GB/T 15861-1995 General technical requirements for ion beam etching machines
Some standard content:
National Standard of the People's Republic of China
Generic specification of inn beam etching system1Subject content and scope of application
GB/T 15861—1995
This standard specifies the terminology, product classification, technical requirements, test methods, inspection rules, packaging, transportation, storage, etc. of inn beam etching systems.
This standard applies to general inn beam etching systems with physical sputtering etching. Other special ion beam etching systems can also be implemented as a reference. 2 References
GB191 Packaging, storage and transportation pictorial mark
GB5080.7 Equipment reliability test Failure rate and mean time to failure verification test plan under constant failure rate assumption SJ 112 General technical requirements for electronic industry special equipment SJ1224 General technical conditions for vacuum evaporation equipment SJ/T10152 Main process equipment for integrated circuits 3 Terms
3.1 Beam energy
Characterizes the kinetic energy of ions in an ion beam. The unit is electron volt (eV). 3.2 Beam current density beam current density The current intensity per unit area on a specified cross section of an ion beam. 3.3 Effective beam diameter effective beam diameter The beam diameter range within which the uniformity of the beam current density hitting the target is within ±5%. 3.4 Uniformity of beam current The percentage of the difference between the maximum and minimum values of the beam current density change between equidistant test points on a specified cross section of the ion beam to the sum of the difference.
3.5 Stability of beam current The ratio of the root mean square value of the beam current intensity change within a specified time to its average value. 3.6 Etch uniformity The inconsistency of the etching rate at different points on the surface of the etched material. 3.7 Neutralizer Neutralizet
Electromagnetic source that produces neutralization of positive charges in the ion beam. 4 Product classification
According to the placement of the workpiece:
a. Vertical ion beam etcher (the workpiece is placed horizontally) Approved by the State Administration of Technical Supervision on December 22, 1995, and implemented on August 1, 1996
GB/T 15861-1995
b. Horizontal ion beam etcher (the workpiece is placed vertically). 5 Technical requirements
5-1 Working conditions
Ambient temperature: 15℃~28℃;
Relative humidity: <60%,
With air conditioning, generally purified room#
Voltage: three-phase four-wire system, AC voltage 380V±10%, 220V±10%, frequency: 50Hz±1%,bzxz.net
Waveform: sine wave,
Power supply power greater than 15kw;
Argon, oxygen purity is 99.99%, nitrogen is 99.9%+Water inlet pressure: 0.2MPa~0.3MPa;
Water inlet temperature: 10℃~26℃;
A standard size interface for discharging exhaust gas ditch should be set up indoors! A trench interface for discharging cooling water should be set up indoors; a wiring terminal with a grounding resistance of less than 40 should be installed indoors; the ion source power supply grounding reference point and the host grounding point should be grounded at one point; the cabinet protection grounding should be separated from the ion source power supply reference point grounding, and the neutral line of the power grid cannot be used as the grounding location. 5.2 Appearance requirements
5.2.1 The appearance of the equipment should be neat, beautiful, and flat, and the surface should not have obvious protrusions, depressions, roughness, scratches, rust and other defects. The signs are firmly installed, the handwriting is clear, and the markings are consistent with the content. 5.2.2 The paint layer of the paint-coated parts should be flat, clear, firm and smooth, and the color should be consistent, and there should be no defects such as sagging, bubbling, and scratches. 5-2.3, the surface of the electroplated and chemically coated parts should be smooth and fine, without spots, rust, bubbling, burn marks and other defects. 5.2.4 The fasteners are firmly connected and there is no looseness. 5.3 Safety requirements
5.3.1 The equipment should have safety protection devices or alarm devices such as overload, short circuit, power failure, and water failure. 5.3.2 The insulation resistance of the ion source power supply terminal should be greater than 20M2. The terminal is equipped with a protective device. 5.3.3 The equipment should be equipped with a safety interlock device to avoid misoperation. 5.4 Main performance requirements
5.4.1 Beam energy
The beam energy of the etching machine should be specified in the specific product standard, and the beam energy value should be in the range of 0 eV~1000 eV. 5.4.2 Beam current density
The size of the beam current density is given in the specific product standard according to the value specified in Table 1. Table 1
Beam energy
1000eV
5.4.3 Beam current uniformity
The beam current uniformity index should be given in the product standard, and its index value should not be greater than 5%. Beam current density
0.5mA/cm2
1mA/cm
GB/T 15861—1995
5.4.4 Effective beam diameter
The effective beam diameter of the etching machine shall be specified in the specific product standard, and the effective beam diameter shall be selected from the three specifications of $60, 180, and 100. The error shall not exceed ±:2%.
5.4.5 Beam stability
The beam stability index shall be given in the product standard, and its index value shall not exceed ±1% within 1 h
b. It shall not exceed ±2% within 4 h.
5.4.6 Vacuum degree
The ultimate pressure of the etching machine studio shall not exceed 6.7×10-*Pa; a.
The working pressure of the etching machine studio shall not be less than ×10-Pa. h.
5.4.7 Recovery time of vacuum
The exposure time of the etching machine to air should not exceed 20min. When the vacuum is pumped from the atmosphere to 4×10-Pa, the time required should not exceed 20min. 5.4.8 Etching table
The angle of the etching table should be continuously adjustable within the range of 0°~90°, and the rotation should be 6~10 revolutions per minute. 5.4. 9 Workpiece temperature rise
When the etching machine processes the workpiece, the temperature rise of the workpiece surface should not exceed 70℃. 5.4.10 Etching uniformity
When etching the etching sample with a uniform film thickness of ±5, the etching uniformity should not exceed ±5%. 5.4.11 Ion beam neutralization method
The ion beam of the etching machine adopts a hot filament neutralizer. 5.5 Reliability requirements
The average trouble-free working time of the product should be no less than 70h, and the average maintenance time should not be more than 3h. 5.6 Completeness requirements
When the supplier supplies the ion beam etcher, it shall include the mainframe, accessories, wearing parts, random technical documents and other requirements specified in the contract. The types, specifications and quantities of accessories, wearing parts and random technical documents shall be clearly specified and explained in the specific product standards and product manuals.
5.7 Packaging and transportation requirements
The packaging boxes of the ion beam etcher components shall not be damaged or deformed during transportation, and shall ensure that the equipment is in good condition. 6 Test methods
The measuring instruments used in the test are within the validity period of the meter calibration. 6.1 Appearance inspection
The appearance and the quality of paint, electroplating and chemical coating shall be measured daily. 6.2 Safety inspection
6.2.1 The output terminals of the screen grid power supply, anode power supply and acceleration grid power supply are respectively short-circuited for a moment, and the overload protection device is observed to see whether it is activated. 6.2.2 Use a 1.5-level, 2500V megohmmeter to measure the insulation resistance of the ion source terminal to the ground. 6.2.3 Check the interlocking device of the mechanical pump and the diffusion pump operation sequence. Check the interlocking and replacement device of the cooling water, the diffusion pump and other cooling parts of the equipment.
6.3 Main performance test
6.3.1 Beam energy test
Connect the positive terminal of the screen grid power supply with the negative terminal of the anode power supply, and use a digital voltmeter with an accuracy of one tenth of a millimeter to measure the output voltage of the screen grid power supply and the anode power supply respectively, and calculate it using the following formula.
..com In the formula: E\-·- represents the beam energy, eV
E—electron charge:
Vs——ion source screen grid power supply voltage, V
VA\\-ion source anode power supply voltage, V; GB/T 15861-1995
E, =e(V.+Va+Ve)
Vt—ion source plasma sheath potential, theoretical value is about 5V. 6.3.2 Beam Density Detection
According to the selected ion source, under the specified test conditions, i.e. Va=50V, Vs=500V, V,=-70V, without neutralization, and the distance from the target to the ion source outlet is a, the test method is as shown in Figure 1. The Faraday cup probe area is 1cm. Under the specified distance d, move the probe radially with 1.The maximum beam current density measured by the 5-level 3mA milliammeter.
Figure 1 Schematic diagram of beam current density test method
S-ion source; F-Faraday spool; A-milliammeter d-distance from target to ion source outlet
6.3.3 Beam current uniformity test
According to the test conditions selected in 6.2.2, the equipment runs for 15 minutes to preheat. According to the method shown in Figure 1. The Faraday spool is measured three times along the radial direction of the beam, on the forward and return paths. Each time, it moves equidistantly every 0.25cm, and the corresponding beam current of the corresponding point is measured. The average value of the three test values of each point on the forward and return paths is calculated respectively, and then the arithmetic average value of each point on the forward and return paths is calculated by the arithmetic average value of the forward and return paths. From the average value, the maximum and minimum beam current density values are determined and substituted into the following formula for calculation. I
where: 1· is the beam density uniformity;
n×100%
the maximum beam density value in the average value of the same process and the same process; Im
Imin——the minimum beam density value in the average value of the process and the return process. 6.3.4 Effective beam diameter detection
According to the data measured in 6.3.3, calculate according to formula (2) to find the minimum beam diameter range that meets the upper 5% beam density uniformity. (2)
GB/T15861-1995
6.3-5 Beam stability detection
Use the method shown in Figure 2, sample the total beam current through a precision resistor with an accuracy of one ten-thousandth, and read the value with a digital voltmeter with an accuracy of one thousandth, and read it every 3 minutes. Substitute the data obtained from the measurement for 1h and 4h into the following formula for calculation. That is, 2(,-1)
where ·I=
i--1,2...-.
I~—beam stability!
n number of readings;
I—arithmetic mean of beam current within the number of measurements. s1
Li Yudong
Figure 2 Schematic diagram of beam stability test
S—ion source +T—target; V.—acceleration grid power supply V.-screen grid power supply; V—digital voltmeter iR—wire-wound resistor 6.3.6 Vacuum test
Measured by using a randomly configured vacuum gauge. +(3)
Measure the ultimate pressure of the equipment under 3h continuous exhaust conditions or after the equipment etching operation. a.
b Select the anode voltage of 50, control the gas supply system, and reduce the pressure from 4×10-2Pa. Adjust the filament power supply and measure the highest pressure that can produce stable discharge:
6.3.7 Vacuum recovery time test
Use a clock to measure the time required to pump from atmospheric pressure to 4×10-Pa after opening the vacuum chamber for 20min. 6.3.8 Etching table inspection
Use visual inspection to check whether the tilt angle of the etching table is continuously adjustable and the number of rotations per minute. 6.3.9 Workpiece temperature rise inspection
When the beam power (i.e. the product of the beam current and the screen grid voltage) is less than 0.5W, use a thermocouple to measure the workpiece temperature and time relationship curve. The temperature corresponding to the saturated part of the curve minus the room temperature is the highest temperature rise of the workpiece on the etching table. 6.3.10 Etching uniformity inspection
Take an etching sample with a film thickness uniformity of ±5%. The sample is laid out, and five test points are determined, including four points distributed at 90° on the circumference of a circle with a diameter of 70% of the ion source beam diameter and the center of the circle. The etching depth of each point is measured by an interference microscope, and the measured data is calculated according to formula (4). In the formula: h——etching uniformity,
hx——maximum etching depth,
minimum etching depth.
6.3.11 Beam neutralization method inspection
GB/T15861—1995
Visually inspect the hot filament cathode neutralizer device. 6.4 Reliability test
hrmm=he×100%
hmy+hmin
Inspect according to the 4:7 probability ratio sequential truncation test plan specified in GB5080.7. 6.5 Completeness inspection
Inspect the completeness of the product according to the instruction manual and the supply contract. 6.6 Packaging and transportation test
Fix the package of the ion beam coating machine on the test bench according to the mark on the package box, vibrate at a frequency of 4Hz, an amplitude of 0.35mm, and last for 2h. After the test, check that the package box is intact and has no defects, and the product tested after startup should meet the technical requirements. 7 Inspection rules
The inspection of ion beam etching machine is divided into finalization inspection, acceptance inspection and routine inspection. 7.1 Finalization inspection
7.1.1 Finalization inspection shall be carried out by the quality inspection department of the production unit or the superior inspection department. 7.1.2 Finalization inspection shall be carried out in any of the following situations:
Development of new products;
Improvement of design or main process, replacement of main components and materials; h.
When the national quality supervision agency puts forward the requirement of finalization inspection. 7.1.3The items and sequence of finalization inspection shall be in accordance with the provisions of Table 2. If any item fails during the inspection, the inspection shall be stopped, the cause of the failure shall be found out, and after the failure is eliminated, the acceptance inspection shall be carried out again. 7. 1. 4
If the fault occurs again during the re-inspection, the machine shall be judged as unqualified, but it is allowed to be repaired and then re-inspected. Table 2
Inspection items
Appearance requirements
Safety requirements
Beam energy
Beam density
Flow uniformity
Effective beam diameter
Beam flow stability
Technical requirements Article number
Test method number
Type inspection
Acceptance inspection
Routine inspection
Inspection items
Vacuum degree||tt| |Nuclear vacuum time
Etching platform
Working temperature rise
Etching uniformity
Ion beam neutralization method
Reliability requirements
Complete set requirements
Packaging and transportation test
GB/T15861—1995
Continued Table 2
Technical requirements
Note: "\ indicates the inspection items that should be carried out in this type of inspection towel. 7.2 Delivery inspection
7.2.1 The delivery inspection shall be carried out by the quality inspection department of the production unit. Test method number
Standardized inspection
Acceptance inspection
7.2.2 Each ion beam etching machine shall pass acceptance inspection before leaving the factory, and qualified products shall have a certificate of compliance. 7.2.3 Acceptance inspection items and sequence shall be as specified in Table 2. Routine inspection
7.2.4 If any item fails during the inspection, the inspection shall be stopped to find out the cause of the failure, and the acceptance inspection shall be carried out again after the failure is eliminated. If the failure occurs again during the re-inspection, the machine shall be judged as unqualified, but it is allowed to be repaired for the first time and then re-inspected. 7.3 Routine inspection
7.3.1 Routine inspection shall be carried out by the quality inspection department of the production unit. 7. 3.2 For formally produced ion beam etching machines, a routine inspection shall be carried out once every three years when the cumulative production exceeds 5 units. 7.3.3 Routine inspection items shall be as specified in Table 2. The samples for routine inspection shall be selected from the products that have passed the delivery inspection. The sampling quantity is one unit for every 5 units, and two units for every 10 units or more. 7.3.4.7.3.5 When there are unqualified items in routine inspection, the sampling shall be doubled and the unqualified items shall be re-inspected on the same day. If unqualified items still occur, the batch of products shall be judged as unqualified. 8 Marking, packaging, transportation, storage 8.1 Marking 8. 1. 1 The ion beam etching equipment should have product name, model, factory number, manufacturing unit, trademark and other signs. 8.1.2 The packaging box should have product name, receiving and shipping units, arrival station, departure station, total number of pieces and number and other signs. 8.1.3 According to the provisions of GB191, the signs of "handle with care", "afraid of moisture", "upward" and "fragile" should be marked on the obvious parts of the packaging box. 8.2 Packaging
8.2.1 The ion beam etching machine is packed in boxes according to the host, power cabinet, power supply components, ion source, accessories, etc. First use plastic packaging, then put it in the packaging box, and fix it firmly with hard foam in the box. Wooden packaging boxes should have protective measures. 8-2-2 The packaging box should have product certificate, instruction manual, packing list, spare parts, etc. 8.2.3 The semi-solid closed corners of the packaging box are fastened with cable ties to prevent cracking. 8.3 Transportation
The packaged products can adapt to the loading and transportation of various tools. During loading and transportation, fastening measures should be taken to prevent falling. 8.4 Storage
GB/T15861—1995
All packaging boxes of ion beam etching equipment should be stored together in a place that is protected from sunlight, rain, moisture and ventilation. Additional remarks:
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Research Institute of the Ministry of Electronics Industry. This standard was drafted by the Changsha Semiconductor Process Equipment Research Institute of the Ministry of Electronics Industry. The drafters of this standard are An Zhichao and Liao Wenchu.4 Busy Storage
GB/T15861—1995
All packaging boxes of ion beam etching equipment should be stored together in a place that is protected from sunlight, rain, moisture and ventilation. Additional Notes:
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Research Institute of the Ministry of Electronics Industry. This standard is drafted by the Changsha Semiconductor Process Equipment Research Institute of the Ministry of Electronics Industry. The drafters of this standard are An Zhichao and Liao Wenchu.
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