This specification specifies the technical requirements and inspection rules for lead frames of plastic quad flat packages for semiconductor integrated circuits. This specification applies to stamped lead frames of plastic quad flat packages (PQFP) for semiconductor integrated circuits. GB/T 15876-1995 Specification for lead frames of plastic quad flat packages GB/T15876-1995 Standard download decompression password: www.bzxz.net

National Standard of the People's Republic of China
Specification of leadframes for plastic quad flat package 1 Subject content and scope of application
GB/T15876—1995
1.1 This specification specifies the technical requirements and inspection rules for leadframes for plastic quad flat packages of semiconductor integrated circuits (hereinafter referred to as leadframes).
1.2 This specification applies to stamped leadframes for plastic quad flat packages (PQFP) of semiconductor integrated circuits. Etched leadframes for plastic quad flat packages can also be used for reference. 2 Reference standards
GB7092-93 Dimensions of semiconductor integrated circuits GB/T14112-93 Specifications for stamped lead frames for plastic dual-row packages for semiconductor integrated circuits GB/T14113-93 Terminology for semiconductor integrated circuit packaging SJ/Z9007-87 Sampling plans and procedures for counting inspection 3 Terms, symbols, and codes
The terms, symbols, and codes used in this specification shall comply with the provisions of GB/T14113. 4 Technical requirements
4.1 Design
The dimensions of the lead frame shall comply with the relevant provisions of GB7092 and The requirements of lead frame design should be met. 4.1.1 Lead bonding area width
4.1.1.1 The minimum lead end width should be agreed upon by both parties. 4.1.1.2 The minimum bonding area of ​​the flat lead is 80% of the nominal lead width and 0.635mm long. 4.1.2 Stamping and metal spacing
4.1.2.1 Stamping depth The minimum stamping depth is 0.013mm and the maximum stamping depth is 30% of the material thickness (for stamping frames only). 4.1.2.2 For stamping frames, the dimensions indicated on the drawings are the dimensions before stamping. 4.1.2.3 The gap between the metal and the metal should be limited by the metal gap requirements (between the inner leads of the lead frame, between the inner leads and the chip bonding area>, the maximum precision embossing protrusion on each side shall not exceed 0.051mm. The gap between the metals shall be agreed upon by the supplier and the tape. 4.2 Lead frame shape and position tolerance
4.2.1 The inner lead twist shall not exceed 3°30°, or the maximum offset shall not exceed 0.015mm for every 0.254mm lead width. 4.2.2 Chip bonding area slope and flatness
4.2.2.1 Slope
a, under the condition of no concave, every 2.54 mm length or width dimension maximum tilt 0.025mm, b. In the concave state, the maximum tilt is 0.051mm for every 4.06mm length or width dimension. When testing the tilt from corner to corner, the total maximum shall not exceed 0.1mm.
4.2.2.2 Flatness
GB/T15876—1995
When measuring from the center to the midpoint of the four corners, it shall not exceed 0.005mm for every 2.54mm chip bonding area length. The corner is specified to be measured at 0.127mm from the edge.
4.2.3 Lead frame internal position tolerance
The actual position tolerance of the characteristic center line of all lead frames relative to the center line of the positioning hole on the frame shall be within 0.051mm. .4.2.4 Side bend
The lead frame shall not exceed 0.051mm in the entire nominal strip length. 4.2.5 Old bend
The curling deformation in the length direction of the lead frame strip is less than 0.51mm, 4.2.6 Horizontal bend
The horizontal bend size shall comply with the requirements of Table 1,
52~100
132~164
196244
4.2.7 Frame distortion
The frame distortion shall not exceed 0.51mm in the nominal strip length. 4.2.8 Coplanarity of embossed lead ends
Horizontal (maximum value)
Measured on the Z reference plane relative to the center of the chip bonding area or measured according to the test method in Appendix A of GB/T14112, the coplanarity should be within the following tolerance range:
44~52 leads, ±0.1mm
64~100 leads: ±0.15mm
120~232 leads: ±0.2mm
4.3 Appearance of lead frame
4.3.1 Burrs
All vertical and horizontal burrs shall not exceed 0.025mm on any part of the frame. 4.3.2 Pits and indentations
4.3.2.1 There should be no pits or indentations with a depth exceeding 0.008mm and a length exceeding 0.013mm in the functional area and external leads. 4.3.2.2 In the non-functional area, the depth of pits and indentations should not exceed 0.025mm and the length should not exceed 0.051mm. 4.3.3 Surface defects
The non-plated parts should be the original color of the metal material, without rust, flowery and other defects. 4.4 Lead frame plating
4.4.1 Plating thickness
4.4.1.1 The thickness of the local bond gold layer of the lead frame shall not be less than 1mm. 4.4.1.2 The thickness of the local silver plating layer of the lead frame shall not be less than 3.8μm. 4.4.2 Appearance of coating
The coating surface should be dense, smooth, uniform in color and in the original color of the coating. No defects such as peeling, blistering, staining, spots, water marks, foreign matter, and floweriness are allowed. There should be no obvious stains, shedding or missed bonding layer, and no marriage marks that penetrate the bonding layer. 4.4.3 Heat resistance of coating
GB/T 15876—1995
The coating should not have obvious discoloration after high temperature test. No defects such as peeling, blistering, falling, floweriness, and spots are allowed. 4.4.4 Bonding strength of coatingbzxz.net
The bonding area of ​​the lead frame lead should be easy to bond, and the bonding strength should be greater than 40mN. 4.5 Strength of external leads of lead frame
The external leads of the lead frame should not be broken after the Li Qu test. 5 Inspection rules
5.1 Composition of inspection batch
An inspection batch can be composed of one production batch or several production batches that meet the following conditions. These production batches are manufactured using the same materials, processes, equipment, etc. The inspection results of each production batch prove that the quality of the materials and processes can ensure that the lead frames produced reach the predetermined quality level.
The time for several production batches to form an inspection batch is usually no more than one week. Unless otherwise specified, the longest time shall not exceed one month. c
5.2 Inspection items and requirements
The inspection items and requirements of lead frames are shown in Table 2. The tests marked with (D) are destructive tests. The test methods quoted in Table 2 refer to the methods specified in the appendix of GB/T14112. The AQL sampling plan is in accordance with the provisions of SI/Z9007, and the number of samples is measured in pieces. Table 2 Inspection and test Geometric guide Coating thickness Coating heat resistance (D) Composite strength (D) External radiant density (D) 6 Ordering information Test method Use to meet Appendix A X-ray fluorescence thickness gauge or other equivalent instrument Appendix B B1 Appendix B Ba Appendix B B3 Appendix B If there is no other stipulation, the following information is required when ordering lead frames: Product model and specification: b. Quantity + Product drawing or drawing number, Material name and specification Any other details (when applicable).
7 Marking, packaging, transportation and storage
7.1 Marking
The lead frame packaging box shall be marked as follows: Factory name or trademark:
h. Product name, model, specification #
c. Product standard number,
Inspection requirements
According to 4.3 and 4.4.2 of this specification
According to 4.1 of this specification
According to 4.4.2 of this specification
According to 4.4.1 of this specification
According to 4.4.3 of this specification
According to 4.4.4 of this specification
According to 4.5 of this specification
d. Quantity;
e. Production date;
GB/T15876-1995
f. Inspection batch identification code and inspector code. 7.2 Packaging
To avoid damage and leakage during normal transportation, the product needs to be packaged in specially designed and manufactured packaging boxes, which should prevent the product from being contaminated and damp.
The lead frame inner packaging should be packaged and sealed with neutral materials to ensure that the product is not contaminated and corroded, and prevent physical damage. 7.3 Transportation
The packaging of the product should be suitable for transportation by any means of transportation, and should be protected from drenching, moisture and damage during transportation. 7.4 Storage
7.4.1 Lead frame products should be stored in a warehouse with an ambient temperature of 10℃~35℃, a relative humidity of no more than 80%, and no corrosive gas around.
7.4.2 From the date of leaving the factory, the shelf life of the plated lead frame is three months, and the shelf life of the unplated lead frame is six months. Additional notes:
This standard was proposed by the Ministry of Electronics Industry of the People's Republic of China, and this standard is under the jurisdiction of the National Integrated Circuit Standardization Technical Committee. This standard was drafted by Xiamen Yonghong Electronics Company and the Standardization Institute of the Ministry of Electronics Industry. The main drafters of this standard are Shangguan Peng and Chen Yukun.
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