SJ 20683-1998 General specification for digital beam controller module of phased array radar T/R assembly
Some standard content:
Military Standard of Electronic Industry of the People's Republic of China FL5963
SJ20683-1998
General specification of digital beam controller module of T/R module for phased array radar Published on March 18, 1998
Implementation on May 1, 1998
Approved by the Ministry of Electronics Industry of the People's Republic of China 1 Scope
Referenced Documents
Quality Assurance Provisions
Delivery Preparation
6 Notes
Appendix A Test Simulation Load (Reference Part)
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Military Standard of Electronic Industry of the People's Republic of China General specification for digital beam controller module of T/R module for phased array radar1 scope
1.1 subject content
SJ206831998
This specification specifies the classification, requirements, quality assurance provisions, etc. of digital beam controller (hereinafter referred to as beam controller) modules used in phased array radar T/R components. 1.2 scope of application
This specification applies to beam controller modules using programmable logic devices. 1.3 classification
Bow controller modules are divided into 8, 12, 16, and 20 channels according to the number of driver output channels: divided into two-way conduction type (type A) and unidirectional conduction type (type B) according to the drive form: divided into ground and ship use (type I) and airborne use (type II) according to the use environment. 2 Referenced documents
GJB150.3---86 Environmental test methods for military equipment High temperature test GJB150.4—86 Environmental test methods for military equipment Low temperature test GJB179A—96 Counting sampling inspection procedures and tables GJB360A--96 Test methods for electronic and electrical components GJB89990 Reliability identification and acceptance test GJB1182—91 Protective packaging and packing levels GJB1765—93 Military material packaging marking
GJB2711-96 Military transport packaging test methods Issued by the Ministry of Electronics Industry of the People's Republic of China on March 18, 1999 and implemented on May 1, 1998
3 Requirements
3.1 Qualification identification
SJ 20683—1998
Products submitted in accordance with this specification shall be products that have passed the identification or have been approved for finalization. 3.2 Module composition and performance characteristics (see 4.7.3 to 4.7.6) The division of the wave controller module and its performance characteristics are shown in Table 1, and the module composition and principle block diagram are shown in Figure 1. Table 1
Number of driver output channels
Maximum drive current
Cut-off voltage
Building time us
Number of forwarding output channels
Forwarding output level
Forwarding delay ns
Power supply voltage
Number of input channels
Input level
Static power consumption W
MBC8A MBC8B|MBC12A|MBC12B|MBC16A|MBC16B MBC20A/MBC20B8
80 (output voltage not less than -4.2V)
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3.3 Module appearance and installation dimensions
SJ20683--1998
Driver output
(to phase shifter, T/R switch, attenuator, etc.) wave
Control logic
Self-wave control computer
Unless otherwise specified, the module appearance and installation dimensions are shown in Figure 2 and Table 2. 2
Forward output
(to other T/R components)
4 -Φ25
MBC12BMBCI6AMBC16BMBC20AMBC20BMBC8B
MBC12A
3.4 Reliability
SJ20683—1998
The mean time between failures (MTBF) of the wave controller module is specified by the product specification, but shall not be less than 100000h. 3.5 Environmental adaptability
3.5.1 Low temperature storage
The wave controller module shall be able to withstand the low temperature storage condition of -55°C. 3. 5. 2 Low temperature operation
Class I wave controller modules shall be able to work normally under the low temperature condition of -40°C: Class II wave controller modules shall be able to work normally under the low temperature condition of ~55°C: 3.5.3 Low temperature storage
The wave controller module shall be able to withstand the high temperature storage condition of 70°C. 3.5.4 High temperature operation
The wave controller module should be able to work normally under the condition of 85°C commercial temperature. 3.5.5 Temperature shock
The Class I wave controller module should be able to work normally under the temperature shock of -55°C to 85°C. 3.5.6 Low pressure
The Class II wave controller module should be able to work normally under the condition of 4.39kPa low pressure. 3.5.7 Damp heat
The wave controller module should be able to work normally after being subjected to the steady-state damp heat test at 40°C and 93% relative humidity. 3.5.8 Vibration
The Class I wave controller module should not have mechanical damage and can work normally after being subjected to the vibration test of 10~500Hz and acceleration of 100m/s2.
Class I wave controller modules should not be mechanically damaged and can work normally after being subjected to a vibration test of 10 to 2000 Hz and an acceleration of 100 m/s2.
3.5.9 Shock
The wave controller module should not be mechanically damaged and can work normally after being subjected to a half-sine wave shock test of an acceleration of 300 m/s2 and a pulse duration of 11 ms. 3.6 Interface and Interchangeability
3.6.1 The input/output connector adopts a CH87-2.54-50ZM printed circuit board connector. 3.6.2 The input command is TTL level, and the number of input channels is shown in Table 1. 3.6.3 Wave controller modules with the same model and logic function can be interchanged without adjustment: Modules with the same model but different logic functions can be interchanged after reprogramming. 3.7 Marking and Code
The module model and code should be marked on the module: -4-
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The module code is composed of the following;
SJ 20683—1998
Improvement serial number (expressed in human letters)
Use environment category (see 1.3)
One-way or two-way conduction type (see 1.3)
Number of driving paths
Wave controller module
Example: The number of driver output paths is 8, and the one-way conduction type use environment is airborne conditions. The first improved wave controller module is expressed as: MBC—08—B—I—1. 3.8 Appearance quality
3.8.1 The surface of the printed circuit board should be free of bubbles larger than 0.08mm, white spots, and delamination visible to the naked eye. 3.8.2 The appearance should be clean, free of stains and residual flux, and the characters and marks should be clear. 4 Quality Assurance Provisions
4. 1 Inspection Responsibility
Unless otherwise specified in the contract or order, the contractor shall be responsible for completing all inspections specified in this specification. If necessary, the ordering party or the superior appraisal agency has the right to inspect any inspection item described in this specification. 4.1.1 Qualification Responsibility
All products must meet all requirements of Chapter 3 and Chapter 5 of the specification. The inspections specified in this specification shall become an integral part of the contractor's entire inspection system or quality outline. If the contract includes inspection requirements not specified in this specification, the contractor shall also ensure that the products submitted for acceptance meet the contract requirements. Quality consistency sampling does not allow the submission of products that are known to be defective, nor can the ordering party be required to accept defective products. 4.2 Inspection Classification
The inspections specified in this specification are divided into:
a. Appraisal inspection;
b. Quality consistency inspection.
4.3 Inspection conditions
, unless otherwise specified, the inspection shall be carried out under the "standard atmospheric conditions for testing" specified in GJB360A: b. All test instruments and equipment shall be calibrated, and within the validity period of the calibration: their accuracy shall not be less than one-third of the allowable error of the measured parameters.
4,4 Identification inspection
Identification inspection is generally only carried out during design and production finalization, but when there are major changes in the main design, process, components and materials of the module that affect the main performance of the module, identification inspection should also be carried out. - 5 -
4.4.1 Inspection samples
SJ 20683-1998
The samples for identification inspection shall be the molds produced by the common equipment and technology in production. The number of samples shall be specified by the product specification, but shall not be less than two pieces. 4.4.2 Inspection items and sequence
The items for identification inspection are shown in Table 3. The inspection sequence shall be specified by the product specification. 4.4.3 Qualification criteria
When all inspection items meet the requirements of Chapter 3 and Chapter 5, the identification inspection is judged to be qualified: If any inspection item does not meet the specified requirements, the inspection shall be stopped. The contractor shall analyze the unqualified items, find out the causes of the defects and take corrective measures before continuing the inspection. If all inspection items meet the specified requirements, the identification inspection is judged to be qualified. If there is still an item that does not meet the specified requirements after continuing the inspection, it is judged to be unqualified.
4.4.4 Maintaining the qualification of identification
To maintain the qualification of identification inspection, the contractor shall provide product test data regularly according to the requirements of the ordering party or the identification agency. The submission frequency shall be specified by the product specification. 4.5 Quality consistency inspection
4.5.1 Inspection grouping
Quality consistency inspection is divided into three groups: A, C and D. 4. 5. 2 Group A inspection
4. 5.2. 1 Inspection items
The inspection items of Group A inspection are shown in Table 3.
4.5.2.2 Qualification judgment
Group A inspection adopts piece-by-piece inspection. If there is one unqualified item in each inspection item, it is unqualified.
Unqualified products can be repaired to correct their defects and resubmitted for re-inspection. -6-
TKANKAca
Project name
Logo and appearance quality
Appearance and installation dimensions
Maximum driving current
Cut-off voltage
Building time
Forwarding delay
Static power consumption
Temperature shock
Low pressure
Reliability
Interface and interchangeability
SJ20683--1998
Required
Chapter number
3.7, 3.8
3.5.1,3.5.2
3.5.3,3.5.4
5.1,5.2.1
Inspection and test
Method code
Note: "O" in the table indicates mandatory items, and "△" indicates inspection items determined according to needs. 4.5.3 Group C inspection
4.5.3.1 Inspection cycle
Group C inspection should be carried out in the following circumstances:
a: Once a year for mass production;
b. When there are major modifications to components, materials or processes that affect their performance; c. When there are clear requirements in the purchase contract.
Conformance inspection
4.5.3.2 Sampling
SJ 206B3—1998
Samples for Group C inspection shall be randomly selected from products that have passed Group A inspection. Unless otherwise specified, sampling shall be based on the special inspection level S-2 of GJB179A for normal inspection. The AQL value shall be specified by the product specification. 4.5.3.3 Inspection items and sequence
Group C inspection items are shown in Table 3. The inspection sequence shall be specified by the product specification. 4.5.3.4 Qualification criteria
According to the inspection results, if the number of defects is not greater than the specified value, the Group C inspection is judged to be qualified, otherwise, the Group C inspection is judged to be unqualified.
4. 5. 4 Group D inspection
4.5.4.1 Inspection cycle
Group D inspection shall be carried out when specified in the purchase contract. 4.5.4.2 Sampling
The sampling plan shall be determined in accordance with the relevant provisions of the contract. 4.5.4.3 Inspection items
Inspection items of Group D and see Table 3.
4.5.4.4 Qualification criteria
Qualification criteria shall be determined in accordance with the test plan and relevant provisions of the contract. 4.5.5 Unqualified
If the sample fails the inspection of Group C or Group D, the acceptance and delivery of the product shall be stopped. The contractor shall notify the qualified appraisal unit of the unqualified situation. After taking corrective measures, all tests shall be repeated according to the opinions of the qualified appraisal unit, or only the unqualified items shall be inspected. If the test is still unqualified, the unqualified situation shall be notified to the qualified appraisal unit.
4.6 Packaging inspection
4.6.1 Each package shall be inspected for packaging, packing and packaging marks in accordance with 4.7.15.1. Inspect each package and make judgments on each package.
4.6.2 During packaging appraisal or when there are major improvements in packaging structure and materials, a box (box) of modules should be selected and subjected to packaging drop test according to 4.7.15.2.
4.7 Inspection method
4.7.1 Marking and appearance quality
Visual inspection of marking and appearance quality, if necessary, can be used to check the bubbles in the printed board with a measuring microscope. 4.7.2 Appearance and installation dimensions
Use measuring tools to inspect the appearance and installation dimensions.
4.7.3 Maximum drive current
KANKAca
SJ20683-1998
Use the design review method to check the input circuit voltage and the forward output circuit voltage. 4.7.3.1 Test system diagram
See Figure 3 for the test system diagram.
Interface card
4.7.3.2 Test equipment and requirements
Module under test
a. PC: simulate radar beam control computer instructions; power supply
b. Interface card: special test interface card, generate beam controller control signal according to microcomputer output instructions: c. Switch S: the number of ways is not less than the number of drive output ways of the module under test: d. Power supply: voltage should comply with the provisions of Table 1, load stability and voltage stability should be better than 1x102, ripple should not be less than 80mV:
Current meter: digital current meter, accuracy should not be less than 0.5 level: e.
f. Load: simulated load for test, see Appendix A (reference). 4.7.3.3 Test steps
Connect as shown in Figure 3, and connect the switch to each drive output terminal of the module under test: a.
b. The PC generates the timing required for module testing, bypassing the interface card and adding it to the module under test; turn the switch to measure the current of each drive output. c.
4.7.4 Setup time and cutoff voltage
4.7.4.1 Test system diagram
The test system diagram is shown in Figure 4.
Interface card
Module under test
Dual-trace oscilloscope
4.7.4.2 Test equipment and its requirements
a. PC: See 4.7.3.2a:
b. Interface card: see 4.7.3.2b;
C. Switch S: see 4.7.3.2c:
d. Power supply: see 4.7.3.2d;
SJ 20683—1998
Dual-trace oscilloscope: bandwidth not less than 100MHz;e.
f. Load: see 4.7.3.2f
4.7. 4. 3 Tidal test steps
Connect as shown in Figure 4, and connect the conversion switch to each drive output terminal of the module under test. a.
The PC generates the timing required for module testing and adds it to the module under test through the interface card: b.
Adjust the dual-trace oscilloscope to measure the rise delay and fall delay of the drive output relative to the input (see Figure 5), and take the larger of 1, and (, as the setup time test value: d. For unidirectional conduction modules, read the cut-off voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the rise delay and fall delay of each drive output relative to the input (see Figure 5). 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
See Figure 4 for the test system diagram.
4.7.5.2 Test equipment and its requirements
See 4.7.4.2 for the test equipment and its requirements.
4.7.5.3 Test steps
Connect the switch to each forwarding output terminal of the module under test. The remaining test steps are the same as those in 4.7.4.3. See Figure 6 for the waveform on the oscilloscope. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAca3 Qualification criteria
When all inspection items meet the requirements of Chapter 3 and Chapter 5, the identification inspection is considered qualified: If any inspection item does not meet the specified requirements, the inspection should be stopped. The contractor should analyze the unqualified items, find out the causes of the defects and take corrective measures before continuing the inspection. If all inspection items meet the specified requirements, the identification inspection is considered qualified. If there is still an item that does not meet the specified requirements after continuing the inspection, it is considered unqualified.
4.4.4 Maintaining the qualification for identification inspection
To maintain the qualification for identification inspection, the contractor should regularly provide product test data according to the requirements of the ordering party or the identification agency. The submission frequency is specified by the product specifications. 4.5 Quality consistency inspection
4.5.1 Inspection grouping
Quality consistency inspection is divided into three groups: A, C, and D. 4.5.2 Group A Inspection
4.5.2.1 Inspection Items
The inspection items for Group A inspection are shown in Table 3.
4.5.2.2 Qualification Criteria
Group A inspection adopts piece-by-piece inspection. If there is one unqualified item in each inspection item, it is considered unqualified.
Unqualified products can be returned for repair to correct their defects and resubmitted for re-inspection. -6-
TKANKAca
Project name
Logo and appearance quality
Appearance and installation dimensions
Maximum driving current
Cut-off voltage
Building time
Forwarding delay
Static power consumption
Temperature shock
Low pressure
Reliability
Interface and interchangeability
SJ20683--1998
Required
Chapter number
3.7, 3.8
3.5.1,3.5.2
3.5.3,3.5.4
5.1,5.2.1
Inspection and test
Method code
Note: "O" in the table indicates mandatory items, and "△" indicates inspection items determined according to needs. 4.5.3 Group C inspection
4.5.3.1 Inspection cycle
Group C inspection should be carried out in the following circumstances:
a: Once a year for mass production;
b. When there are major modifications to components, materials or processes that affect their performance; c. When there are clear requirements in the purchase contract.
Conformance inspectionwwW.bzxz.Net
4.5.3.2 Sampling
SJ 206B3—1998
Samples for Group C inspection shall be randomly selected from products that have passed Group A inspection. Unless otherwise specified, sampling shall be based on the special inspection level S-2 of GJB179A for normal inspection. The AQL value shall be specified by the product specification. 4.5.3.3 Inspection items and sequence
Group C inspection items are shown in Table 3. The inspection sequence shall be specified by the product specification. 4.5.3.4 Qualification criteria
According to the inspection results, if the number of defects is not greater than the specified value, the Group C inspection is judged to be qualified, otherwise, the Group C inspection is judged to be unqualified.
4. 5. 4 Group D inspection
4.5.4.1 Inspection cycle
Group D inspection shall be carried out when specified in the purchase contract. 4.5.4.2 Sampling
The sampling plan shall be determined in accordance with the relevant provisions of the contract. 4.5.4.3 Inspection items
Inspection items of Group D and see Table 3.
4.5.4.4 Qualification criteria
Qualification criteria shall be determined in accordance with the test plan and relevant provisions of the contract. 4.5.5 Unqualified
If the sample fails the inspection of Group C or Group D, the acceptance and delivery of the product shall be stopped. The contractor shall notify the qualified appraisal unit of the unqualified situation. After taking corrective measures, all tests shall be repeated according to the opinions of the qualified appraisal unit, or only the unqualified items shall be inspected. If the test is still unqualified, the unqualified situation shall be notified to the qualified appraisal unit.
4.6 Packaging inspection
4.6.1 Each package shall be inspected for packaging, packing and packaging marks in accordance with 4.7.15.1. Inspect each package and make judgments on each package.
4.6.2 During packaging appraisal or when there are major improvements in packaging structure and materials, a box (box) of modules should be selected and subjected to packaging drop test according to 4.7.15.2.
4.7 Inspection method
4.7.1 Marking and appearance quality
Visual inspection of marking and appearance quality, if necessary, can be used to check the bubbles in the printed board with a measuring microscope. 4.7.2 Appearance and installation dimensions
Use measuring tools to inspect the appearance and installation dimensions.
4.7.3 Maximum drive current
KANKAca
SJ20683-1998
Use the design review method to check the input circuit voltage and the forward output circuit voltage. 4.7.3.1 Test system diagram
See Figure 3 for the test system diagram.
Interface card
4.7.3.2 Test equipment and requirements
Module under test
a. PC: simulate radar beam control computer instructions; power supply
b. Interface card: special test interface card, generate beam controller control signal according to microcomputer output instructions: c. Switch S: the number of ways is not less than the number of drive output ways of the module under test: d. Power supply: voltage should comply with the provisions of Table 1, load stability and voltage stability should be better than 1x102, ripple should not be less than 80mV:
Current meter: digital current meter, accuracy should not be less than 0.5 level: e.
f. Load: simulated load for test, see Appendix A (reference). 4.7.3.3 Test steps
Connect as shown in Figure 3, and connect the switch to each drive output terminal of the module under test: a.
b. The PC generates the timing required for module testing, bypassing the interface card and adding it to the module under test; turn the switch to measure the current of each drive output. c.
4.7.4 Setup time and cutoff voltage
4.7.4.1 Test system diagram
The test system diagram is shown in Figure 4.
Interface card
Module under test
Dual-trace oscilloscope
4.7.4.2 Test equipment and its requirements
a. PC: See 4.7.3.2a:
b. Interface card: see 4.7.3.2b;
C. Switch S: see 4.7.3.2c:
d. Power supply: see 4.7.3.2d;
SJ 20683—1998
Dual-trace oscilloscope: bandwidth not less than 100MHz;e.
f. Load: see 4.7.3.2f
4.7. 4. 3 Tidal test steps
Connect as shown in Figure 4, and connect the conversion switch to each drive output terminal of the module under test. a.
The PC generates the timing required for module testing and adds it to the module under test through the interface card: b.
Adjust the dual-trace oscilloscope to measure the rise delay and fall delay of the drive output relative to the input (see Figure 5), and take the larger of 1, and (, as the setup time test value: d. For unidirectional conduction modules, read the cut-off voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the rise delay and fall delay of each drive output relative to the input (see Figure 5). 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
See Figure 4 for the test system diagram.
4.7.5.2 Test equipment and its requirements
See 4.7.4.2 for the test equipment and its requirements.
4.7.5.3 Test steps
Connect the switch to each forwarding output terminal of the module under test. The remaining test steps are the same as those in 4.7.4.3. See Figure 6 for the waveform on the oscilloscope. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAca3 Qualification criteria
When all inspection items meet the requirements of Chapter 3 and Chapter 5, the identification inspection is considered qualified: If any inspection item does not meet the specified requirements, the inspection should be stopped. The contractor should analyze the unqualified items, find out the causes of the defects and take corrective measures before continuing the inspection. If all inspection items meet the specified requirements, the identification inspection is considered qualified. If there is still an item that does not meet the specified requirements after continuing the inspection, it is considered unqualified.
4.4.4 Maintaining the qualification for identification inspection
To maintain the qualification for identification inspection, the contractor should regularly provide product test data according to the requirements of the ordering party or the identification agency. The submission frequency is specified by the product specifications. 4.5 Quality consistency inspection
4.5.1 Inspection grouping
Quality consistency inspection is divided into three groups: A, C, and D. 4.5.2 Group A Inspection
4.5.2.1 Inspection Items
The inspection items for Group A inspection are shown in Table 3.
4.5.2.2 Qualification Criteria
Group A inspection adopts piece-by-piece inspection. If there is one unqualified item in each inspection item, it is considered unqualified.
Unqualified products can be returned for repair to correct their defects and resubmitted for re-inspection. -6-
TKANKAca
Project name
Logo and appearance quality
Appearance and installation dimensions
Maximum driving current
Cut-off voltage
Building time
Forwarding delay
Static power consumption
Temperature shock
Low pressure
Reliability
Interface and interchangeability
SJ20683--1998
Required
Chapter number
3.7, 3.8
3.5.1,3.5.2
3.5.3,3.5.4
5.1,5.2.1
Inspection and test
Method code
Note: "O" in the table indicates mandatory items, and "△" indicates inspection items determined according to needs. 4.5.3 Group C inspection
4.5.3.1 Inspection cycle
Group C inspection should be carried out in the following circumstances:
a: Once a year for mass production;
b. When there are major modifications to components, materials or processes that affect their performance; c. When there are clear requirements in the purchase contract.
Conformance inspection
4.5.3.2 Sampling
SJ 206B3—1998
Samples for Group C inspection shall be randomly selected from products that have passed Group A inspection. Unless otherwise specified, sampling shall be based on the special inspection level S-2 of GJB179A for normal inspection. The AQL value shall be specified by the product specification. 4.5.3.3 Inspection items and sequence
Group C inspection items are shown in Table 3. The inspection sequence shall be specified by the product specification. 4.5.3.4 Qualification criteria
According to the inspection results, if the number of defects is not greater than the specified value, the Group C inspection is judged to be qualified, otherwise, the Group C inspection is judged to be unqualified.
4. 5. 4 Group D inspection
4.5.4.1 Inspection cycle
Group D inspection shall be carried out when specified in the purchase contract. 4.5.4.2 Sampling
The sampling plan shall be determined in accordance with the relevant provisions of the contract. 4.5.4.3 Inspection items
Inspection items of Group D and see Table 3.
4.5.4.4 Qualification criteria
Qualification criteria shall be determined in accordance with the test plan and relevant provisions of the contract. 4.5.5 Unqualified
If the sample fails the inspection of Group C or Group D, the acceptance and delivery of the product shall be stopped. The contractor shall notify the qualified appraisal unit of the unqualified situation. After taking corrective measures, all tests shall be repeated according to the opinions of the qualified appraisal unit, or only the unqualified items shall be inspected. If the test is still unqualified, the unqualified situation shall be notified to the qualified appraisal unit.
4.6 Packaging inspection
4.6.1 Each package shall be inspected for packaging, packing and packaging marks in accordance with 4.7.15.1. Inspect each package and make judgments on each package.
4.6.2 During packaging appraisal or when there are major improvements in packaging structure and materials, a box (box) of modules should be selected and subjected to packaging drop test according to 4.7.15.2.
4.7 Inspection method
4.7.1 Marking and appearance quality
Visual inspection of marking and appearance quality, if necessary, can be used to check the bubbles in the printed board with a measuring microscope. 4.7.2 Appearance and installation dimensions
Use measuring tools to inspect the appearance and installation dimensions.
4.7.3 Maximum drive current
KANKAca
SJ20683-1998
Use the design review method to check the input circuit voltage and the forward output circuit voltage. 4.7.3.1 Test system diagram
See Figure 3 for the test system diagram.
Interface card
4.7.3.2 Test equipment and requirements
Module under test
a. PC: simulate radar beam control computer instructions; power supply
b. Interface card: special test interface card, generate beam controller control signal according to microcomputer output instructions: c. Switch S: the number of ways is not less than the number of drive output ways of the module under test: d. Power supply: voltage should comply with the provisions of Table 1, load stability and voltage stability should be better than 1x102, ripple should not be less than 80mV:
Current meter: digital current meter, accuracy should not be less than 0.5 level: e.
f. Load: simulated load for test, see Appendix A (reference). 4.7.3.3 Test steps
Connect as shown in Figure 3, and connect the switch to each drive output terminal of the module under test: a.
b. The PC generates the timing required for module testing, bypassing the interface card and adding it to the module under test; turn the switch to measure the current of each drive output. c.
4.7.4 Setup time and cutoff voltage
4.7.4.1 Test system diagram
The test system diagram is shown in Figure 4.
Interface card
Module under test
Dual-trace oscilloscope
4.7.4.2 Test equipment and its requirements
a. PC: See 4.7.3.2a:
b. Interface card: see 4.7.3.2b;
C. Switch S: see 4.7.3.2c:
d. Power supply: see 4.7.3.2d;
SJ 20683—1998
Dual-trace oscilloscope: bandwidth not less than 100MHz;e.
f. Load: see 4.7.3.2f
4.7. 4. 3 Tidal test steps
Connect as shown in Figure 4, and connect the conversion switch to each drive output terminal of the module under test. a.
The PC generates the timing required for module testing and adds it to the module under test through the interface card: b.
Adjust the dual-trace oscilloscope to measure the rise delay and fall delay of the drive output relative to the input (see Figure 5), and take the larger of 1, and (, as the setup time test value: d. For unidirectional conduction modules, read the cut-off voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the rise delay and fall delay of each drive output relative to the input (see Figure 5). 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
See Figure 4 for the test system diagram.
4.7.5.2 Test equipment and its requirements
See 4.7.4.2 for the test equipment and its requirements.
4.7.5.3 Test steps
Connect the switch to each forwarding output terminal of the module under test. The remaining test steps are the same as those in 4.7.4.3. See Figure 6 for the waveform on the oscilloscope. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAca2 Qualification criteria
Group A inspection adopts piece-by-piece inspection. If there is one unqualified item in each inspection item, it is unqualified.
Unqualified products can be repaired to correct their defects and resubmitted for re-inspection. -6-
TKANKAca
Item name
Marking and appearance quality
Appearance and installation dimensions
Maximum driving current
Cut-off voltage
Building time
Forwarding delay
Static power consumption
Temperature shock
Low pressure
Reliability
Interface and interchangeability
SJ20683--1998
Required
Chapter number
3.7, 3.8
3.5.1,3.5.2
3.5.3,3.5.4
5.1,5.2.1
Inspection and test
Method code
Note: "O" in the table indicates mandatory items, and "△" indicates inspection items determined according to needs. 4.5.3 Group C inspection
4.5.3.1 Inspection cycle
Group C inspection should be carried out in the following circumstances:
a: Once a year for mass production;
b. When there are major modifications to components, materials or processes that affect their performance; c. When there are clear requirements in the purchase contract.
Conformance inspection
4.5.3.2 Sampling
SJ 206B3—1998
Samples for Group C inspection shall be randomly selected from products that have passed Group A inspection. Unless otherwise specified, sampling shall be based on the special inspection level S-2 of GJB179A for normal inspection. The AQL value shall be specified by the product specification. 4.5.3.3 Inspection items and sequence
Group C inspection items are shown in Table 3. The inspection sequence shall be specified by the product specification. 4.5.3.4 Qualification criteria
According to the inspection results, if the number of defects is not greater than the specified value, the Group C inspection is judged to be qualified, otherwise, the Group C inspection is judged to be unqualified.
4. 5. 4 Group D inspection
4.5.4.1 Inspection cycle
Group D inspection shall be carried out when specified in the purchase contract. 4.5.4.2 Sampling
The sampling plan shall be determined in accordance with the relevant provisions of the contract. 4.5.4.3 Inspection items
Inspection items of Group D and see Table 3.
4.5.4.4 Qualification criteria
Qualification criteria shall be determined in accordance with the test plan and relevant provisions of the contract. 4.5.5 Unqualified
If the sample fails the inspection of Group C or Group D, the acceptance and delivery of the product shall be stopped. The contractor shall notify the qualified appraisal unit of the unqualified situation. After taking corrective measures, all tests shall be repeated according to the opinions of the qualified appraisal unit, or only the unqualified items shall be inspected. If the test is still unqualified, the unqualified situation shall be notified to the qualified appraisal unit.
4.6 Packaging inspection
4.6.1 Each package shall be inspected for packaging, packing and packaging marks in accordance with 4.7.15.1. Inspect each package and make judgments on each package.
4.6.2 During packaging appraisal or when there are major improvements in packaging structure and materials, a box (box) of modules should be selected and subjected to packaging drop test according to 4.7.15.2.
4.7 Inspection method
4.7.1 Marking and appearance quality
Visual inspection of marking and appearance quality, if necessary, can be used to check the bubbles in the printed board with a measuring microscope. 4.7.2 Appearance and installation dimensions
Use measuring tools to inspect the appearance and installation dimensions.
4.7.3 Maximum drive current
KANKAca
SJ20683-1998
Use the design review method to check the input circuit voltage and the forward output circuit voltage. 4.7.3.1 Test system diagram
See Figure 3 for the test system diagram.
Interface card
4.7.3.2 Test equipment and requirements
Module under test
a. PC: simulate radar beam control computer instructions; power supply
b. Interface card: special test interface card, generate beam controller control signal according to microcomputer output instructions: c. Switch S: the number of ways is not less than the number of drive output ways of the module under test: d. Power supply: voltage should comply with the provisions of Table 1, load stability and voltage stability should be better than 1x102, ripple should not be less than 80mV:
Current meter: digital current meter, accuracy should not be less than 0.5 level: e.
f. Load: simulated load for test, see Appendix A (reference). 4.7.3.3 Test steps
Connect as shown in Figure 3, and connect the switch to each drive output terminal of the module under test: a.
b. The PC generates the timing required for module testing, bypassing the interface card and adding it to the module under test; turn the switch to measure the current of each drive output. c.
4.7.4 Setup time and cutoff voltage
4.7.4.1 Test system diagram
The test system diagram is shown in Figure 4.
Interface card
Module under test
Dual-trace oscilloscope
4.7.4.2 Test equipment and its requirements
a. PC: See 4.7.3.2a:
b. Interface card: see 4.7.3.2b;
C. Switch S: see 4.7.3.2c:
d. Power supply: see 4.7.3.2d;
SJ 20683—1998
Dual-trace oscilloscope: bandwidth not less than 100MHz;e.
f. Load: see 4.7.3.2f
4.7. 4. 3 Tidal test steps
Connect as shown in Figure 4, and connect the conversion switch to each drive output terminal of the module under test. a.
The PC generates the timing required for module testing and adds it to the module under test through the interface card: b.
Adjust the dual-trace oscilloscope to measure the rise delay and fall delay of the drive output relative to the input (see Figure 5), and take the larger of 1, and (, as the setup time test value: d. For unidirectional conduction modules, read the cut-off voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the rise delay and fall delay of each drive output relative to the input (see Figure 5). 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
See Figure 4 for the test system diagram.
4.7.5.2 Test equipment and its requirements
See 4.7.4.2 for the test equipment and its requirements.
4.7.5.3 Test steps
Connect the switch to each forwarding output terminal of the module under test. The remaining test steps are the same as those in 4.7.4.3. See Figure 6 for the waveform on the oscilloscope. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAca2 Qualification criteria
Group A inspection adopts piece-by-piece inspection. If there is one unqualified item in each inspection item, it is unqualified.
Unqualified products can be repaired to correct their defects and resubmitted for re-inspection. -6-
TKANKAca
Item name
Marking and appearance quality
Appearance and installation dimensions
Maximum driving current
Cut-off voltage
Building time
Forwarding delay
Static power consumption
Temperature shock
Low pressure
Reliability
Interface and interchangeability
SJ20683--1998
Required
Chapter number
3.7, 3.8
3.5.1,3.5.2
3.5.3,3.5.4
5.1,5.2.1
Inspection and test
Method code
Note: "O" in the table indicates mandatory items, and "△" indicates inspection items determined according to needs. 4.5.3 Group C inspection
4.5.3.1 Inspection cycle
Group C inspection should be carried out in the following circumstances:
a: Once a year for mass production;
b. When there are major modifications to components, materials or processes that affect their performance; c. When there are clear requirements in the purchase contract.
Conformance inspection
4.5.3.2 Sampling
SJ 206B3—1998
Samples for Group C inspection shall be randomly selected from products that have passed Group A inspection. Unless otherwise specified, sampling shall be based on the special inspection level S-2 of GJB179A for normal inspection. The AQL value shall be specified by the product specification. 4.5.3.3 Inspection items and sequence
Group C inspection items are shown in Table 3. The inspection sequence shall be specified by the product specification. 4.5.3.4 Qualification criteria
According to the inspection results, if the number of defects is not greater than the specified value, the Group C inspection is judged to be qualified, otherwise, the Group C inspection is judged to be unqualified.
4. 5. 4 Group D inspection
4.5.4.1 Inspection cycle
Group D inspection shall be carried out when specified in the purchase contract. 4.5.4.2 Sampling
The sampling plan shall be determined in accordance with the relevant provisions of the contract. 4.5.4.3 Inspection items
Inspection items of Group D and see Table 3.
4.5.4.4 Qualification criteria
Qualification criteria shall be determined in accordance with the test plan and relevant provisions of the contract. 4.5.5 Unqualified
If the sample fails the inspection of Group C or Group D, the acceptance and delivery of the product shall be stopped. The contractor shall notify the qualified appraisal unit of the unqualified situation. After taking corrective measures, all tests shall be repeated according to the opinions of the qualified appraisal unit, or only the unqualified items shall be inspected. If the test is still unqualified, the unqualified situation shall be notified to the qualified appraisal unit.
4.6 Packaging inspection
4.6.1 Each package shall be inspected for packaging, packing and packaging marks in accordance with 4.7.15.1. Inspect each package and make judgments on each package.
4.6.2 During packaging appraisal or when there are major improvements in packaging structure and materials, a box (box) of modules should be selected and subjected to packaging drop test according to 4.7.15.2.
4.7 Inspection method
4.7.1 Marking and appearance quality
Visual inspection of marking and appearance quality, if necessary, can be used to check the bubbles in the printed board with a measuring microscope. 4.7.2 Appearance and installation dimensions
Use measuring tools to inspect the appearance and installation dimensions.
4.7.3 Maximum drive current
KANKAca
SJ20683-1998
Use the design review method to check the input circuit voltage and the forward output circuit voltage. 4.7.3.1 Test system diagram
See Figure 3 for the test system diagram.
Interface card
4.7.3.2 Test equipment and requirements
Module under test
a. PC: simulate radar beam control computer instructions; power supply
b. Interface card: special test interface card, generate beam controller control signal according to microcomputer output instructions: c. Switch S: the number of ways is not less than the number of drive output ways of the module under test: d. Power supply: voltage should comply with the provisions of Table 1, load stability and voltage stability should be better than 1x102, ripple should not be less than 80mV:
Current meter: digital current meter, accuracy should not be less than 0.5 level: e.
f. Load: simulated load for test, see Appendix A (reference). 4.7.3.3 Test steps
Connect as shown in Figure 3, and connect the switch to each drive output terminal of the module under test: a.
b. The PC generates the timing required for module testing, bypassing the interface card and adding it to the module under test; turn the switch to measure the current of each drive output. c.
4.7.4 Setup time and cutoff voltage
4.7.4.1 Test system diagram
The test system diagram is shown in Figure 4.
Interface card
Module under test
Dual-trace oscilloscope
4.7.4.2 Test equipment and its requirements
a. PC: See 4.7.3.2a:
b. Interface card: see 4.7.3.2b;
C. Switch S: see 4.7.3.2c:
d. Power supply: see 4.7.3.2d;
SJ 20683—1998
Dual-trace oscilloscope: bandwidth not less than 100MHz;e.
f. Load: see 4.7.3.2f
4.7. 4. 3 Tidal test steps
Connect as shown in Figure 4, and connect the conversion switch to each drive output terminal of the module under test. a.
The PC generates the timing required for module testing and adds it to the module under test through the interface card: b.
Adjust the dual-trace oscilloscope to measure the rise delay and fall delay of the drive output relative to the input (see Figure 5), and take the larger of 1, and (, as the setup time test value: d. For unidirectional conduction modules, read the cut-off voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the rise delay and fall delay of each drive output relative to the input (see Figure 5). 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
See Figure 4 for the test system diagram.
4.7.5.2 Test equipment and its requirements
See 4.7.4.2 for the test equipment and its requirements.
4.7.5.3 Test steps
Connect the switch to each forwarding output terminal of the module under test. The remaining test steps are the same as those in 4.7.4.3. See Figure 6 for the waveform on the oscilloscope. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAca4D Group Inspection
4.5.4.1 Inspection Cycle
D Group Inspection is to be conducted when specified in the purchase contract. 4.5.4.2 Sampling
The sampling plan shall be determined in accordance with the relevant provisions of the contract. 4.5.4.3 Inspection Items
D Group Inspection Items and see Table 3.
4.5.4.4 Acceptance Criteria
The acceptance criteria shall be determined in accordance with the test plan and relevant contractual provisions. 4.5.5 Failure
If the sample fails to pass the C or D Group Inspection, the acceptance and delivery of the product shall be stopped. The Contractor shall notify the Qualification Assessment Unit of the failure. After taking corrective measures, all tests shall be repeated or only the failed items shall be inspected according to the opinions of the Qualification Assessment Unit. If the test is still unqualified, the failure shall be notified to the Qualification Assessment Unit.
4.6 Packaging Inspection
4.6.1 Each package shall be inspected for packaging, packing and packaging marks according to 4.7.15.1. Inspect and judge each package piece by piece.
4.6.2 During packaging appraisal or when there is a major improvement in packaging structure or materials, a box (box) of modules shall be selected and subjected to a packaging drop test according to 4.7.15.2.
4.7 Inspection Methods
4.7.1 Marking and Appearance Quality
Inspect the marking and appearance quality by visual inspection. If necessary, use a measuring microscope to inspect the bubbles in the printed board. 4.7.2 Appearance and Installation Dimensions
Use measuring tools to inspect the appearance and installation dimensions.
4.7.3 Maximum drive current
KANKAca
SJ20683-1998
Use the design review method to check the input path and forwarding output path circuit voltage. 4.7.3.1 Test system diagram
The test system diagram is shown in Figure 3.
Interface card
4.7.3.2 Test equipment and its requirements
Tested module
a. PC: simulate radar beam control computer instructions; power supply
b. Interface card: special test interface card, according to the microcomputer output instructions, generate beam controller control signal: c. Switch S: the number of channels is not less than the number of drive output channels of the module under test: d. Power supply: the voltage should meet the requirements of Table 1, the load stability and voltage stability are better than 1x102, and the ripple is not more than 80mV:
Ammeter: digital ammeter, the accuracy is not less than 0.5 level: e.
f. Load: simulated load for testing, see Appendix A (reference). 4.7.3.3 Test steps
Connect according to Figure 3, and connect the switch to each drive output terminal of the module under test: a.
b. The PC generates the timing required for module testing, bypassing the interface card and adding it to the module under test; turn the switch to measure the current of each drive output. c.
4.7.4 Setup time and cut-off voltage
4.7.4.1 Test system diagram
The test system diagram is shown in Figure 4.
Interface card
Module under test
Dual-trace oscilloscope
4.7.4.2 Test equipment and its requirements
a. PC: See 4.7.3.2a:
b. Interface card: see 4.7.3.2b;
C. Switch S: see 4.7.3.2c:
d. Power supply: see 4.7.3.2d;
SJ 20683—1998
Dual-trace oscilloscope: bandwidth not less than 100MHz;e.
f. Load: see 4.7.3.2f
4.7. 4. 3 Tidal test steps
Connect as shown in Figure 4, and connect the conversion switch to each drive output terminal of the module under test. a.
The PC generates the timing required for module testing and adds it to the module under test through the interface card: b.
Adjust the dual-trace oscilloscope to measure the rise delay and fall delay of the drive output relative to the input (see Figure 5), and take the larger of 1, and (, as the setup time test value: d. For unidirectional conduction modules, read the cut-off voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the rise delay and fall delay of each drive output relative to the input (see Figure 5). 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
See Figure 4 for the test system diagram.
4.7.5.2 Test equipment and its requirements
See 4.7.4.2 for the test equipment and its requirements.
4.7.5.3 Test steps
Connect the switch to each forwarding output terminal of the module under test. The remaining test steps are the same as those in 4.7.4.3. See Figure 6 for the waveform on the oscilloscope. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAca4D Group Inspection
4.5.4.1 Inspection Cycle
D Group Inspection is to be conducted when specified in the purchase contract. 4.5.4.2 Sampling
The sampling plan shall be determined in accordance with the relevant provisions of the contract. 4.5.4.3 Inspection Items
D Group Inspection Items and see Table 3.
4.5.4.4 Acceptance Criteria
The acceptance criteria shall be determined in accordance with the test plan and relevant contractual provisions. 4.5.5 Failure
If the sample fails to pass the C or D Group Inspection, the acceptance and delivery of the product shall be stopped. The Contractor shall notify the Qualification Assessment Unit of the failure. After taking corrective measures, all tests shall be repeated or only the failed items shall be inspected according to the opinions of the Qualification Assessment Unit. If the test is still unqualified, the failure shall be notified to the Qualification Assessment Unit.
4.6 Packaging Inspection
4.6.1 Each package shall be inspected for packaging, packing and packaging marks according to 4.7.15.1. Inspect and judge each package piece by piece.
4.6.2 During packaging appraisal or when there is a major improvement in packaging structure or materials, a box (box) of modules shall be selected and subjected to a packaging drop test according to 4.7.15.2.
4.7 Inspection Methods
4.7.1 Marking and Appearance Quality
Inspect the marking and appearance quality by visual inspection. If necessary, use a measuring microscope to inspect the bubbles in the printed board. 4.7.2 Appearance and Installation Dimensions
Use measuring tools to inspect the appearance and installation dimensions.
4.7.3 Maximum drive current
KANKAca
SJ20683-1998
Use the design review method to check the input path and forwarding output path circuit voltage. 4.7.3.1 Test system diagram
The test system diagram is shown in Figure 3.
Interface card
4.7.3.2 Test equipment and its requirements
Tested module
a. PC: simulate radar beam control computer instructions; power supply
b. Interface card: special test interface card, according to the microcomputer output instructions, generate beam controller control signal: c. Switch S: the number of channels is not less than the number of drive output channels of the module under test: d. Power supply: the voltage should meet the requirements of Table 1, the load stability and voltage stability are better than 1x102, and the ripple is not more than 80mV:
Ammeter: digital ammeter, the accuracy is not less than 0.5 level: e.
f. Load: simulated load for testing, see Appendix A (reference). 4.7.3.3 Test steps
Connect according to Figure 3, and connect the switch to each drive output terminal of the module under test: a.
b. The PC generates the timing required for module testing, bypassing the interface card and adding it to the module under test; turn the switch to measure the current of each drive output. c.
4.7.4 Setup time and cut-off voltage
4.7.4.1 Test system diagram
The test system diagram is shown in Figure 4.
Interface card
Module under test
Dual-trace oscilloscope
4.7.4.2 Test equipment and its requirements
a. PC: See 4.7.3.2a:
b. Interface card: see 4.7.3.2b;
C. Switch S: see 4.7.3.2c:
d. Power supply: see 4.7.3.2d;
SJ 20683—1998
Dual-trace oscilloscope: bandwidth not less than 100MHz;e.
f. Load: see 4.7.3.2f
4.7. 4. 3 Tidal test steps
Connect as shown in Figure 4, and connect the conversion switch to each drive output terminal of the module under test. a.
The PC generates the timing required for module testing and adds it to the module under test through the interface card: b.
Adjust the dual-trace oscilloscope to measure the rise delay and fall delay of the drive output relative to the input (see Figure 5), and take the larger of 1, and (, as the setup time test value: d. For unidirectional conduction modules, read the cut-off voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the rise delay and fall delay of each drive output relative to the input (see Figure 5). 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
See Figure 4 for the test system diagram.
4.7.5.2 Test equipment and its requirements
See 4.7.4.2 for the test equipment and its requirements.
4.7.5.3 Test steps
Connect the switch to each forwarding output terminal of the module under test. The remaining test steps are the same as those in 4.7.4.3. See Figure 6 for the waveform on the oscilloscope. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAcaFor unidirectional conduction modules, read the cutoff voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the setup time and cutoff voltage of each drive output. 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
The test system diagram is shown in Figure 4.
4.7.5.2 Test equipment and its requirements
The test equipment and its requirements are shown in 4.7.4.2.
4.7.5.3 Test steps
The conversion switch is connected to each forwarding output terminal of the module under test. The remaining test steps are the same as 4.7.4.3. The waveform on the oscilloscope is shown in Figure 6. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAcaFor unidirectional conduction modules, read the cutoff voltage U from the dual-trace oscilloscope (see Figure 5b); e. Use the conversion switch to measure the setup time and cutoff voltage of each drive output. 4.7.5 Forwarding delay
4.7.5.1 Test system diagram
The test system diagram is shown in Figure 4.
4.7.5.2 Test equipment and its requirements
The test equipment and its requirements are shown in 4.7.4.2.
4.7.5.3 Test steps
The conversion switch is connected to each forwarding output terminal of the module under test. The remaining test steps are the same as 4.7.4.3. The waveform on the oscilloscope is shown in Figure 6. Take the larger of t, and as the forwarding delay test value. 10 -
TKAONKAca
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