title>GB/T 4723-1992 Copper-clad phenolic paper laminate for printed circuits - GB/T 4723-1992 - Chinese standardNet - bzxz.net
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GB/T 4723-1992 Copper-clad phenolic paper laminate for printed circuits

Basic Information

Standard ID: GB/T 4723-1992

Standard Name: Copper-clad phenolic paper laminate for printed circuits

Chinese Name: 印制电路用覆铜箔酚醛纸层压板

Standard category:National Standard (GB)

state:in force

Date of Release1992-07-08

Date of Implementation:1993-04-01

standard classification number

Standard ICS number:Electronics >> 31.180 Printed circuits and printed circuit boards

Standard Classification Number:Electronic Components & Information Technology>>Electronic Components>>L30 Printed Circuit Board

associated standards

alternative situation:GB 4723-1984

Procurement status:≈IEC 249-2-85

Publication information

other information

Release date:1984-10-20

Review date:2004-10-14

Drafting unit:Guangzhou Electrical Equipment Research Institute

Focal point unit:National Technical Committee for Printed Circuit Standardization

Publishing department:Ministry of Information Industry (Electronics)

competent authority:Ministry of Information Industry (Electronics)

Introduction to standards:

GB/T 4723-1992 Copper-clad phenolic paper laminate for printed circuits GB/T4723-1992 Standard download decompression password: www.bzxz.net

Some standard content:

National Standard of the People's Republic of China
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB 4723-92
Replaces GB4723--84
This standard refers to and adopts the specifications of the corresponding models in the International Electrotechnical Commission standard IEC249-2 "Metal foil substrates for printed circuits (1985-1988 edition)". Subject content and scope of application
This standard specifies the electrical, mechanical and other performance requirements of copper-clad phenolic paper laminated sheets for printed circuits. Part 2: Specifications
This standard applies to copper-clad laminated sheets made of cellulose paper impregnated with phenolic resin, one or both sides covered with copper foil, and hot-pressed (hereinafter referred to as clad sheets).
Referenced standards
GB/T4721 General rules for copper-clad laminates for printed circuits GB/T4722 Test methods for copper-clad laminates for printed circuits GB5230 Electrolytic steel foil
3 Product classification
3.1 Models and characteristics
The models and characteristics of the foil-clad laminates included in this standard are shown in Table 1. Table 1
CPFCP-01
CPFCP-02
CPFCP-03
CPFCP-04
CPFCP-05F
CPFCP-06F
CPFCP-07F
CPFCP-08F
CPFCP-09F
CPFCP-10F
High electrical performance, hot punching
High electrical performance, cold punching
General electrical performance, economic type, hot punchingGeneral electrical performance, economic type, cold punching
High electrical performance, flame retardant, hot punching
High electrical performance, flame retardant, cold Punching performance
Medium electrical performance, flame retardancy, hot punching performance
Medium electrical performance, flame retardancy, cold punching performance
General electrical performance, economic type, flame retardancy, hot punching performanceGeneral electrical performance, economic type, flame retardancy, cold punching performance
Note: CPFCP-01 and CPFCP-02 correspond to IEC-249-2-1; CPFCP-03 and CPFCP-04 correspond to IEC-249-2-2: CPFCP-05F and CPFCP-06F correspond to IEC-249-2-6-FH (but with FV grade flame retardancy) CPFCP-07F and CPFCP-08F correspond to IEC-249-2-7-FV Type; CPFCP-09F type and CPFCP-10F type correspond to IEC-249-2-14-FV type. Approved by the State Administration of Technical Supervision on July 8, 1992 and implemented on April 1, 1993
3.2 Materials and Structure
GB 4723-92
Foil-clad laminates are composed of an insulating substrate with copper foil on one or both sides. 3.2.1 Insulating substrate
Electrical insulating paper laminates with phenolic resin as a binder and cellulose paper as a reinforcing material. 3.2.2 Copper foil
The technical requirements for electrolytic copper foil used for foil-clad laminates shall comply with the provisions of GB5230. 3.3 Product marking
The product marking shall comply with the provisions of Article 11.1 of GB/T4721. Technical requirements
4.1 Electrical properties of foil-clad boards
Foil-clad boards shall have the electrical properties listed in Table 2. 364
GB4723-92
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4.2 Non-electrical properties of foil-clad boards
4.2.1 Appearance
4.2.1.1 Conventional surface appearance
GB 4723--92
The end faces of foil-clad boards shall be neat and free of delamination and cracks; the foil-clad surface shall not have bubbles, wrinkles, pinholes, deep scratches, pits and glue spots that affect its use, and any discoloration or dirt shall be easily wiped off with a hydrochloric acid solution with a density of 1.02g/cm3 or a suitable organic solvent; the laminated surface shall not have defects such as bubbles, pressure pits, lack of glue and foreign impurities that affect its use. c.
4.2.1.2 High-quality surface appearance (optional) If the purchaser has requirements for the high-quality surface appearance of the foil-clad laminate, the supply and demand parties can negotiate. Add this item, and its requirements shall comply with the provisions of Article 6.2 of GB/T4721.
4.2.2 Size
4.2.2.1 The recommended nominal area and deviation of the foil-clad laminate shall comply with the provisions of Table 3. Table 3
Recommended nominal area (×b)
1 000×1 000
1200×1000
Note: If it is different from the recommended nominal area, it can be negotiated by the supply and demand parties. 4.2.2.2 Thickness
The nominal thickness and single-point deviation of the foil-clad laminate shall be tested in accordance with Chapter 23 of GB/T4722, and its value shall comply with the provisions of Table 4. Table 4
Nominal thickness
Single point deviation
Nominal thickness
Note: ①Non-nominal thickness can be manufactured by negotiation between the supply and demand parties, and its deviation shall be implemented according to the larger nominal thickness value. ②07F.08F.09F, 10F do not have 6.4mm specifications. 4.2.3VerticalitybzxZ.net
Verticality of foil clad laminate shall be tested in accordance with Chapter 24 of GB/T4722, and its value shall comply with the provisions of Table 5. Table 5
1000×1000
1200×1000
4.2.4Warp
Verticality
Single point deviation
The bow and twist values ​​of foil clad laminate shall be tested in accordance with Chapter 14 of GB 4722. When the clad box board is converted to L=1000mm, the values ​​of d and d shall not exceed the provisions of Table 6.
Nominal thickness
0.8 to 1.2
Above 1.2 to 1.6
Above 1.6 to 3.2
Above 3.2 to 6.41
≤35μm
GB4723-92
Bow d
Single-sided foil-clad board
>35μm
Double-sided box-clad board
≤70μm
Twist d
Single-sided or double-sided box-clad board
≤70 μm
Note: ①The requirements for maximum bow and twist are only applicable to the board size shipped from the manufacturer or the board length and width after cutting are not less than 460mm. ②This table is only applicable to the nominal thickness of the steel foil not more than 70um. 1) 07F, 08F, 09F, 10F have no bow or twist value of 3.2mm to 6.4mm. 4.2.5 Other non-electrical properties
The cover board shall meet the other non-electrical properties listed in Table 7. 4.3 Non-electrical properties of the insulating substrate after all copper foil is removed 4.3.1 The insulating substrate is not allowed to have pitting, holes, lack of glue, white spots, looseness and foreign impurities (including cured resin particles) that affect use. The color is uniform and consistent, and a small amount of irregular color changes are allowed. 4.3.2 After all copper foil is removed from the cover board according to the provisions of Chapter 3 of GB/T4722, the performance of the insulating substrate shall meet the provisions of Table 8. 367
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Inspection rules
GB4723-92
Inspection rules shall comply with the provisions of Chapter 10 of GB/T4721. Marking, packaging, transportation and storage
Marking, packaging, transportation and storage shall comply with the provisions of Chapter 11 of GB/T4721. Additional remarks:
This standard was proposed by the Ministry of Machinery and Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry. This standard was drafted by the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry. The main drafter of this standard revision is Lin Zhenru. 370
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