This standard specifies the test method for the leveling performance of electroplating solutions. This standard is applicable to electroplating solutions with various leveling performances. JB/T 7704.5-1995 Electroplating solution test method Leveling test JB/T7704.5-1995 Standard download decompression password: www.bzxz.net
This standard specifies the test method for the leveling performance of electroplating solutions. This standard is applicable to electroplating solutions with various leveling performances.

Mechanical Industry Standard of the People's Republic of China
Test Methods for Electroplating Solutions
Leveling Test
1 Subject Content and Scope of Application
This standard specifies the test method for the leveling performance of electroplating solutions. This standard is applicable to electroplating solutions with various leveling performances. 2 Reference Standards
GB6462bzxz.net
2 Microscopic Measurement Method for Cross-Sectional Thickness of Metal and Oxide Coverings 3 Terminology
Leveling Effect: The ability of the plating solution to make the surface of the coating smoother than the underlying surface. 4 Principle of the Method
JB/T 7704.5-95
Artificially create a sample with a microscopic rough surface, electroplate it in the plating solution to be tested, measure the changes in the microscopic contour of the sample surface before and after electroplating, and evaluate the leveling performance of the plating solution. 5 Test method
5.1 Pseudo-sine wave method
5.1.1 Overview
A cathode sample with regular "peaks" and "troughs" on the surface is made by tightly wrapping a bare copper wire around a copper rod, and then electroplated in the plating solution to be tested. The changes in the amplitude of the "peaks" and "troughs" (plating thickness) of the microscopic surface of the cathode sample after plating are measured to evaluate the leveling ability of the plating solution. 5.1.2 Test instruments and equipment
Metallographic microscope with photographic device;
Metallographic inlay machine:
c.Metallographic polishing machine:
d, laboratory electroplating equipment.
5.1.3 Plating solution and process conditions
The plating solution to be tested and the spacer layer plating solution. The selected spacer layer plating solution should only have geometric leveling properties, and the color contrast between its plating layer and the plating solution to be tested is preferred. Cyanide copper inlay solution and ordinary nickel plating solution are often used. The electroplating process conditions are specified by the corresponding plating solution. 5.1.4 Cathode Sample and Anode
5.1.4.1 Cathode Sample
Take a 5mm copper rod. At one end of the copper rod, saw a slit about 20mm long perpendicular to the circular cross section from the point where it deviates from the center of the circle. Use 0.15mm bare copper wire to saw a section along the copper rod, and tightly wrap the copper rod in a circle-by-circle manner to form a spiral shape, so that its cross section appears to be a regular pseudo-sine waveform with crests and "troughs", and use it as the cathode sample. 5.1.4.2 Anode
Select an anode plate that corresponds to the plating solution and meets national standards. Approved by the Ministry of Machinery Industry on June 20, 1995
Implemented on January 1, 1996
5.1.5 Test Procedures
JB/T 7704. S --. 95
5.1.5.1 Pour the plating solution to be tested and the spacer layer plating solution into their respective plating tanks, and place the corresponding anodes in the tanks. Keep the plating solution constant at the pre-selected temperature according to the process conditions.
5.1.5.2 After the cathode sample has been subjected to conventional pre-plating treatment, it is charged and placed in the spacer layer plating tank for flash plating. 5.1.5.3 After flash plating, the sample is washed with water, etched with weak acid, and then placed in the plating tank to be tested, and electroplated at the specified current density for 15~~20min; take out the sample, rinse with water, and quickly put it into the spacing layer plating tank with charge, and electroplate at the specified current density for 3~~5min. In this way, the plating solution coating to be tested and the spacing layer coating are alternately electroplated for 6~~7 times, and finally the spacing layer is plated for about 30mi as a thickened protective layer. 5.1.5.4 Cut the cathode sample of the electroplated layer along the saw seam, saw off the part with the axis winding, and then make a metallographic sample according to the method specified in GB6462. Observe under a 300x metallographic microscope, and take a photo with the micrometer ruler at the same magnification. Develop the metallographic photo. 5.1.6 Calculation of results
5.1.6.1 Use the micrometer scale photo to measure the pseudo-sine wave amplitude (α) and the cumulative thickness () outside the wave crest of the coating plated by the test solution on the metallographic photo of the sample, and draw an α-relationship curve, as shown in Figure 1. alum
μtn
Figure Pseudo-sine wave method amplitude α and wave crest cumulative coating thickness relationship curve 5.1.6.2 Draw a straight line α= in the figure. It intersects with the curve at point L. 5.1.6.3 Read the projection value al of point L on the α axis and substitute it into formula (1). Obtain the leveling ability value. E= 0.4la-α × 100%
Where: E—leveling ability; ao—pseudo-sine wave amplitude when the coating thickness of the tested plating solution is zero, i.e., the radius of the copper wire·um; a—pseudo-sine wave amplitude equals the amplitude when the accumulated coating thickness on the wave crest, um5.1.7 Factors affecting test results
5.1.7.1 Preparation of samples
If the bare copper wire of the prepared sample is not round or is not tightly wound, the measurement result will be biased. 5.1.7.2 Pre-plating treatment
If the pre-plating treatment causes wear or corrosion on the surface of the sample, or impurities are embedded between the turns of the wire, the measurement result will be biased. 5.1.7.3 Metallographic sample preparation
In metallographic sample preparation, if the sample is not cut, polished or etched properly, the measurement result will be biased. 5.1.7.4 Spacer layer
The selected spacer layer plating solution must have geometric integrity, and the boundary of the spacer layer should be clear under the microscope (it is best if the whole layer is a clear isolation line), otherwise the measurement will cause deviation in the result. 5.2 Profiler method (Hall slot test method) 5.2.1 Overview
JB/T 7704.5-95
A standard test piece with a certain roughness is prepared by artificial methods such as sandblasting, and then the plating solution to be tested is placed in the Zhaier slot for electroplating according to the corresponding process conditions. The profiler is used to measure the bonded test piece. The leveling ability of the plating solution is calculated based on the relative change of the surface roughness value of the test piece before and after electroplating.
5.2.2 Test instruments and equipment
Surface profiler (roughness tester); a.
Hall slot test device;
Laboratory electroplating device.
5.2.3 Plating solution and process conditions
5.2.3.1 Plating solution: the electroplating solution to be tested.
5.2.3.2 Process conditions: according to the electroplating solution process conditions. 5.2.4 Cathode specimen and anode
5.2.4.1 Cathode specimen: a 70mm×100mm copper or iron sheet is sandblasted or polished with a grinding wheel or sandpaper to produce three test pieces with surface roughness R of 2.7um, 1.0um, and 0.5μm. The back is coated with insulating paint and dried. 5.2.4.2 Anode: according to the requirements of the plating solution to be tested, the corresponding anode material that meets the national standards is selected to make the Hall cell anode. 5.2.5 Test steps
5.2.5.1 Pour 250ml of the key liquid to be tested into the Hall cell, place the anode, and keep the plating solution constant at the pre-selected temperature according to the process conditions. 5.2.5.2 Draw 10 lines at intervals of 1 cm from 0.5 cm to 9.5 cm from the low current density end of the Hall slot test piece. Use a profilometer to measure the average surface roughness value R (um) at the position in the middle of each line. 5.2.5.3 Apply insulating paint on the back of the Hall slot test piece, dry it, and then put it into the slot with electricity after weak acid washing and water washing. Closely adhere to the inner inclined wall of the Zhaier slot. 5.2.5.4 According to the corresponding process conditions of the plating solution, select a certain current intensity and plating time for electroplating. 5.2.5.5 After the plated Hall slot test piece is washed and dried, use a profilometer to measure the average surface roughness value R (um) at the corresponding measurement position specified in 5.2.5.2. And calculate the flatness according to formula (2). 5.2.5.6 According to needs. The result curve as shown in Figure 2 (example) can be drawn to compare the plating solution leveling performance. 5.2.6 Result calculation
R.=R × 100%
Flatness=year
Wherein: R. — Average roughness of the Hall slot test piece before plating·um; R. — Average roughness of the Hall slot test piece after plating μm. 3.0F
2. 01
. Before plating
·After plating
4567
８９10
Position on the Hall cell test piece
Figure 2 Curve of the result of the Hall cell method for testing the flatness (example) 2)
Sometimes·The workpiece or the test piece with the same surface roughness as the workpiece can also be used directly to test its flatness·At this time, the workpiece or the test piece is electroplated in the test plating solution for a certain period of time according to the process conditions, and the average surface roughness value R (μm) before electroplating is measured. The leveling ability of the test 19
JB/T 7704.5 --95
plating solution is calculated according to formula (2). It should be noted that at this time, the surface roughness of each workpiece before plating and the thickness of the coating after plating must be basically the same, so that the calculated leveling ability can be compared.
5.2.7 Factors affecting the test results
5.2.7.1 Electroplating process conditions
During the test, the electroplating process conditions such as current, temperature, pH value, etc. are unstable. This will cause the current efficiency of the plating solution to change. The thickness of the plated test piece will also change greatly, and the deviation of the flatness result will also be large. 5.2.7.2 Electroplating pretreatment
Prepared by sandblasting or grinding to meet the requirements of 5.2.4.1. The required specimens, when undergoing pre-plating treatments such as degreasing and pickling, if the roughness of the specimen surface is accidentally changed due to corrosion or wear, the flatness measurement results will have a large deviation. 6. Test report
The test report should generally include the following contents: a.
Name and model of the tested plating solution (including additives); this standard number and the test method used:
Test instruments and equipment;
Test conditions;
Test results and calculation formulas:
Abnormal phenomena during the test;
Test date and test personnel.
Additional notes:
This standard was proposed by the National Metal and Non-metal Covering Standardization Committee. This standard was drafted by the Wuhan Materials Protection Research Institute of the Ministry of Machinery Industry. The main drafter of this standard was Zhu Aosheng.
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