This standard specifies the high temperature blocking test method for common rectifiers, common thyristors and their derivative devices. This standard is applicable to batch inspection and periodic inspection of products. This standard is not applicable to product reliability grading, maintenance and other tests. JB/T 5847-1991 High temperature blocking test method guidelines JB/T5847-1991 standard download decompression password: www.bzxz.net

Mechanical Industry Standard of the People's Republic of China
Guidelines for High-Temperature Blocking Test MethodsWww.bzxZ.net
Topic Content and Applicable Scope
JB/T5847--91
This international standard specifies the high-temperature blocking test methods for common rectifiers, common thyristors and their derivative devices (hereinafter referred to as products). This standard is applicable to batch inspection and periodic inspection of products. This standard is not applicable to product reliability grading, maintenance and other tests. Reference Standards
GB4939
Ordinary rectifiers
GB4940 Ordinary thyristors
GB3187 Basic terms and definitions of reliability GB2900.32 Electrical terms Power semiconductor devices GB4936.1 General specification for discrete semiconductor devices GB2828 Batch inspection counting sampling procedures and sampling tables 3 Terms
3.1 High-Temperature Blocking Test
A test in which a specified temperature and PN junction reverse bias voltage are applied to the product within a specified time. 3.2 Durability
The ability of a product to complete specified functions when it reaches the limit of a certain technical or economic indicator under specified use and maintenance conditions. 3.3 Failure
The loss of specified functions of a product.
3.4 ​​Failure mode
The manifestation of failure.
3.5 Failure mechanism
The internal causes such as physical and chemical changes that cause failure. 3.6 Early failure
The failure of a product due to design and manufacturing defects. (Article 2.2.6 of GB3187-82). 3.7 Screening test
A test conducted to select products with certain characteristics or to eliminate early failures. 3.8 Durability test
A test conducted within a certain period of time to examine the relationship between the performance of a product and the influence of the applied stress conditions. 3.9 PN junction
The junction between the P-type region and the N-type region of a semiconductor. Test purpose
The purpose of the screening test is to eliminate products with early failures. The purpose of durability testing is to assess the product's ability to perform specified functions under specified conditions. 5 Circuit Principle
Approved by the Ministry of Machinery and Electronics Industry on October 24, 1991 176
Implementation on October 1, 1992
T Power Transformer
RI--Test circuit current limiting resistor,
S--Fuse:
JB/T5847-91
Heating standby
Required filter test panel system
Figure 1 High temperature blocking test circuit
-Test main circuit current limiting resistor;
Rc gate resistor;
Off-state peak voltage measurement meter:
Leakage current sampling resistor;
Test product;
Air temperature system
Reverse temperature protection circuit
Reverse drop voltage measurement meter.
Note: In some types of thyristors, the thyristor may be turned on due to power on or noise in the test circuit. Ro can reduce gate sensitivity to prevent turning on. 6 Sampling quantity
Sampling for screening test is recommended according to Table 1, or full or sampling test can be carried out according to the detailed requirements of the manufacturer or delivery contract. Package
Product capacity
<100A
According to GB2828,
AQL is 2.5 or 4.0
6.2 Durability test is carried out according to the sampling plan specified in 3.2 of GB4939, 3.2 of GB4940, or B8 and C8 groups of relevant detailed specifications.
7 Test conditions
7.1 Test voltage
The test voltage shall be selected according to the value specified in the relevant standards or Table 2 of this standard. The change of the test voltage shall be within 0% to -10% of the specified value. 7.2 Test temperature
The change of the screening test temperature shall comply with the provisions of Table 2. The durability test temperature shall comply with the provisions of 3.2 of GB4939 or 3.2 of GB4940. 177
7.3 Test duration
The time of the screening test is recommended to adopt the value in Table 2. JB/T5847-91
The time of the durability test shall be determined in accordance with 3.2 of GB4939 or 3.2 of GB4940. If the test is interrupted due to various reasons, the test should be resumed within 24 hours as far as possible, and the test time is allowed to be calculated continuously. The screening test can be carried out according to the combination conditions listed in Table 2. Qiu 2
Test voltage V
VRM and (or) VDR
Note: T= is the rated junction temperature of the tested product.
Test equipment, instruments, and meters
Test temperature
8.1 The accuracy of the test instruments and meters shall not be less than Class 1.5. 8.2 Test protection measures
Test time
During the test, the heating device shall have overheating control protection measures to limit the maximum temperature. The test circuit shall adopt measures to suppress transient overvoltage to prevent damage to the product due to transient overvoltage. Failure criteria
After the test, the failure criteria for determining device failure are shown in Table 3. Qiu 3
Device category
Ordinary crystal tube 2)
Ordinary rectifier tube\)
Derived device 3》
Note: 1)
USL=upper limit of specification
Failure determination electrical parameters
Single component heating method
Failure criterion
>2xUSL or>1xUSLt)
>2×USL or>1×USL
>2×USL or>1×USL
If the product loses the specified blocking voltage capability during the test, the device is considered to have failed; the corresponding failure criterion can be formulated with reference to the ordinary crystal tube and ordinary rectifier tube in Table 3. After the test, the test piece is placed at room temperature for 2 hours before testing. All tests should be completed within 96 hours. 9.2
When the batch test fails, the procedure for failing the periodic inspection in 3.6.2.4 of GB4936.1 shall be followed. 178
10 Test records and test reports
10.1 Test records
JB/T584791
During the test, accurate and complete test records shall be made. For each test product, the leakage current data shall be recorded in chronological order within the specified time or after the failure occurs. When the device fails due to a mis-test (such as a failure of the test equipment or the measuring instrument or an operator's error), the failure shall be recorded in the test record and the cause shall be stated. 10.2 Test report
The test report is a document that makes the final conclusion based on the test records and analysis after the test is completed. Its content shall comply with the requirements of Appendix A. 179
Manufacturing unit
Test date
Test conditions
Test port
Cumulative test time (h)
Failed product number
Product model and specification
Cumulative number of failures
Test conclusion and recommended measures
Form filler:
Test person in charge:
Additional words,
Failure occurrence time
JB/T5847-91||tt ||Appendix A
High temperature over-break test report
(Supplement)
High temperature over-break test report
Validity
Test standard, inspection and other document names, codes
[naIGT
Test equipment, only serious fault occurrence time
Test list:
This standard is proposed and coordinated by the Lei'an Power Electronics Technology Research Institute of the Ministry of Electronics Industry, and this standard is drafted by the Xi'an Power Electronics Technology Research Institute of the Ministry of Electronics Industry. The main drafters of this standard are Wang Menglong and Li Xuemin. Date
IanxIat
Number of tests
Failure criteria
Professional maintenance time
(Stamp)
Maintenance personnel
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