This standard is equivalent to the International Electrotechnical Commission electronic device quality assessment system standard IEC/PQC 90 "Special Specification for Single-Sided and Double-Sided Printed Boards with Metallized Holes" (1990 Edition). This document is the Sectional Specification (SS) for Single-Sided and Double-Sided Printed Boards with Metallized Holes. When they are prepared to install components, regardless of their manufacturing method, this specification specifies the performance and test methods evaluated by capability approval tests and quality consistency inspections (batch by batch and periodic). GB/T 4588.2-1996 Sectional Specification for Single-Sided and Double-Sided Printed Boards with Metallized Holes GB/T4588.2-1996 Standard download decompression password: www.bzxz.net

National Standard of the People's Republic of China Sectional specification: single and double sided printed boards with plated-through holes GB/T 4588.2-1996 IEC/PQC 90:1990 Substitute GB 4588.2 84
This standard is equivalent to the International Electrotechnical Commission electronic component quality assessment system standard IEC/PQC90 single-sided and double-sided printed boards with metallized holes (1990 edition).
1 Overview
IEC326-5 is the IEC standard for printed boards with single and double metallized holes. The following documents contain this IFC standard and the supplementary standards necessary for printed boards prepared to be assessed according to the European Electrotechnical Standardization Committee (CFAEI.FC) electronic component quality assessment system. These standards are consistent with GB/T16261-~1996 "General Specification for Printed Boards". 1.1 Scope and purpose
This document is a section specification (SS) for single and double metallized holes printed boards. When they are prepared to install components, their manufacturing method does not need to be considered. This specification specifies the performance and test methods evaluated by capability approval tests and quality consistency inspections (batch by batch and periodic). 1.2 Related Documents
1EC68 Special Environment Test Procedures
IEC194 Printed Circuit Terms and Definitions
IEC249 Metal-clad Substrates for Printed Circuits
TEC321 Design and Use Guide for Components for Printed Board Mounting TEC:326-2 Test Methods for Printed Boards
IEC 325-3 Design and Use of Printed Boards
GB/16261—1996 General Specification for Printed Boards
GB/T1588.1-1996 Sectional Specification for Single-Sided and Double-Sided Printed Boards with Plated Holes 2 General
This Section Specification (SS) applies to single-sided and double-sided printed boards with plated holes and is the basis for the development of the following detailed specifications: Capability Detailed Specification (CapDS). It applies to IEC 249-2 Specified materials and capability approval procedures, if necessary, each material should have a CapDS. Capability Detailed Specification (CapTS) can be prepared by international or national organizations or manufacturers. User Detailed Specification (CDS) It is applicable to printed boards produced in accordance with Part 5 of GB/T16261-1996. CDS is usually completed by the user and numbered in his own system. GB/T16261-1996 and Part 1 of CECC00114 specify the details of the steps. Adoption Note: 1 The newly released Part 1 of CECC.00114 replaces Part 1 of the original CECC 001. Approved by the State Administration of Technical Supervision on March 22, 1996, and implemented on October 1, 1996
GA/T 4588.2 1996
Table 1 specifies the basic properties that are generally considered important for single-sided and double-sided printed boards with metallized holes and the appropriate methods to prove these properties. Table 1 specifies the additional properties that may be important for certain single-sided and double-sided printed boards with metallized holes and/or certain applications and the appropriate methods to prove these properties. When necessary, the relevant specifications may refer to the properties and methods from Table I. For tests that require test details to be specified in the relevant specifications, an asterisk is marked in the relevant column, and the provisions of these details should be consistent with IEC 326-2.
Table I specifies the capability test plan. Use the specified comprehensive test pattern (CTP) as a capability identification component. Table I specifies the data for quality assurance testing: These tables specify the test sequence. Unless otherwise specified, the tests may be carried out in any order. 3 Test specimens
3.1 Capability approval
3.1.1 Basic capability
Basic capability tests shall be carried out on the integrated test diagram specified in Chapter 8: 3.1.2 Additional capability
The performance specified in 3.5.3 of GB/T 16261-1996 shall be used. The various arrangements of the integrated test diagram are shown in Chapter 8. 3.1.3 Maintenance of capability approval
The provisions of 3.8 of GB/T 16261-1996 shall be used. 3.2 Quality assurance testing
Unless otherwise specified, remote batch testing and periodic testing may be carried out using product panels and/or specially designed test diagrams. Specially designed test diagrams may be included in the panels. They may be designed based on the appropriate diagrams in the integrated test diagrams in Chapter 8. Agreement between the manufacturer and the user is usually necessary. 4 Relevant specifications
The term "relevant specifications" means the product specifications for a certain actual printed board, that is, the user detailed specifications (CIS) and capability detailed specifications (CapDS) applicable to special materials and technologies. The relevant specifications should include the information necessary to clearly and completely specify the printed board. It is best to follow the provisions in IEC326-3. Be careful to avoid unnecessary provisions, and the allowable deviations should be clearly stated where they are really needed. When it is sufficient to use the unbiased nominal value or the simple maximum value or the simple minimum value, only the unbiased nominal value or the simple maximum value or the simple minimum value should be specified. When only in the dead area or some parts of the printed board, deviations must be made. Only these areas or parts should be specified. If there are several deviation levels, it is best to choose from the levels specified in IEC326-3. In case When there is a discrepancy between the user detailed specification (CIS) and any other relevant specification (such as BS.GS or SS), the user detailed specification (CDS) shall prevail.
5 Printing performance
The basic performance of single-sided and double-sided printed boards with metallized holes is specified in Table 1. The additional performance of single-sided and double-sided printed boards with metallized holes is specified in Table II. General inspection
.Conformity, identification symbols
External and processing quality information
Meanwhile, the defects on the electrical wire
Residues between the conductors
Dimensional inspection
The size of the top
Printed plug part Thickness
IEC.326-2
Test number
Ih or lc
GB/T 4588.2-1996
Table 1 Basic properties
Specified in relevant specifications
Comprehensive test
Additional test graphic selection
Graphics, markings, symbols and material drawings
The coating should comply with relevant specifications and should not have those obvious defects
Be processed carefully according to the best process of Tongchuan
:: The metallized holes should be clean and should not have any defects that may affect the insertion and solderability of the parts. The total volume of voids should exceed 10% of the total area of ​​the hole, the largest dimension in the horizontal plane should not exceed 2% of the hole circumference, and the largest dimension in the vertical plane should not exceed 25% of the plate thickness. The metallized hole should not have electrical voids at the interface between the hole and the conductive foil. This interface extends into the hole and is a certain distance below the sheet surface. This distance is 1% of the total thickness of the sheet metal foil. 5 times
The metallized hole should have no annular cracks
, lines
, or annular separation from the hole
The metallized hole with electroplating cavities should not exceed
5% of the total metallized hole effect
For single-sided effect, when measuring
from the welding surface, it is required that
80% of the length of the hole should beEspecially cracks or breaks, as long as the width of the wire or the reduction of the leakage path between the wires does not exceed the relevant specifications, such as 20% or 35%, then defects such as voids or edge damage are allowed. As long as the reduction of the leakage path between the wires does not exceed 20% of the original design or is not less than the circuit voltage spacing requirement, the existence of residual metal particles is acceptable. t||External color gray compliance and deviation virtual compliance with relevant regulations
: The nominal thickness of the board shall comply with the relevant standards. The total thickness and deviation of the board shall comply with relevant regulations
Where necessary
Apply test method 24:
Avoid dimensional inspection
Where necessary
Apply test method 2,
Rely on dimensional inspection
The total thickness and deviation
shall be in accordance with IEC 321
N1 correction file to mark
slots, gaps[]
wire width
wire spacing
hole and connection plate are not coaxial
hole center position difference
electrical test
interconnection resistance
insulation and delay resistance
pretreatment
measured under standard atmospheric conditions
processed according to 1F)68-2-3
test (a: stable Heat treatment or 1F:68-2-38 test Z/AD Combined temperature/humidity cycle test Measured at high temperature Mechanical properties test Residual strength Measured under standard atmospheric conditions Measured at high temperature Pull-off strength Pull-off strength Test number of IEC326-2 GB/T 4588.21996 Continued Table 1 Comprehensive tests specified in relevant specifications Additional test figures Test bottle Nominal diameter of mounting holes and working holes and IEC 326-3 stipulates that the recommended hole size deviation should comply with the relevant specifications. The tolerance series of metallized holes used for through-hole connection does not need to be precisely measured. The nominal diameter should comply with the relevant specifications. The wire width should comply with the various sizes specified in the relevant specifications. As long as the reduction in wire width does not exceed 20 or 35% of the provisions of the relevant specifications, defects such as hollowing or over-edge wetting are allowed. The length of the defect should not be greater than the wire width S or 5 mm, the smaller of the two shall prevail (see Figure 1). The distance between the tracks shall comply with the relevant specifications. Various sizes of the connecting plates shall not be damaged, and the connection between the connecting plates and the conductors shall not be disconnected. Since there is no obvious deviation in the comparison, the approximate deviation specified in 326-3 can be used. The center of the hole shall be within the deviation range specified in the relevant specifications. Should comply with relevant specifications
Insulation resistance should comply with relevant specifications
Residual strength should comply with relevant specifications
According to relevant current specifications
Measurement environment must be before and after treatment and at high temperature
Insulation resistance should be in accordance with relevant specifications
Non-metallized connection
Pull-out strength
No connection plate Metallized hole
Warp
Other tests
Coating strength|| tt||Tape method
Plating thickness
Printed contact
Solderability
A) When the supplier and the buyer agree to use the non-effective agent, the acceptance condition is changed to the test number of TEC326-2
GB/T4588.2-1996
Continued Table 1
There are American specifications|| Comprehensive test specified in
Additional test figure specimen
During short-circuit operation, the connecting plate should not fall down, and the pull-off strength should not be less than the requirements of the relevant specifications
The pull-out strength should not be less than the requirements of the relevant specifications
The radius of curvature should not be less than the requirements of the relevant specifications
Except for the coating sticking part, there should be no trace of coating sticking on the conductor after the rubber is pulled off from the conductor
The thickness should comply with the requirements of the relevant specifications
The conductor should be smooth. After the polished solder is removed from the coating, scattered defects such as pinholes, non-wetting or semi-wetting areas should not exceed about 5% of the area, and defects should not be concentrated in one area. Solderable: the sample should be wetted within 3 s. When there is a temporary cleaning point on the sample that can maintain wettability, the sample should be wetted within 4 s. Semi-solderable: after the sample is kept in contact with the molten material for 5 to 6 s, there should be no semi-wetting phenomenon. Solderable: the sample should be wetted within 4 s. Semi-solderable: the sample should be in contact with the molten material for 5 to 6 s. 5. There should be no half-river phenomenon. For flat and solderable holes (applicable), it should meet the requirements of good soldering holes in Figure 3. There should be a temporary floating layer on the board that has or secretes protective solderability: According to 6.6.1 of IEC68-2-20. Specified
Inactive flux
Replacement
Determine appropriate conditions
Active flux (0.2%)
According to the provisions of
6.2.2 in EC68-2-20
Solvent resistance and flux
Note: *See Chapter 2.
Dimensional inspection
Graphic and hole relative reference
Reference groove position
Electrical test
IEC326-2
Test
GB/T 4588.2-1996
Continuation table "
Comprehensive test questions specified in relevant specifications
Shape test pattern specimen
Solderable: Test mixture is wetted within 3
Semi-solderable: The specimen maintains
contact with the molten solder for 5--6 There should be no semi-wetting phenomenon after s. Requirements for good solder holes in semi-solderable and solderable holes (suitable for use) There should be no following phenomena: delamination or stratification; irregularity due to layer or printing material falling off! Explanation: obvious discoloration Acceptable: a. Bad mark: h. Marking weakened but still recognizable. Rejected: a. Mark cannot be recognized or disappears; b. Recognition mark is in doubt, similar to the word may be wrong,: RPB.EF I CGO
Table additional performance (only for evaluation when specifically required) related specifications
Comprehensive test
TEC 326-2: The test number and test details of the additional graphic test column specified in the detailed specification shall comply with the details specified in the relevant specifications. The applicable method shall be specified in the layout specification. This is usually not measured. The most important function is the relationship between the graphic and the hole, which controls the minimum diameter of the connecting plate. When special requirements are required, the provisions of IEC:326-3 shall be used. The resistance variation of the metallized hole is the withstand current of the metallized hole. The withstand current of the conductor library is the withstand voltage. Frequency drift treatment: according to IFX 68 2 3
TestCa:State damp heat test
Other tests
Coating adhesion
Porosity
Air level exposure test
Electrical conductivity
|Tweezers density (part other than the push head)
Note: → Test number of Chapter 2
6 Capacity test plan
IEC326-2
IEC standard
326-2A
s
GB/T 4588.2-1996
Continued
Specifications ... Overheating
The conductor shall not be burned, and there shall be no discoloration
There shall be no spark discharge
The mass transfer rate shall not exceed the limit specified in the relevant specifications
The symptoms of blistering or shedding of the coating shall comply with the relevant specifications
The thickness shall comply with the relevant specifications
The performance and requirements to be identified in the capability test are shown in Table I and Table 1 in Chapter 5. Remarks
Additional capability tons are in accordance with the provisions of 3.5.3 of GB/T16261-1996, and the multiple arrangement of the test pattern (CTP), specimen and test pattern in Chapter 8 and Figure 2
Identification symbols
Add! Quality
Metalized hole
Wire defect
Residual exposure between wires
Dimension inspection
Board size
Printed drag head position
Wire width
Wire spacing
Differential axis
Hole and land
Electrical test
Resistance change of metalized hole
Insulation resistance||tt ||Chaore Institute
Mechanical test
Peel strength
Pull-off strength
Non-plated hole connection pad
Pull-out strength
Especially connected pad metalized hole
Other tests
Coating adhesion
Coating thickness
Printed contact
Solderability
Test number
GB/T 4588.2—1996bZxz.net
Capacity test plan
Allowable number of failures
Before cutting
Basic capacity test specimens
Number and specimen pattern
19 complete
Before cutting9 complete
! Test bar K
9 test rubs4
9 test specimens F
9 test specimens A
: 6 test specimens D
3 test specimens E
13 test specimens G
3 test specimens selected
3 Sample B
3 tests
3 tests
For the processing ability
Large overall size
Large thickness to aperture ratio
Small thickness
"Maximum distance
At high temperature
At high temperature
Acceptance state, 0.2%
Calcium flux
Acceptance state, inactive flux
After accelerated aging, inactive flux
After accelerated aging.0.2% active
GB/T 4588-2--1996
Continued Table 1
Test number
Number of failures
The total number of failures allowed for all tests is 3.
7 Quality conformity inspection
Basic capability test partners
Number and sample pattern
9 samples 1
9 samples A
The performance and requirements of quality conformity inspection are shown in Table 1 and Table 2 of Chapter 5. The division of inspection groups is shown in Section 4 and 3 of GB/T 16261:1996. The composition of the inspection batch of printed boards is shown in Section 1.1 of GB/T 16261-1996. The inspection batch of small batches and/or expensive printed boards is shown in Section 4.2 of GB/T 16261-1996.
Assessment levels are shown in Table N.
Assessment level B & any intermediate level between level A and level C are formed as shown in 5.2.5 of GB/T 16261-1996. Higher assessment level D can be formed by using assessment level C and specifying additional tests or stricter IL/AQL, see 5.2.5 of GB/T 16261-1996.
Inspection matrix
AI group direct inspection
Manufacturing quality
Metalized hole
Line search defect
Residue between conductors
A2 distance! Dimension inspection
Outside board dimensions
Push, mouth
Wire integrity
Wire spacing
Normality
Hole and plate
Hole position deviation
A3 Red risk test spare group
Included to
H group dimensional interchangeability
B! Printed plug sequence
B2 group Solderability
B3 group Thermal shock
Unsuitable
Mechanical test
Peel strength
Normal test conditions
Pull-off strength
Metalized hole connection pad
Optical connection pad Metalized hole
[R6 Group coating test
Coating adhesion
Coating thickness
Contact strip
Additional test group
GB/T 4588. 2-1996
Table Assessment level
Level A
14a5-2
Formed according to 6.2.5 of G3/T 16261-1996
Results of Groups A2 and A3
Results of Group A2
Formed according to 5.2.5 of GB/T 16261: 1956
$-2 1 2.5
Formed according to 5.2. Formation of the results of A2 and A3 groups according to 5.2.5 of GR/T 16261-1996 Formation of inspection groups including porcelain materials C1 Group Test once every 3 months Insulation resistance Before and after mixed heat test Resistance to solvents and coal loading Change in metallization resistance Test once every 12 months (no result) C3 Red negative plus time interval group including RCE application data 8 Test pattern Test board GR/T 4588.2 -1996
Continued Table N
Level A
Results from group B2
Results from groups B1, B2, B4, B5, B6
Results from 5.2.5 of CB/T 162611996
Level C
Results from group RI, P2.
Results from group C1, from groups C1, C2, C3, from groups CI
Figure 1 Defect length
The pattern used for the test is the test pattern. The test pattern can be:
Part of the conductive pattern on the product board (used when using a printed board) is a special test pattern specially designed and prepared only for the test day. The test pattern can be arranged on the following boards: Results of B
Results obtained from BI, 132, B4, R1, B36
According to 5.2.5 of G3/T16261-[996
Shape should be
from C1, C2,C3 group chicken knot resistance
Attached test board (printed board or part of a printed board, usually before the printed board is used (see "EC 194 05-03): .-... separate test pole (see 1EC 194 05-02) 8.1 Application of test patterns and test boards
8.1.1 Capability approval test
GB/T 4588.21996
Basic capability shall be tested with the comprehensive test pattern specified in 8.2. When the manufacturer considers that the size of the board (effective area) is larger than the size of a comprehensive test pattern test board (160mm×m), the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T162611996.
8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. For the use of special test patterns, whether it is a part of the comprehensive test pattern shown in 8.2 or a special design, it should also be provided to the demanding party. 8-1.3 Product testing
When testing product boards, the manufacturer may arbitrarily use the test pattern (guide pattern on the product board) 8.2 Combined Test Pattern (CTP)
When selecting the capacity, the combined test pattern (CTP) should be used. See 3.5 of GB/T16261-1996. The following tests can be carried out using a single combined test pattern (see Figure 2): Test
Solderability of metallized holes
Pull-out strength of metallized holes without connection pads
Thickness of printed header plating
Change of resistance of metallized holes
Insulation resistance
Conductor accuracy
Fogging intensity
Solderability of guide surface
Clearance strength
Non-metallized hole connection station
International hole diameter
Nominal connection pad H diameter
Note: Medical 2a The CTP (positive and negative) patterns A, E, F, G, UI, J and K are equivalent to the comprehensive test pattern in Figure 2 of GB/T 4588.11996. 8.3 Multiple arrangements of comprehensive test patterns (CTP) When a manufacturer claims that the size (effective area) of its board is larger than the size of a single comprehensive test pattern (160 iu × 90 n) and hopes to use comprehensive test patterns to prove its attachment ability, it can use appropriate comprehensive test pattern arrangement. When arranging, each corner of the effective area of ​​the pole has a comprehensive test pattern. The area occupied by each comprehensive test pattern is allowed to be less than the size of a comprehensive test pattern. Examples of multiple arrangements are shown in Figure 2℃.
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