure tin—1 Tin infiltration A small amount of added elements—2 Tin (95±3)%, lead balance Tin (60±3)%, lead balance— Tin (30±3)%, lead balance—5 GB12061—89 The ratio of tin and lead and their codes can also be agreed upon by both the supplier and the buyer. 3.3.2.3 Coating thickness h grade The coating thickness h grade shall comply with the requirements of Table 1. Table 1 3.3.2.4 Plating process Hot dip plating— Hot dip plating plus electroplating mixed method——HbzxZ.net 3.3.2.5 Wire state Soft state——R Semi-hard state——1/2Y Hard state—— 3.3.2.6 Order of arrangement of model components Plating thickness h 9 Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.