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Mechanical Industry Standard of the People's Republic of China
JB/T 6173-1992
Water-soluble organic soldering flux
Published on May 15, 1992
Implementation by the Ministry of Machinery and Electronics Industry of the People's Republic of China on January 1, 1993
Mechanical Industry Standard of the People's Republic of China
Water-soluble organic soldering flux
JB/T6173-1992
This standard specifies the main technical requirements, test methods, inspection rules and marking, packaging, transportation and storage of water-soluble organic soldering flux. This standard applies to water-soluble organic soldering flux (hereinafter referred to as soldering flux) used for automatic and manual soldering of electronic components on printed circuit boards.
Cited standards
GB2828
GB2829
GB 191
SY2000
3 Technical requirements
3.1 Color and state
Count sampling procedure and sampling table for batch inspection (applicable to inspection of continuous batches)Count sampling procedure and sampling table for periodic inspection (applicable to inspection of stability of production process)Basic environmental testing procedures for electric and electronic productsTest Ca: Steady-state damp heat test methodBasic environmental testing procedures for electric and electronic productsGeneral method for density determination of chemical reagents
Picture mark for packaging, storage and transportation
Guide for damp heat test
Rules for acceptance of packaging, storage, transportation and delivery of petroleum productsSolder flux is a colorless or light-colored liquid without sediment. 3.2 Specific gravity
The specific gravity of the flux with water as solvent for manual welding is: 1.04±0.06g/cm33.2.1
The specific gravity of the flux with isopropyl alcohol as solvent for automatic welding is: 0.90±0.05g/cm3. 3.3 pH
The pH value of the flux is: 1.0~4.0. 3.4 Expansion rate
The expansion rate>90%.
3.5 Copper plate corrosion test
The sample after the copper plate corrosion test has no corrosion phenomenon. 3.6 Insulation resistance
The insulation resistance of the printed circuit board after flux soldering is>1×10\9 after cleaning and air drying.4 Test method
4.1 Color
Approved by the Ministry of Machinery and Electronics Industry on May 15, 1992 and implemented on January 1, 1993
Visual inspection with standard color card
4.2 Specific gravity
Specific gravity is determined in accordance with the provisions of GB611.
JB/T6173-1992
Specific gravity of solder flux for manual soldering is determined by the specific gravity bottle method. The solder flux for automatic soldering is determined by a specific gravity meter, and the specific gravity balance method is used as an arbitration means. 4.3 Acidity
Tested with a pH meter.
4.4 Expansion rate
The sample liquid used is water-soluble organic solder flux, and the test piece is a thin copper sheet of 0.3mmx30mmx30mm. The test method is shown in Appendix A. 4.5 Copper plate corrosion test
This method is suitable for the determination of solder flux corrosion. The preparation and test method of the test piece are shown in Appendix B. 4.6 Insulation resistance
The insulation resistance includes the surface resistance of the printed circuit board. It is measured under the conditions of relative humidity of 73%~77% and ambient temperature of 15~35℃. Test piece: During the test, a GE-4 copper foil plate with glass cloth as the substrate is made into a comb-shaped electrode plate as shown in Figure 1. A layer of solder flux with uniform thickness is applied on the test piece by dipping method, and then the comb-shaped electrode surface of the test piece is tinned. Then the test piece is washed with water and air-dried. The insulation resistance R is measured by applying a DC voltage of 500V for not less than 3min using an insulation resistance tester. 50
Conductor line width: 0.0635mm
Gap between conductors: 1.27mm
Shuttle electrode
5 Inspection rules
5.1 Inspection classification
Products must pass the following inspections:
a. Type inspection (routine inspection):
b. Factory inspection (delivery inspection).
5.2 Type inspection (routine inspection)
(1) Electrode A (2) Electrode B
Products must pass the final inspection of the technical supervision department when they are designed and finalized. For batch-produced products, each batch must be inspected, and for continuously produced products, routine inspections must be carried out at least once a year. Routine inspections must also be carried out when the formula and main process are changed. Routine inspections are carried out by the quality inspection department. 2
JB/T6173-1992
5.2.1 The items of type inspection (routine inspection) shall be inspected in accordance with the items specified in Articles 3.1 to 3.6 of this standard. 5.2.2 Sampling method Sampling shall be carried out in accordance with the sampling standard of GB2829. 5.2.3 Judgment method: During the inspection, if Article 3.4 or Article 3.5 fails, the inspection shall be stopped, and the test of the item shall be repeated after the cause is found, the fault is eliminated and a fault analysis report is submitted. If a fault occurs again during the test, the type inspection (routine inspection) shall be repeated after the cause is found, the fault is eliminated and a fault analysis report is submitted. 5.2.4 After the type inspection (routine inspection) is completed, a type inspection (routine inspection) report shall be submitted. 5.3 Factory inspection (delivery inspection)
Factory inspection (delivery inspection) shall be carried out by the quality inspection department. 5.3.1 Factory inspection (delivery inspection) items include: 3.1, 3.2, 3.3. 5.3.2 Sampling method Sampling shall be carried out in accordance with the sampling standard of GB2828. 5.3.3 Judgment method: If one item fails during the inspection, the inspection shall be stopped, and the cause of the failure shall be found and eliminated. If the failure occurs again during the inspection, the product shall be judged as a defective product. 6 Marking, packaging, transportation and storage
6.1 Marking
6.1.1 The plastic container used for packaging shall be firmly and clearly affixed with a mark indicating the product model, name, manufacturer, manufacturing date and storage period.
6.1.2 The packaging box shall have the following marks: product name, model, gross weight, net weight, box size. In accordance with the provisions of GB191, non-fading storage and transportation instructions shall be marked in obvious places on the packaging box, such as "No fireworks", "Handle with care", "Upward" and other marks. 6.2 Packaging
6.2.1 Put the soldering flux into a plastic container, tighten the container cover firmly to prevent leakage, and then put it into the packaging box. 6.2.2 The packaging box must be firm and closed, and fastened with strapping. 6.2.3 The packaging box should be accompanied by: product certificate, instruction manual, etc. 6.2.4 The packaging of soldering flux using isopropyl alcohol as solvent should comply with the relevant provisions of SY2000. 6.3 Transportation
6.3.1 Applicable to land, water and air transportation. 6.3.2 Avoid falling during transportation and keep away from fire. The transportation of soldering flux using isopropyl alcohol as solvent should comply with the relevant provisions of SY2000.
6.4 Storage
The soldering flux should be stored in a dry, ventilated warehouse with an ambient temperature of -10℃~+40℃. Fireworks are strictly prohibited around the warehouse. 3
A1 Work content
This test is applicable to the determination of flux expansion rate. A2 Preparation of sample solution and test piece
A2.1 Sample solution
The sample solution is a water-soluble organic flux.
A2.2 Test piece
JB/T 6173—1992
Appendix A
Determination method of expansion rate
(Supplement)
The test piece is a 0.3mmx30mmx30mm copper sheet. After grinding the surface with 00 fine sandpaper, the surface is cleaned with xylene and ethanol in turn, and then air-dried in air.
The air-dried test piece is placed in an oven at 150℃ and heated for 1h for oxidation treatment. The test piece is taken out and placed at room temperature, and then it can be used as a test piece for determining the expansion rate.
A2.3 Solder
Use HISnPb39Φ1mm welding wire (specific gravity 8.5) as solder, roll the welding wire on a Φ3mm stainless steel rod, cut it with a blade to form a welding wire ring with an inner diameter of 3mm, and weigh it on an analytical balance. Determination method
Install the instrument according to the determination device diagram (see Figure A1), heat the metal bath in the tin pot to 250℃ and control the measurement at this temperature.
Put a welding wire ring of known weight in the center of the test piece, apply a thin layer of silicone oil on the bottom of the test piece, fold a corner of the test piece with pliers to facilitate clamping the test piece, and drop 1~2 drops of flux sample liquid (about 0.05g) in the center of the ring, place the test piece on the surface of the 250℃ tin pot, take it out carefully after 30s and place it on a flat surface, let it cool, and then use ethanol to clean the residue (note that there should be no metal in the metal bath on the bottom of the test piece), use the internal micrometer to measure the height of the expanded solder, and calculate the expansion rate according to formula (A1): Expansion rate (%) = —
Where: H is the height of the expanded solder, mm; D is the diameter of the test solder when converted into a sphere, mm; W is the weight of the solder wire ring, g:
Specific gravity of solder, (here it is 8.5).
JB/T 6173-1992
Flaine ring
Mohr's type
Water immersion meter
Thermometer
Figure A1 Diagram of measuring device
Thermostat
B1 Work content
This test is applicable to the corrosiveness determination of solder flux. B2 Preparation of test piece
JB/T6173-1992
Appendix B
Copper plate corrosion test
(Supplement)
After grinding the surface of four copper pieces with a size of 0.3mmx30mmx30mm with 00# fine sandpaper, put them in xylene organic solvent to remove the oxide film, then use ethanol to wash off the surface contamination, and then place them in the air to make them fully dry. Use three pieces to do the following test, and keep one piece in the desiccator as a control. B3 Test method
Drop 3 drops of solder flux on each of the three cleaned and air-dried test pieces, place them in a metal bath at 260℃, heat for 5s, then take them out and let them cool to room temperature.Www.bzxZ.net
Temperature-controlled oven
Drying four
10% glycerol aqueous solution
After washing with water (40~60℃) or 95% ethanol, the three test pieces made as above are placed on a bracket in a desiccator filled with 10% glycerol aqueous solution, and placed in an oven at 40±2℃ (relative humidity 98%) for 72 hours, then take them out and compare them with the comparison test piece to observe whether there is corrosion (see Figure B1). Additional remarks:
This standard was proposed and managed by the Shenyang Instrument and Meter Technology Research Institute of the Ministry of Machinery and Electronics Industry. This standard was drafted by the Shenyang Instrument and Meter Technology Research Institute of the Ministry of Machinery and Electronics Industry. Drafters of this standard: Ma Tiancheng, Zhao Shiwei, Xie Minggui, Xu Xiaojuan. 6
People's Republic of China!
Mechanical Industry Standard
Water-soluble Organic Soldering Flux
JB/T 61731992
Published and issued by the China Academy of Mechanical Science
Printed by the China Academy of Mechanical Science
(No. 2 Shouti South Road, Beijing
Postal Code 100044)
Format 880×1230
Word Count 12,000
Sheet 5/8
First Edition in May 1992 First Printing in May 1992 Printing Quantity 00,001-500
Price 5.00 Yuan
Mechanical Industry Standard Service Network: http://www.JB.ac.cn66_9
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