GB/T 15878-1995 Specification for lead frames for small outline packages

Basic Information

Standard ID: GB/T 15878-1995

Standard Name: Specification for lead frames for small outline packages

Chinese Name: 小外形封装引线框架规范

Standard category:National Standard (GB)

state:in force

Date of Release1995-01-02

Date of Implementation:1996-08-01

standard classification number

Standard ICS number:Electronics>>31.200 Integrated Circuits, Microelectronics

Standard Classification Number:Electronic Components and Information Technology>>Microcircuit>>L55 Microcircuit Comprehensive

associated standards

Procurement status:SEEDS G28:1986

Publication information

publishing house:China Standards Press

Publication date:1996-08-01

other information

Release date:1995-12-22

Review date:2004-10-14

Drafting unit:Xiamen Yonghong Electronics Company

Focal point unit:National Semiconductor Device Standardization Technical Committee

Publishing department:State Bureau of Technical Supervision

competent authority:Ministry of Information Industry (Electronics)

Skip to download

Introduction to standards:

This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit small outline package (SOP) lead frame. This specification is applicable to semiconductor integrated circuit plastic small outline package punching type lead frame. GB/T 15878-1995 Small outline package lead frame specification GB/T15878-1995 Standard download decompression password: www.bzxz.net