Some standard content:
GB/T 8012--2000
This standard is a revision of GB/T80121987 "Casting Tin-Lead Solder". The revision refers to IS(）9453:1990, BSFV29453:1994, ASTMB32:1995.JISZ3282:1986 and other standards. Compared with GB/T8012-1987 "Casting Tin-Lead Solder", this standard has been modified as follows: 1) "Foreword", "Reference Standards", "Definition", "Order Contract Content" and other chapters have been added; 2) The product brands have been rearranged, and the number of brands has been increased from 35 to 40; 3) The requirements for the impurity content of the chemical composition of all brands have been increased to cadmium, and the requirements for sulfur have been cancelled. The requirements for silver have been added to AA, A and 8 grade products, and the requirements for bismuth, iron, arsenic, copper, zinc and aluminum impurities have been tightened; 4) When the inspection results of the solder received by the purchaser do not conform to this standard, the effective time for the request to the supplier is changed from "6 months" to 2 months; 5) The number of arbitration ingots for solder has been changed from "1% of the number of solder ingots, but not less than two ingots" to "not less than 2% of the number of ingots, and not less than 6 ingots" and "double sampling and repeated testing" and other contents have been added. Appendix A in this standard is a prompt appendix.
This standard shall replace GB/T8012-1987 "Casting Tin-Lead Solders" from the date of entry into force. This standard is proposed by the State Bureau of Nonferrous Metals Industry. This standard is under the jurisdiction of China Nonferrous Metals Industry Standard Metrology and Quality Research Institute. This standard is drafted by Yunnan Tin Company.
The main drafters of this standard are Guan Jiaying, He Peiru, Guo Wanli and Wang Tianming. 714
1 Scope
National Standard of the People's Republic of China
Casting Tin-Lead Solders
Casting Tin-Lead Solders
GB/T 8012----2000
Replaces GB/T 8012-1987
This standard specifies the product requirements, test methods, inspection rules and marking, packaging, transportation and storage of casting tin-lead solders. This standard applies to casting tin-lead solders produced by wet and fire refining. 2 Reference Standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and parties using this standard should explore the possibility of using the latest versions of the following standards. GB/T1250—1989Expression and formulation methods of limit valuesGB/T81701987Rules for rounding off values
GB/T 10574.1-1989
Chemical analysis methods for tin-lead solders-Determination of tin content by potassium iodate titrationGB/T 10574.2--1989
GB/T 10574.3—1989
GB/T 10574.4—1989
GB/T 10574. 5---1989
GB/T 10574.6--1989
GB/T 10574. 7...1989
GB/T10574.8—1989
GB/T 10574.9-1989
GB/T 10574.10
Chemical analysis methods for tin-lead solders--Malachite green spectrophotometric method for determination of antimony content--Chemical analysis methods for tin-lead solders
Potassium bromate titration method for determination of antimony content
Chemical analysis methods for tin-lead solders
Thiourea spectrophotometric method for determination of bismuth content
Chemical analysis methods for tin-lead solders 1.10-Phenanthroline spectrophotometric method for determination of iron content--Chemical analysis methods for tin-lead solders
Chemical analysis methods for tin-lead solders Analytical methods
Chemical analysis methods for tin-lead solder
Antimony blue spectrophotometric method for determination of arsenic content
2,9-dimethyl-1,10-phenanthroline spectrophotometric method for determination of copper content Flame atomic absorption spectrometry for determination of silver content
Potentiometric titration method for determination of silver content
Chemical analysis methods for tin-lead solder
: Flame atomic absorption spectrometry for determination of zinc content Chemical analysis methods for tin-lead solder
GB/T 10574. 11—1989
GB/T 10574.12—1989
GB/T 10574. 13 1989
GB/T 10574.14-1989
3 Definitions
This standard adopts the following definitions:
3.1 Casting
Chemical analysis methods for tin-lead solders
Spectrophotometric determination of tin-lead solders by chrome azurol S-polyethylene glycol octylphenyl ether
Catalytic oscillographic polarographic determination of cadmium content
Chemical analysis methods for tin-lead solders by spectrophotometric determination of phosphorus content by phosphorus-vanadium-molybdenum heteropolyacid crystal violet Chemical analysis methods for tin-lead solders by distillation oscillographic polarographic determination of sulfur content A processing technology in which the solder melt is poured into a mold with a certain shape. 3.2 Batch
A collection of solder products with the same chemical composition. 3.3 Ingot (bar)
Approved by the State Administration of Quality and Technical Supervision on June 9, 2000, implemented on November 1, 2000
GB/T 8012
A metal block formed by pouring molten solder into a mold of a specific geometric shape. 4 Requirements
4.1 Product category, brand and chemical composition
Product category, brand and chemical composition of solder shall comply with the provisions of Table 1. 4.1.1 Products with other chemical compositions may be provided upon negotiation between the supplier and the buyer. Physical properties
Physical properties of solder are shown in Appendix A (suggestive appendix). 4.3
Appearance requirements
The surface of solder ingots and bars shall be clean, free of corrosion, slag inclusions, burrs and foreign inclusions. 4.4
Quantity requirements
The weight of cast tin-lead solder ingots and bars shall comply with the requirements of Table 2716
GB/T 8012-
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1000 10001000
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10001000
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10009000z0005000
10*01000100*0
os 0a
o90~-1c
050~210
090~21
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GB/T8012.2000
9100100010001000
100+C0* 0~1000 climb
9t00100010001000
v000~100*0
000100m
S001001000100
1000100 01000
10001000100
10001000100
200100
100010001000
900200
100 °0100°0100'0
1000t00
10001000
100010001
10001000
100.01000
100010001000
080~90
080~210
080~090
209~961
509565
$'09~9'69
89~929
100~68
9.09~9.69
dqdosusIH
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Ingot weight, kg
Bar weight Product
1000±100
GB/T 8012
500+50
Other weights can be provided upon negotiation between the supplier and the buyer. 5 Test methods
5.1 The chemical composition arbitration analysis method of solder shall be carried out in accordance with the provisions of GB/T10574. 5.2 If it is necessary to detect elements other than those specified in Table 1, the analysis method shall be determined by negotiation between the supplier and the buyer. 5.3 The surface quality of solder shall be tested by daylight.
5 Inspection rules
6.1 Inspection and acceptance
250±25
6.1.1 The solder shall be inspected by the supplier’s quality and technical supervision department to ensure that the product complies with the provisions of this standard and fill in the quality certificate. 6.1.2 The purchaser may inspect the solder received according to this standard. If the inspection result does not conform to the standard (or order contract), it should be reported to the supplier within 2 months from the date of receipt of the solder, and the supply and demand parties shall negotiate to resolve the issue. If arbitration is required, the supplier and the buyer shall jointly conduct the inspection or the inspection agency recognized by both parties shall conduct random inspection. 6.2 Inspection Items
According to the provisions of Articles 4.1, 4.2 and 4.3, each batch of products shall be inspected for chemical composition, appearance, Weight inspection. 6.3 Arbitration sampling and sample preparation method
Randomly select not less than 2% of the batch of ingots, but not less than 6 ingots, and take an even number of ingots. For sample preparation. 6.3.2 | |tt||Randomly select 3% of the boxes, but not less than 3 boxes, and randomly select two pieces from each box for sample preparation. 6.3.3 Sampling method
Select the selected ingots (strips) , divide the ingot (bar) into 7 equal parts according to the size of the bottom, use a saw blade to saw 3 saws from both sides of the ingot (bar) alternately, and the depth of the saw gate is half of the width of the ingot (bar), see Figure 1. Figure 1
6.3.4 Before sawing, the sample surface should be cleaned, the sawing speed should not cause oxidation of sawdust, and lubricants should not be used. 6.3.5 The sawdust should be made into a particle size not larger than 1.25mm. 6.3.6. Sawdust Use a magnet to remove all the iron filings brought in during processing, mix carefully, and then reduce it to less than 100g per portion by quartering. During arbitration, divide the sample into 4 equal parts, two One copy is for the arbitration party to analyze and use, and the remaining two copies are kept by the supplier and the buyer respectively. 6.4 Determination of test results
6.4.1 The rounding of test results shall be carried out in accordance with the provisions of Chapter 3 of GB/T8170. The rounded values Compare with the limit values specified in this standard and determine whether the actual indicators meet the requirements of this standard in accordance with Article 5.2.2 of GIB/T1250. 6.4.2 If the results of the arbitration analysis do not meet the requirements of 4.1, double the number of samples specified in 6.3.1 or 6.3.2 should be taken from the batch of products for repeated testing. If the test results still do not meet the requirements of 4.1, the arbitration shall be followed. The analysis results are judged as unqualified products. GB/T 8012--2000
6.4.3 The surface of the solder ingot (strip) does not meet the requirements of Article 4.2 of the standard. The ingot (strip) shall be discarded. 7 Marking, packaging, Transportation and storage
7.1 Labeling
7.1.1 The solder ingot should have the company's abbreviated name, product trademark, batch number, and code. 7.1.2 The solder bar should have the company's abbreviated name, product trademark, and code. The packaging box should have the company name, factory address, product trademark, product implementation standard, batch number, brand number and net weight. The box should contain qualified products. 7.1.3
Packaging, transportation and storage
Solder ingots are packaged in bundles or in bulk.
Solder bars are packaged in wooden boxes, plastic boxes, cartons, or by To be agreed upon by both parties. 7.2.2:
7.2.3 During transportation, solder should be protected from rain, contact with chemicals and loose packages. 7.2.4 Solder should be stored in a moisture-proof and chemical-free environment. 7.3 Quality Certification Each batch of ingots (strips) shall be accompanied by a quality certificate, which shall indicate: a) the name of the supplier; b) the product name and trademark; c) the brand number. , batch number;
d) chemical composition and stamp of the quality and technical supervision department or signature of the responsible person; t) number of this standard;
f) packaging date.
8 Order contract content
8.1 Product name.
8.2 Brand.
8.3 Special requirements for impurity content.
8.4 Differences in geometric shapes Requirements.
8.5 Packaging method.
8.6 Quantity.
8.7 Standard number.
8.8 Others,
Melting overflow range, C
GB/T 8012..2000
Appendix A
(Suggestive Appendix)|| tt||Melting temperature, relative density, and application instructions of cast tin-lead solder Table A1
Relative density
[solidus, about liquidus, about
degrees, about|| tt||Postal, electrical, instrumentation high temperature welding
Special solder, welding zinc and plated metal
Application instructions
Electrical, electrical (printed circuit) wave soldering closed electronics, electrical General welding, mechanical and appliance welding. Radiator dip soldering. Cable joints are welded by machinery, bulb welding
Radiator chip welding
Mechanical and electrical welding, tinning. Cable and household appliance welding, To iron process welding machinery and electrical welding. Cooling machinery, lubrication machinery manufacturing, copper and copper alloys, ink welding
melting temperature range, C
solid phase line, about liquid phase line, about
relative density
degrees, about
GB/T 8012--2000
Table A1 (end)
Application instructions
Silver electrode, conductor welding: silver For tableware welding, electronic and electrical (printed circuit) wave soldering. Has certain anti-oxidation propertiesSawdust Use a magnet to remove all iron filings brought in during processing, mix carefully, and then reduce it to no less than 100g per portion by quartering. During arbitration, the sample shall be divided into 4 equal portions, two of which shall be used for analysis by the arbitration party, and the remaining two portions shall be kept by the supply and demand parties. 6.4 Determination of test results
6.4.1 The rounding of the test results shall be carried out in accordance with the provisions of Chapter 3 of GB/T8170. The rounded values shall be compared with the limit values specified in this standard, and the actual indicators shall be determined in accordance with the provisions of Article 5.2.2 of GB/T1250 to determine whether they meet the requirements of this standard. 6.4.2 If the arbitration analysis results do not meet the requirements of Article 4.1, double the samples specified in Article 6.3.1 or 6.3.2 shall be taken from the batch of products for repeated testing. If the test results still do not meet the requirements of Article 4.1, they shall be judged as unqualified products according to the arbitration analysis results. GB/T 8012--2000
6.4.3 If the surface of the solder ingot (strip) does not meet the requirements of Article 4.2 of the wood standard, the ingot (strip) shall be discarded. 7 Marking, packaging, transportation, storage
7.1 Labeling
7.1.1 The solder ingot shall have the abbreviated name of the enterprise, product trademark, batch number, and code. 7.1.2 The solder strip shall have the abbreviated name of the enterprise, product trademark, and code. The packaging box shall have the enterprise name, factory address, product trademark, product implementation standard, batch number, brand, and net weight. The box shall have qualified product 7.1.3
Packaging, transportation, storage
The solder ingot shall be packaged in bundles or in bulk.
The solder strip shall be packaged in wooden boxes, plastic boxes, cartons, or as agreed by the supply and demand parties. 7.2.2:www.bzxz.net
7.2.3 The solder should be protected from rain, chemicals and loose packages during transportation. 7.2.4 The solder should be stored in a moisture-proof and chemical-free environment. 7.3 Quality certificate
Each batch of ingots (strips) should be accompanied by a quality certificate, which should indicate: a) Name of supplier;
b) Product name and trademark;
c) Brand and batch number;
d) Chemical composition and stamp of the quality and technical supervision department or signature of the responsible person; t) Number of this standard;
f) Packing date.
8 Contents of order contract
8.1 Product name.
8.2 Brand.
8.3 Special requirements for impurity content.
8.4 Different requirements for geometric shapes.
8.5 Packaging method.
8.6 Quantity.
8.7 Standard number.
8.8 Others,
Melting overflow range, C
GB/T 8012..2000
Appendix A
(Suggestive Appendix)
Casting tin-lead solder melting temperature, relative density, application instructions Table A1
Relative density
[solidus, about liquidus, about
degree, about
Postal and telecommunications, electrical, instrumentation high temperature welding
Special solder, welding zinc and plated metal
Application instructions
Electrical, electrical (printed circuit) wave soldering closed electronics, electrical general welding, machinery, equipment welding Radiator dip soldering. Cable joints for mechanical manufacturing welding, bulb welding
Radiator chip welding
Mechanical and electrical welding, tinning. Cable, household appliances welding, iron process welding machinery, electrical welding. Cooling machinery, lubrication machinery manufacturing, copper and copper alloys, printing technology welding
Melting temperature range, C
Solid phase, about liquid phase, about
Relative density, about
GB/T 8012--2000
Table A1 (end)
Application instructions
Silver electrode, conductor welding: silver tableware welding for electronic, electrical (printed circuit) wave soldering. Has certain anti-oxidation propertiesSawdust Use a magnet to remove all iron filings brought in during processing, mix carefully, and then reduce it to no less than 100g per portion by quartering. During arbitration, the sample shall be divided into 4 equal portions, two of which shall be used for analysis by the arbitration party, and the remaining two portions shall be kept by the supply and demand parties. 6.4 Determination of test results
6.4.1 The rounding of the test results shall be carried out in accordance with the provisions of Chapter 3 of GB/T8170. The rounded values shall be compared with the limit values specified in this standard, and the actual indicators shall be determined in accordance with the provisions of Article 5.2.2 of GB/T1250 to determine whether they meet the requirements of this standard. 6.4.2 If the arbitration analysis results do not meet the requirements of Article 4.1, double the samples specified in Article 6.3.1 or 6.3.2 shall be taken from the batch of products for repeated testing. If the test results still do not meet the requirements of Article 4.1, they shall be judged as unqualified products according to the arbitration analysis results. GB/T 8012--2000
6.4.3 If the surface of the solder ingot (strip) does not meet the requirements of Article 4.2 of the wood standard, the ingot (strip) shall be discarded. 7 Marking, packaging, transportation, storage
7.1 Labeling
7.1.1 The solder ingot shall have the abbreviated name of the enterprise, product trademark, batch number, and code. 7.1.2 The solder strip shall have the abbreviated name of the enterprise, product trademark, and code. The packaging box shall have the enterprise name, factory address, product trademark, product implementation standard, batch number, brand, and net weight. The box shall have qualified product 7.1.3
Packaging, transportation, storage
The solder ingot shall be packaged in bundles or in bulk.
The solder strip shall be packaged in wooden boxes, plastic boxes, cartons, or as agreed by the supply and demand parties. 7.2.2:
7.2.3 The solder should be protected from rain, chemicals and loose packages during transportation. 7.2.4 The solder should be stored in a moisture-proof and chemical-free environment. 7.3 Quality certificate
Each batch of ingots (strips) should be accompanied by a quality certificate, which should indicate: a) Name of supplier;
b) Product name and trademark;
c) Brand and batch number;
d) Chemical composition and stamp of the quality and technical supervision department or signature of the responsible person; t) Number of this standard;
f) Packing date.
8 Contents of order contract
8.1 Product name.
8.2 Brand.
8.3 Special requirements for impurity content.
8.4 Different requirements for geometric shapes.
8.5 Packaging method.
8.6 Quantity.
8.7 Standard number.
8.8 Others,
Melting overflow range, C
GB/T 8012..2000
Appendix A
(Suggestive Appendix)
Casting tin-lead solder melting temperature, relative density, application instructions Table A1
Relative density
[solidus, about liquidus, about
degree, about
Postal and telecommunications, electrical, instrumentation high temperature welding
Special solder, welding zinc and plated metal
Application instructions
Electrical, electrical (printed circuit) wave soldering closed electronics, electrical general welding, machinery, equipment welding Radiator dip soldering. Cable joints for mechanical manufacturing welding, bulb welding
Radiator chip welding
Mechanical and electrical welding, tinning. Cable, household appliances welding, iron process welding machinery, electrical welding. Cooling machinery, lubrication machinery manufacturing, copper and copper alloys, printing technology welding
Melting temperature range, C
Solid phase, about liquid phase, about
Relative density, about
GB/T 8012--2000
Table A1 (end)
Application instructions
Silver electrode, conductor welding: silver tableware welding for electronic, electrical (printed circuit) wave soldering. Has certain anti-oxidation properties
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