SJ/T 10455-1993 Copper conductor paste for thick film hybrid integrated circuits SJ/T10455-1993 Standard download decompression password: www.bzxz.net

Electronic Industry Standard of the People's Republic of China
SJ/T 10455-93
Copper conductor paste for thick film hybrid integrated circuits1993-12-17Promulgated
Implementation on 1994-06-01
Ministry of Electronics Industry of the People's Republic of China
Electronic Industry Standard of the People's Republic of China
Copper conductor paste for thick film hybrid integrated circuits1 Subject content and scope of application
1.1 Subject content
S3/T10455-93
This standard defines the technical requirements, test methods, inspection rules, packaging, storage and transportation of copper conductive paste for integrated circuits (hereinafter referred to as paste).
1.2 Scope of application
This standard applies to thick film hybrid integrated circuit conductive paste. 2 Reference standards
GB2421
G0 2423.28
GD 8976
3 Technical requirements
3.1 Material properties
Environmental test procedures for electric and electronic products Basic environmental test procedures for electric and electronic products Test methods
Film-formed circuit composite film single or circuit board electronic device design and testing procedures
The paste properties shall comply with the requirements of Table 1.
Table 1 Paste retention ratio
3.2 Paste molding properties
The film forming properties of the material shall comply with the requirements of Table 2.
Early body material to the same color
125~20
The Ministry of Industry of the People's Republic of China approved on December 17, 1993 as
Implementation on June 1, 1994
4 Test method
4.1 Environmental conditions
Practice group sharing
Sintering service degree
Selectivity
SJ/T10455-93
Table 2 Film-forming properties of raw materials
After commercial storage| |tt||Anti-penetration and folding
Initial test
High climbing storage
Pressure
Hot opening
High-temperature storage
Pressure recovery
High-temperature storage
According to the requirements
15--18
Unless otherwise specified, all tests shall be carried out under the normal atmospheric conditions specified in GB2421 (temperature 15~35℃, relative humidity 45%~75%, air pressure 86~106kPa). 4.2 Sample preparation
Test samples for the working characteristics of conductor paste and conductor performance are prepared according to the thick coating process. The recommended processing technology is shown in Appendix A (reference). The substrate size is 30 mm × 20 mm. The test shape is shown in Figure 12.
The size of the test area A~Au is: 2 mm x 2 mm,
The size of the test area 2 is: 1 mm × 1 mm. The maximum width of the conductor L is: 0.50 mm. The maximum width of the conductor L is: 0.21 mm.
The width of the conductor 1 is: 0.20 mm
S3/T10455-93
The minimum distance between the conductor L and L is: 0.30 mm. The minimum spacing between the guide band L1 and L2 is 20 mm2. The measurement is only for the group
a, viscosity meter:
b+ service table;
s. Measurement microscope:
film thickness tester;
e tension;
", gram meter.
4.4 Appearance
The appearance of the slurry is visually inspected and should comply with the provisions of the table! 4.5 Resolution
Measured with an absolute working rotational viscometer, the constant temperature water skirt temperature is 25=100 million, the shear rate is 10 r/min4.6Resistance
Conductive tape printed line is calculated as /=1 state (the length of conductive tape is 1/100). Use ohmmeter to measure the value of the conductive film at both ends of the sample, and calculate the square resistance according to the following formula: R=R/100
Where: R. Conductive film square resistance, ml:
—, the measured value of the resistance at the end,
7 lines
Use ohmmeter to measure the line width of L, L, and the distance between L, and observe L , and L must not be connected, or measured with an ohmmeter, 1, and the difference between them must be. 4.8 Film thickness
Use a film thickness tester or other instruments with equivalent accuracy to measure the film thickness, and the measurement error is 1.5%. 4.9 Solderability
The test can be carried out on A,-A19. According to the requirements of 4.5.10.1 of 896, one side of the test area of ​​the test piece is wetted with coal, and the return is 5±0.55 when immersed. It is good if the area is more than 80%. When immersed in the solder phase, allow the test substrate to be condensed. Horizontal is vertical movement. 4.10 Resistance to solder bending
Resistance to solder bending test is carried out in accordance with 4.9 of this specification with the following changes: No time is 10±s;
b. Carry out the above operation, cool down to 15-35 each time, and repeat the operation. If 50% of the solder area is broken off by the material, it will fail.
4.11 Adhesion
Adhesion is determined by another test, and is carried out on the AA area. Test lead If a 0.8mm thick lead is used, bend it according to the method shown in Figure 2. SI/T 10455-93
Test substrate
Figure 2 Test substrate
Liang Ai District People
Pre-treat the substrate according to Article 4.6 of GB242320, and heat the substrate for 30±5s. After the test lead is lubricated with flux, the test lead should be bent or perpendicular to the substrate at an angle of ±1° for 5s (2 hours) at room temperature (15--35°C) for 16 hours before measurement. Use a tensile machine to move the test lead for 5 minutes. 10.-20mm machine is pulled upward from the vertical direction of the substrate. The following damage modes are distinguished: Conductive tape and solder are pulled off:
b. The test can be carried out from the solder: e. The sound plate is pulled and broken
Good quality 6, the core allows the policy or replacement of the sample after the last test. 4.12 Alloy strength
According to GJR548 method 2011 test piece D, the lead wire is connected at any point on ~Z. Lead diameter: 25μmu
4.13 High-voltage storage
The sample is placed in a 150±2t drying auxiliary for 96h and then recovered for 24h for measurement. The mechanical resistance, adhesion force and rated all-in strength should be in accordance with the provisions of Table 2. 5 Inspection rules
5.1 Inspection batch
SJ/T10455-93
Each preparation of slurry is an inspection batch. An appropriate amount of slurry is randomly selected from the inspection batch and tested samples are prepared. The sample preparation is shown in 4.2.
5.2 Delivery inspection
Inspect each batch according to the provisions of B in Table 3 and Table 4. The inspection of Group B should be carried out after the inspection of Group A is qualified. 5.3 Periodic inspectionbzxz.net
The test samples should be taken according to the representative period, and the periodic inspection should be carried out according to the provisions of Table 3 and Table 4 and the order of Group A, C, and qualified. If a single sample fails during the test, the subsequent test will not be selected and it is considered that the periodic inspection will fail. The fixed inspection is carried out once a year. When the manufacturing process or raw materials are greatly changed, the test should also be carried out. Table 3 Slurry properties Plasticity test
Square resistance (nail building)
Sintered tube thickness
Adhesion (initial low)
Chain strength (initial value)
Optional
Chemical resistance
High-break storage
Test after test
5.4 Cold judgment criteria
Square road
Appendix J
Test according to Method
Test of conductive properties after film formation
Requirements
Methods
Number of test samples
Enough to allow
3 pieces
(by windage)>
20 (by line number)
Understanding the number of samples
The test results should meet the requirements of this standard. If it is found that the requirements of this standard are not met, double the number of samples from the batch of slurry shall be selected, and the non-compliant items shall be re-tested. If the reduced test is still qualified, the batch of slurry shall be deemed unqualified. 6. Labeling, packaging, storage and transportation
6.1 Labeling
Day 1.1 In addition to the special markings required by the contract, each construction and packaging component shall be marked with the following: 4: Product name:
Number;
Manufacturer name;
D, production date, batch number.
SI/J1045593
6.1.2 Each inner package shall be stamped with the seal of the manufacturer. 6.2 Packaging
Conductor slurry shall be sealed in polyethylene plastic bottles. 6.3 These
Conductor slurry shall be stored in a clean, low-temperature, and sun-proof place, with a storage temperature not higher than 25℃ and a relative humidity not higher than 75%. The validity period is half a year.
6.4 Transportation
Packaged conductor slurry can be transported in any way, but it must be kept away from sunlight, rain or other contamination. A1 substrate 96% lead oxide steam.
51/T10455-93
Attachment A
Recommended processing technology for sample
【Reference】
A2 Print A325 self-screen, recommended latex thickness 12.-20ga, printing speed 20/sA3 Drying
After drying, dry in room temperature for 5-[urnin, in 120t air for 1-·15ainA4 Sinter in an atmosphere furnace with carrier gas content less than 10?10-*Sintering cycle for 15min, peak salt concentration tIprain sintering curve A1
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descent speed
Han C/m.in
time Time (min
zone A1 olefin wire
A5 rust welding month 60/4) silver/lead or 60/38/2 aluminum/lead/silver solder, neutral flux welding, PF01 type, A6 heat sound gold welding temperature range 100--200TA7 ultrasonic aluminum wire welding and precious metal with the same conductor, higher power and shorter welding time Additional remarks:
This standard is drafted by the Ministry of Industry Standardization Research Institute and the Ministry of Electronics Industry East China Institute of Electronic Technology and 4310 Factory.
The main drafters of the standard are: Ye Guohua, Xia Zhengyi, Zhou Jilan, Han Yanfen, Xing Yaolian.
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