Some standard content:
Standard of the Ministry of Electronic Industry of the People's Republic of China Resin core solder wire for electronic industry
SJ2659-86
This standard applies to resin core solder wire manufactured by pressure processing method for circuit welding of electronic, electrical equipment and instruments.
1 Classification
1.1 Classification Resin core solder wire is divided into two categories: active and inactive solder wire. The code is as follows: H—inactive resin core solder wire,
HH—active resin core solder wire.
“H” is the first letter of the Chinese pinyin of “活” (live) and “焊” (weld). “HH” is composed of the first letters of the Chinese pinyin of “活” (live) and “焊” (weld). 1.2 The brand name of resin core solder wire is as follows: HH (H) Sn60—-1-I
Flux quality grade code
(see 2.6)
Flux content symbol code (see 1.4)
Tin element symbol and its content (see 1.3)
Active resin core solder wire (inactive resin core solder wire) 1.3
Tin content shall comply with the provisions of Table 1.
Table 1 Solder alloy composition
Main component, %
62.5~63.5Residue 02~0.5
61.5~62.5Residue 0.2~0.51.75~2.250.2559.5~61.5Residue 0.2~0.5
54.5~56.5Residue 0.2~0.5
49.5~51.5Residue 0.2~0.5
44.5~46.5 Residue 0.2~0.5
39.5~41. Residue 0.2~0.5
Impurities,% impurities
0.0030.0050.030.08
0.0050.030.08
0,0020.0050.030.08
0.0050.030.08
Note: ①Sn60 and Sn50 solders can be supplied without antimony components after consultation between the supply and demand parties. According to the needs, the manufacturer can supply solid solder with antimony content. Ministry of Electronics Industry 1986-01-21 issued
0.02,0.002
0.0050.030.08
0.005.0.030.08
0.020.0020.0050.030.08bzxz.net
Melting temperature
Fan Guo ℃
1986-10-01 implementation
SJ2659-86
1.4 The flux content and its symbol code shall comply with the provisions of Table 2. 2 Flux content and symbol code
Bonus code
Flux content maximum%
1.5 The outer diameter size and allowable deviation of resin core solder wire shall comply with the provisions of Table 3. Table 3 External dimensions and allowable deviations of solder wire
Nominal external diameter
Note: Special specifications can be negotiated between the supply and demand parties. mm
Charge new difference
1.6 The mark consists of three parts: brand, wire diameter and standard number. Example: The active resin core solder wire with brand name HSn60-1-I, wire diameter of 2mm and standard number SJ2659-86 is represented as:
HHSn60-1-12S
2 Technical requirements
2.1 Appearance quality The surface of the resin core solder wire should be smooth, clean, and should not have cracks, oil stains and inclusions. The color of the cross-section flux should be the same as the color of the raw material of the flux used. 2.2 Size The external diameter dimensions and deviations of the resin core solder wire should comply with the provisions of Table 3. 2.3 Uniformity and continuity of the resin core The resin core inside the resin core solder wire should be uniform and continuous, and there should be no empty breaks. The quality index of the open defect should be less than 1.5%.
2.4 Solder The alloy composition of solder should meet the requirements of Table 1. 2.5 Flux The rosin in the resin core flux should meet the requirements of LY204-63 medium or first grade, and the activated substance added to the flux should be not less than chemical purity.
2.6 The main properties of the resin core solder wire should meet the requirements of Table 4. 3 Test method
3.1 Appearance quality According to the requirements of 2.1, the surface of the resin core solder wire shall be comprehensively inspected by naked eye on the specified single copper mirror or copper plate of each axis (roll) sample taken out, acid value, KOHmg/g
water-soluble conductivity, us/cm
total nitrogen content, %
steel corrosion
flux content, %
dryness
insulation resistance, Q
extension, %
position length.
SJ2659-86
Table 4 Main performance indicators
The copper film under the flux should not disappear
There should be no obvious change between the sample and the control sample as specified in Table 2
Chalk powder should be easily removed
>1×10″
3.2 Outer diameter size According to the requirements of 2.1, the outer diameter of the resin core solder wire is measured with a lower scale with a graduation value of 0.01mm. On the sample that has been inspected for appearance, at 5mm from both ends of the sample and the center of the sample, the outer diameter data of the three parts are measured at the cross-section in directions perpendicular to each other, and the average value is taken. 3.3 Uniformity and continuity of the resin core, according to the requirements of 2.3, a 60cm long resin core solder is cut from each axis (roll) sample unit drawn according to the specified number. Cut the solder wire into 6 sections with a length of about 10 cm, and observe the uniformity of the resin core in the cross section with the naked eye. Use scissors to cut the solder wire longitudinally to observe the continuity of the resin core. 3.4: The solder composition is in accordance with the requirements of 2.4. When the supply and demand parties have objections to the composition of the tin-lead solder alloy, arbitration can be conducted by a unit agreed upon by both parties.
3.5 The corrosion test of copper mirror or copper-plated plate shall be carried out in accordance with 3.10.1 of SJ2660-86 (Test method for resin-based flux for soft soldering).
3.6 The acid value test of the flux shall be carried out in accordance with 3.12.1 of SJ2660-86. 3.7 The conductivity test of water-soluble substances shall be carried out in accordance with 3.13 of SJ2660-86. 3.8 The fluorine content test of the flux shall be carried out in accordance with 3.11 of SJ2660-86. Copper plate corrosion The corrosion test shall be carried out in accordance with the provisions of 3.10.2 of SJ2660-86. 3.9
3.10 Flux content test
SJ2659-86
Weigh about 30.000g (m,) of resin core solder wire with a clean surface into a beaker, add 100ml of propylene glycol, heat to melt the solder wire, and after the flux is completely removed from the solder wire, cool it to solidify. Then take the solidified solder. First wash it with water, then wash it with ethanol, weigh it after drying (m), and calculate it according to the following formula: Flux content (the solder can be used for analysis of solder composition in 3.4); Flux content %=1==×100%
Where: ml-mass of resin core solder wire, g, m2-mass of solder after drying, g.
3.11 Dryness test Test
Wash the surface of the 0.3×30×30mmT copper plate with ethanol, dry it, and place 0.3g of resin core solder wire. Heat it to melt at a temperature 40-50℃ higher than the melting temperature of the solder (the highest temperature does not exceed 270℃), take it out after 5s, place the sample at room temperature for 30min, and sprinkle chalk powder on the surface of the residual flux part of the sample, and then check whether the powder can be removed by gently brushing with a soft brush.
3.12 The insulation resistance test shall be carried out in accordance with 3.14 of SJ2660-86. 3.13 The extended test shall be carried out in accordance with 3.9 of SJ2660-86. 4 Acceptance rules
4.1 The resin core solder wire must be inspected and qualified by the supplier's technical inspection department in accordance with the provisions of this standard before it can be shipped. The acceptance of products is divided into delivery test and routine test. All tests should be carried out at the manufacturer. 4.2 The ordering party has the right to inspect the product in accordance with the provisions of this standard. If the inspection result does not meet the requirements of the product standard, it must be reported to the manufacturer within two months from the date of receipt of the product, and the two parties shall negotiate to resolve the problem. 4.3 In order to implement the needs of sampling inspection, the resin core solder wire submitted for inspection in rolls (rolls) shall be divided into units of products per roll (roll). After removing the 0.5m at the beginning, 10m of solder wire shall be measured as the sample unit. The inspection of various properties shall be sampled within this length. 4.4 The delivery test inspection procedure and sampling plan shall be carried out in accordance with the secondary normal inspection sampling plan in GB2828-81 "Batch inspection counting sampling procedure and sampling table (applicable to continuous batch inspection)". Specific test items, inspection level and qualified quality level are specified in Table 5.
Test sequence
Inspection items
Appearance quality
External dimensions and allowable deviation
Uniformity and continuity of resin core
Material composition
Maximum flux
Acid value of flux
Natural weight of flux
Acceptance test items and requirements
Qualified quality
Maximum water content
Per furnace
(batch)
SJ2659-86
4.5 If one item of the acceptance test is unqualified, the whole batch is unqualified. The manufacturer may conduct 100% inspection on the unqualified items and accept the qualified parts separately.
4.6 The routine test items of resin core solder wire are carried out every quarter or half a year, and the periodic inspection is carried out according to the secondary sampling plan in GB2829-81 "Periodic Inspection Counting Sampling Procedure and Sampling Table (Applicable to the Inspection of Production Process Stability)". Routine test samples should be randomly sampled from products that have passed the delivery test within the period. The specific inspection items, discrimination level and unqualified quality level are specified in Table 6.
Age inspection items
Dryness
Expansion rate
Magic touch of copper plate
Corrosion touch of copper mirror or copper-plated plate
Electrical conductivity of water-soluble matter in solder
Insulation resistance of solder
Technical requirements
Requirements
Routine test items and requirements
Acidification method
Method clauses
Unqualified quality
Water quality
4.7 If the routine test fails in this cycle, the products in the cycle will be stopped from being delivered, and the two parties will negotiate to solve the problem. For the products delivered in this cycle, the supplier shall find out the reasons and take immediate measures in production until the routine test is qualified, and the delivery can be resumed.
5 Marking, packaging, transportation and storage
5.1 Resin core solder wire should be wound on plastic or iron bobbins, and the weight is divided into 0.5Kg and 1Kg. Each shaft (roll) should be marked with:
. Brand,
c. Net weight,
d. Production date and manufacturer name.
5.2 The shaft (roll) of resin core solder wire should be packed in wooden boxes or other sturdy boxes. The net weight of each box shall not exceed 25Kg. It should be marked with:
a. Manufacturer name
d. Production brand number and specifications,
c. Batch number.
5.3 Products packed in packaging boxes can be transported by any method. During transportation and storage, they should be protected from damage, moisture and chemical corrosion.
Additional remarks:
This standard was proposed by the Technical Department of the Ministry of Electronics Industry. This standard is under the responsibility of the Standardization Institute of the Ministry of Electronics Industry and Factory 761, and was drafted by Comrades Huang Daqi, Zhao Changchun, Tang Shanyu and Comrade Fengxiang of Suzhou TV Factory. 5
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