This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit small outline package (SOP) lead frame. This specification is applicable to semiconductor integrated circuit plastic small outline package punching type lead frame. GB/T 15878-1995 Small outline package lead frame specification GB/T15878-1995 Standard download decompression password: www.bzxz.net

National Standard of the People's Republic of China
Specification of leadframes for small outline package
Specification of leadframes for small outline package1 Subject content and scope of application
1.1 Subject content
GB/T15878—1995www.bzxz.net
This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit small outline package (SOP) leadframes (hereinafter referred to as leadframes).
1.2 Scope of application
This specification applies to semiconductor integrated circuit plastic small outline package stamping leadframes. 2 Reference standards
GB7092-93 Outer dimensions of semiconductor integrated circuits GB/14112-93 Specifications for stamped lead frames for plastic dual-row packages of semiconductor integrated circuits GB/T14113-93 Terminology for semiconductor integrated circuit packaging SJ/L9007-87 Sampling plans and procedures for counting inspection 3 Terms, symbols, and codes
The terms, symbols, and codes used in this specification shall comply with the provisions of GB/T14113. 4 Technical requirements
4. 1 Design
The outer dimensions of the lead frame shall comply with the relevant provisions of GB7092 and meet the requirements for lead frame design. 4.1.1 Coining area
The minimum flat lead bond area, the width is 80% of the nominal lead width, and the length is 0.381mm. 4.1.2 Depth of coining
4.1.2.1 For 0.2 mm thick material, the minimum coining depth is 0.013 mm and the maximum is 0.051 mm. 4.1.2.2 For 0.25 mm thick material, the minimum coining depth is 0.013 mm and the maximum is 0.051 mm. 4.1.2.3 The maximum coining depth may also be limited by the minimum lead spacing requirement, and the minimum coining depth may also be limited by the minimum bonding area requirement.
4.1-3 Spacing between metals
The distance between each inner lead of the lead frame and between the inner lead and the chip bonding area shall not be less than 0.152 mm. 4.2 Lead frame shape and tolerance
4.2.1 Lead twist
Lead twist within the lead frame shall not exceed 3°30°, that is, the maximum deviation for every 0.254mm lead width shall not exceed 0.015mm4.2.2 Chip bonding area slope and flatness
Approved by the State Administration of Technical Supervision on December 22, 1995..com Implemented on August 1, 1996
GB/T15878-1995
4.2.2.1 Slope Under the condition of no concave, the maximum inclination is 0.025mm for every 2.54mm, and under the condition of concave, the maximum inclination is 0.051mm for every 2.54mt.
4.2.2.2 Flatness test is carried out from the center to the center of the four corners, the midpoint is specified as 0.127mm from each side, and the flatness is 0.005mm.
4.2.3 Die Attach Area Dimple
When measured from the center of the die attach area to a point on the support strip, it shall be within ±0.05 mm of the nominal dimension. For a 0.25 mm thick frame, the nominal dimple depth shall be 0.3 mm, and for a 0.2 mm thick frame, the nominal dimple depth shall be 0.2 mm. 4.2.4 Lead Coplanarity and Die Attach Area Coplanarity 4.2.4.1 Lead Coplanarity The coplanarity of the ends of the lead coining area within the leadframe shall be within ±0.1 mm. 4.2.4.2 Die Attach Area Flatness When measured at the center, the deviation of the die attach area from the reference plane shall be within ±0.076 mm/-0.127 mm.
4.2.5 Curl
The curl deformation along the length of the leadframe strip shall be less than 0.5 mm. 4.2-6 Horizontal bend
The maximum horizontal bend shall not exceed ±0.127mm.
In the length direction of 150mm, it shall not exceed 0.05mm. 4.2.8 Frame distortion
The distortion on each frame shall not exceed 0.51mm. 4.3° Lead frame appearance
4.3.1 Burr
The vertical burr inside the lead frame rib shall not exceed 0.02mm, and the vertical burr outside the rib and the horizontal burr at any position shall not exceed 0.05mm.
4.3.2 Pits and indentations
4.3.2.1 There shall be no indentations on the functional area and external leads. The depth of the pits in this area shall not exceed 0.008rm and the maximum surface size shall not exceed 0.013mm.
4.3.2.2 In other areas, pits and other defects shall not affect the strength of the lead frame, the depth shall not exceed 0.05mm, and the maximum surface size shall not exceed 0.13mm
4.3.3 Surface defects
The non-bonded area shall be the natural color of the metal material, free of rust, flower and other defects. 4.4 Lead frame plating
4.4. 1 Plating thickness
4.4.1.1 The thickness of the local gold plating layer of the lead frame shall not be less than 1μm. 4.4.1.2 The thickness of the local silver plating layer of the lead frame shall not be less than 3.8um4.4.2 Appearance of plating
The surface of the plating shall be dense, smooth, uniform in color and the natural color of the plating, and no defects such as peeling, blistering, staining, spots, water marks, foreign matter, flower and other defects are allowed. There shall be no obvious stains, loose or missing bond layers. There shall be no scratches that penetrate the entire plating. 4.4.3 Heat resistance of coating
The coating should not have obvious discoloration after high temperature test, and no defects such as peeling, blistering, flaking, blooming, spots, etc. are allowed. 4.4.4 Coating bonding strength
The coating of the lead frame should be easy to dry and bond, and the bonding strength is greater than 40mN. 4.5 Strength of lead frame outer leads
The outer leads of the lead frame should not be broken after the bending test. 5 Inspection rules
GB/T15878—1995
5.1 Composition of inspection batches
“An inspection batch can be composed of one production batch or several production batches that meet the following conditions. a. These production batches are manufactured using the same materials, processes, equipment, etc.; h. The inspection results of each production batch prove that the quality of materials and processes can ensure that the lead frames produced reach the predetermined quality level;
c. The time for several production batches to form an inspection batch is usually no more than one week, and unless otherwise specified, the longest shall not exceed one month. 5.2 Inspection items and requirements || tt||The inspection items and requirements of the lead frame are shown in Table 1. The test marked with (D) is a destructive test. The test methods quoted in Table 1 refer to the methods specified in the appendix of GB/T14112. The AQL sampling plan is in accordance with the provisions of SJ/Z9007, and the number of samples is measured in strips. Table 1
Inspection and test
Geometric tolerance
Thickness of coating
Heat resistance of coating (1)
Bonding degree (D)
Strength of external lead wire (D)
6 Ordering information
Test method
Used to meet the measurement accuracy||tt| |Measurement of measuring instruments
Appendix A
X fluorescence thickness gauge or
Other equivalent instruments
Appendix B R1
Appendix B+B2
Appendix B 13
Inspection requirements
According to 4.3 and 4.4.2 of this specification
According to 4. of this specification)
According to 4.2 of this specification
According to 4.4.1 of this specification
According to 4.4.3 of this specification
According to 4.4.4 of this specification
According to 4.5 of this specification
If there are no other provisions, order lead wires At least the following information is required when making a lead frame: a.
Product model, specification:
Quantity;
Product drawing and drawing number;
Material name and specification;
Any other details (when applicable).
7 Marking, packaging, transportation, storage
7.1 Marking
The lead frame packaging box should have the following markings: "Name or trademark:
Product name, model, specification
Product standard number:
Quantity:
Production date"
Inspection batch identification code and inspector code. [
7.2 Packaging
To avoid damage and leakage during normal transportation, the product needs to be packaged in a specially designed and manufactured packaging box, which should prevent the product from being contaminated and damp.
GB/T 15878-1995
The inner package of the lead frame should be packed with neutral materials and sealed to ensure that the product is not contaminated and corroded, and to prevent physical damage. 7.3 Transportation
The packaging of the product should be able to adapt to the transportation of any means of transportation, and should be protected from rain, moisture and damage during transportation. 7.4 Storage
7.4.1 Lead frame products should be stored in a warehouse with an ambient temperature of 10~35℃, a relative humidity of no more than 80%, and no corrosive gas around.
7.4.2. From the time of leaving the factory, the shelf life of the lead frame with a coating is three months, and the shelf life of the lead frame without a coating is six months. Additional notes:
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the National Integrated Circuit Standardization Technical Committee. This standard was drafted by Xiamen Yonghong Electronics Company and the Standardization Institute of the Ministry of Electronics Industry. The main drafters of this standard are Shangguan Peng and Chen Yukun
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