This blank detailed specification stipulates the basic principles for the formulation of the detailed specification of "microwave detection and mixing diodes". All detailed specifications within this scope should be consistent with this blank detailed specification. This blank detailed specification is one of a series of blank specifications related to GB4589.1-89 "General Specification for Discrete Semiconductor Devices and Integrated Circuits" and GB12560-90 "Separate Specification for Discrete Semiconductor Devices". GB/T 15177-1994 Blank Detailed Specification for Microwave Detection and Mixing Diodes GB/T15177-1994 Standard Download Decompression Password: www.bzxz.net

National Standard of the People's Republic of China
Blank detail specification for microwave detectors and mixer diodesCB/T 15177-94
This blank detailed specification specifies the basic principles for the formulation of the detailed specification of "microwave detectors and mixer diodes". All detailed specifications within this scope shall be formulated in accordance with this blank detailed specification. This blank detailed specification is one of a series of blank specifications related to GB4589.1-89 "General Specification for Semiconductor Devices and Integrated Circuits" and GB12560--9 "Sectional Specification for Discrete Semiconductor Devices". Required information
The following required items shall be included in the specified blanks. Identification of the detailed specification
(1) Name of the standardization body authorized to issue the detailed specification. (2) IECQ detailed specification number.
(3) General specification number and version number.
(4) Detailed specification number, month of publication and any further information required by the national system fee. Identification of the device
(5) Brief description of the device type.
(6) Typical structure and application information.
If a device is designed to meet several applications, this should be clearly stated in the detailed specification. The characteristics, limit values ​​and test requirements of these applications should be met.
(7) Appearance drawing and/or reference to relevant appearance standards. (8) Category of quality assessment.
(9) Reference data of the most important characteristics that can be compared between device models. Approved by the State Administration of Technical Supervision on August 2, 1994 and implemented on April 1, 1995
Name of the standardization organization authorized to issue detailed specifications Basis for evaluating device quality:
GB/T 15177-94
GB4589.-89 "General Specification for Semiconductor Devices, Discrete Devices and Integrated Circuits"
&Special Specification for Flat Conductor Devices, Discrete Devices
GB 12560--90
Detailed specification:
[Model of relevant device]
Ordering information: See Chapter 7 of this specification
Mechanical description
Appearance standard:
LIECQ Detailed specification number, version number and (or) date) Detailed specification number
(7)|2 Brief description
Semiconductor materials·Silicon arsenide
GB7581-87 "Small outline size of semiconductor discrete devices" Appearance drawing:
[You can go to Chapter 10 of this specification or give a detailed drawing] Terminal identification:
The provisions for the terminals shown in the drawings include graphic symbols: letters and graphics or color codes
Currently, Article 2.5 of GB4589.1 and (or) Article 6 of this specification Chapter 1
Package: Cavity or non-cavity
Power: Ambient rated temperature (T)
Application: Mixing, detection
Type:
Continuous wave mixing
2 Pulse mixing
3 Detection
Quality assessment category
「According to Article 2.6 of GB4589.1
Reference data
For relevant information of manufacturers qualified according to this detailed specification, see the list of qualified products. (2)
GB/T 15177-94
[Throughout the detailed specification, the information given in square brackets is only used for guidance in the preparation of the detailed specification and is not included in the detailed specification.
Throughout the specification:
X: indicates a value that should be filled in the detailed specification. 4 Limiting Values ​​(Absolute Maximum Ratings)
Unless otherwise specified, these limiting values ​​apply over the entire operating range. [Only the clauses with titles are reused. Any additional values ​​are given at the appropriate [place. But there is no clause number. "L curves are preferably given in Chapter 10 of this specification. ］Number
Article number
Working environment temperature
Storage temperature
Reverse voltage
Reverse DC voltage (when applicable)
Reverse peak voltage (applicable Appendix)
Under specified pulse conditions
Power dissipation
Absolute limit value of power dissipation [If necessary, attach the overflow derating curve (see Chapter 10)
Maximum continuous wave power (when applicable)
Maximum pulse power (when applicable)
5 Electrical characteristics
For inspection requirements, see Chapter 8 of this specification.
Minimum Maximum Minimum Maximum
Those characteristics marked as "applicable" in this specification and the test section, or omitted, or deleted if specified, shall be tested. Minimum Maximum
The text with the title is repeated. Any additional characteristics are given in the appropriate place, but without clause numbers. [When several specifications of devices are included in the same detailed specification, the relevant values ​​should be given in a continuous manner to avoid repetition of the same position.
The curve is preferably given in Chapter 10 of this specification. 7 Clause number
Characteristics and conditions
Unless otherwise specified,
T.mt—25
GB/T 1517794
Minimum and maximum
Forward voltage at forward current Im (DC or pulse, as specified)
Forward voltage at minimum stop current I (when applicable)Maximum reverse current at specified reverse voltageMaximum reverse current at specified voltage and high temperatureIntermediate frequency impedance at specified drive and bias
Voltage standing wave ratio
Video impedance under specified drive and bias conditions and specified test fixture
Total noise figure
Under given rectifier current and tracking amplifier with mirror matching
Conversion loss under specified conditions and
Output noise ratio
Figure of merit at specified rectifier current and specified limiting tracking amplifier (when applicable)
Tangent sensitivity
Current sensitivity under specified bias and video bandwidth
Under specified RF input power or rectifier current5. 14
Voltage sensitivity (when applicable)
At specified RF input power or rectified current 5.15
Total capacitance (when applicable)
Relay resistance (when applicable)
Continuous wave burn-in and repetitive pulse burn-in energy (when applicable) Note: 1>When applicable.
6 Marking
Ermtrep
" Grouping
Minimum Maximum
Minimum Maximum
"In addition to the mountain given in the previous (7) column and "or") GB4589.1 Article 2.5, any other special information should be specified here. 7: Ordering information
GB/T 15177—94
[Unless otherwise specified, the following information is required at least for ordering a specific device: Exact model
IECQ detailed specification number with version number and/or date, where relevant. Quality assessment category (if required, follow the screening order of clause 3.6 of GB12560). Any other details.]
8 Test conditions and inspection requirements
[In the following table, test conditions and inspection methods are given. The values ​​used and the exact test conditions shall be in accordance with the requirements of the given model and in accordance with the relevant provisions of GB6570 Microwave Diode Test Method and GB4937≤Mechanical and Gas Test Methods for Discrete Semiconductor Devices. When several specifications of devices are included in the same detailed specification, the relevant conditions and/or values ​​shall be given in consecutive sheets, in which duplication of the same conditions and/or values ​​shall be avoided as much as possible. Unless otherwise specified, the clause numbers quoted in the section correspond to the clause numbers of GB4589.1. Sampling requirements, according to the applicable quality assessment category, refer to or restate the values ​​of 3.7 of GB12560. For Group A, select the AQL or LTPD scheme in the detailed specification. J Table 1 Group A - Batch by batch
All tests are non-destructive (3, 6.6). Unless otherwise specified, inspection or test Group A1 External visual inspection Group A2 Non-operating devices Group A2b Reverse current Forward voltage Positive quotient voltage (where applicable) Total noise figure Transformation loss Output operating noise ratio Visual impedance Reference standards 4.2.1.1 GB 65703.2 CB 65703.3 GB 65703.3
GB 6570 4. 5
GR 65704. 7
GB65704.6
CB 65707.9
Tma = 25
(See Chapter 4 of GR4580.1)
Test requirements
Minimum value Maximum value Minimum servo Maximum value Minimum polarity question
Vμ -[10V+imrk
or>[100k[?
"Unless otherwise specified
Vr=maximum value
DC current or pulse. Connect||tt ||Regulations"
Three indicates DC current or pulse.
Connection regulations"
[According to regulations]】
"Connection regulations"
L According to regulations]
[As specified]
Inspection or test
Tangent sensitivity
Current sensitivity
Voltage sensitivity
(when applicable)| |tt||(When used)
A3 group
Voltage standing wave ratio
Medium impedance
(When applicable)
Total capacitance||tt ||（When applicable）
Series connection
【When applicable）
Note) When applicable.
Quoted standard
GB65707.3|| tt||G3 6570 7.5
G 65707. 4
GE 6570 7. 6
GR65?0
GR6570
GB6570
GB 65706. 9
GB/T15177—94
Continued Table 1
Unless otherwise specified:
Tamb=25 ℃
Inspection requirements
Minimum valueMinimum valueMaximum valueMinimum value of other quantity (see Chapter 1 of GB1589.1)
According to regulations (with partial cover)|| tt||LAccording to regulations!
[According to regulations (without bias]
According to regulations
【According to regulations】
［According to regulations］||tt| |「一定值
以定】
Table 2 Group B——Batch by batch
(for Class 1 Requirements, see 2.6 of GR4589.1) Only tests marked with (D) are destructive (3.6.6). Article
Unless otherwise specified.
Inspection or test||tt| |B1 grouping L
B3 grouping
Porridge strength
Lead bending
(when applicable)
134 grouping
Can be port
(When applicable)
Referenced standards
GB 49372.1.2
GK 49372.2. 1
Tarmb=25℃
( See Chapter 4 of G34589.1)
"According to regulations"
[According to regulations, the trough method is preferred"
LSL-A Lower limit value of group specification
SY. E: limit value of A-New specification
test requirement
maximum value minimum value maximum value Chapter 1 of the specification
No damage
Good wetting
Inspection or test
Group B5
Temperature change continues
Alternating Damp Heat
(D) (For
Non-cavity device
Last test
Reverse current
Forward current Pressure
Sealing (for
cavity devices)
B8 grouping
Electrical durability
Final test
Reverse electric construction
|tt||Forward voltage
Total noise figure
Transformation loss
Output noise ratio
Tangent sensitivity
Current sensitivity
Voltage sensitivity
(when applicable)）
CRRL group
reference standard
GB 49373. 1
GE 2423. 4
GB 493*3. 7
GB 4938
GB/T 15177—94
Continued Table 2| |tt||Unless otherwise specified,
Tnh= 25 C
Inspection fee
Minimum value, maximum value, minimum value, minimum price, minimum price (see (4589.1, Chapter 4)
-According to regulations]bzxz.net
【According to regulations
Grouped by A2b
Grouped by A2h
「According to regulations］
168h working time or reverse temperature deviation
Grouped by A2b
Group by A2h
Group by A2b
Group by A2h
Group by A2b
Connect to A26
Connect to A2h
A2b group
provides count check results for groups 133, 134, B5 and B8 tist
Only the tests marked with (1)) are destructive (3.6.6). Inspection or test
C1 group
C26 group
Question current
C2e group
(when applicable)
Continuous fatigue burnout
or heavy pulse
final test:
reverse current
forward voltage
3Shu"
lead-out strength| |tt||Tension (D) or
Bending moment (D)
(for metal ceramics
Ceramic coaxial package
C4 grouping
(when applicable)
Resistance to soldering heat
Final test;
Reverse current
Forward Reverse voltage
(for cavity device
mechanical shock or
followed by:
constant acceleration
final test:
reverse forward current
forward voltage
Epmeep)
reference standard
GB 65703.2
GB65704.8
GB 43972.1.1
Appendix A to this specification
GB 4937 2.2.2
GB4937||tt ||Note, for ultra-small devices, the requirements are as follows:
GB/T 1517794
Table 3 Group C - Cycles
Unless otherwise specified,
Tanb = 25 ℃
Test requirements
Minimum value Maximum value Minimum value Minimum value Maximum value (see GH 4589.】Chapter 4)
See Chapter 1 of this specification
VR—specified value [It is best to take the maximum value of Vk!
Tanb—specified High temperature
［According to regulations］
[According to regulations］
Grouped by A2h
Grouped by A2h
「According to regulations］
[According to regulations]
「According to regulations」
According to A2L. Division
LAccording to regulations］
[According to regulations」
According to A2h division| |tt||Group by A2b
Test or cheat
C7 group
(for non-cavity
devices) stable State
Damp heat (D)
Alternating damp heat
Test:
Reverse current
Forward voltage
Electrical endurance
Final continental test:
High temperature storage
Final test:
Same as B8 group
CRRL group
Reference mark only| |tt||CB 40373.5
GB 2423-4
GB4938
CB 49373.2
GB/T 15177—94
Continued Table 3
Unless Otherwise specified
TiL=25 C
Inspection requirements
Minimum debt maximum estimated financing minimum value maximum value aggregate minimum maximum value (see GB4589.1, No. 4)
"As specified"
"As specified"
Grouped by A2h
Grouped by A2b
Working life or high temperature reverse bias, at least
At the highest storage temperature, at least
Same as R8
Same as B8
Provide counting inspection results for C3.C5.C6C8 and C9. Provide counting inspection results before and after C8 group test 9D group inspection
When required, this test should be specified in the detailed specification (for identification and approval only). 10 Additional information (not for inspection)
[Additional information should be given whenever the specification and device use require it, such as: temperature derating curves related to the limit:
Complete description of the test circuit or supplementary method; detailed appearance drawing. 7
A1 Purpose
GB/T 15177--94
Appendix A
Bending moment test method
(Supplement)
This test is designed to test the bending resistance of metal-ceramic packaged coaxial devices. A2 Equipment
The bending moment test requires appropriate fixtures and specified weights to fix the device. A3 Test method
Fix one end of the device on the support and hang a specified weight at the other end in a direction perpendicular to the axis without impact. After the torque is applied, the support rotates three times at a high speed within 10 seconds. A4 Post-measurement inspection
After the test, conduct a visual inspection at a magnification of 3 to 10 times. If the electrodes and If there are any signs of breakage, looseness and relative movement between the porcelain tubes, the device shall be judged as failed.
A5 Data to be given in the relevant specifications
The value of the bending moment applied to the device.
Additional instructions:
This standard was proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the National Technical Committee for Standardization of Semiconductor Devices. This standard is drafted by the Standardization Institute of the Ministry of Electronics Industry. The main drafters of this standard are Jin Guiyong, Shen Jichang and Hao Zun. From the date of implementation of this standard, the former Ministry of Electronics Industry of the People's Republic of China Standard SJ2607-85 Blank Detailed Specification for Microwave Detection Mixed-Amount Diodes shall cease to apply.
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