JB/T 8050-1999 Technical requirements for punching die and die frame JB/T8050-1999 Standard download decompression password: www.bzxz.net

This standard is a revision of JB/T8050—1999 Technical Specifications for Press Die Sets.
This standard is a revision of JB/T8050—95 Technical Specifications for Press Die Sets. The main contents of this standard are the same as those of JB/T8050—95. This revision has made some changes in the text to make the meaning more precise. This standard replaces JB/T8050—95 from the date of implementation. This standard is proposed and managed by the National Technical Committee for Die Standardization. The drafting unit of this standard: Guilin Electrical Science Research Institute. The main drafters of this standard: Weng Shizhen and Qin Guangwei. 1
1 Scope
Mechanical Industry Standard of the People's Republic of China
Technical specification for press die sets
Technical specification for press die sets This standard specifies the technical conditions for press die sets. This standard applies to press die sliding guide sets and press die rolling guide sets. 2 Referenced standards
JB/T8050-1999
Replaces JB/T8050-95wwW.bzxz.Net
The clauses contained in the following standards constitute the clauses of this standard by being referenced in this standard. At the time of publication of the standard, the versions shown are valid. All standards are subject to revision; parties using this standard should explore the possibility of using the latest versions of the following standards. GB/T1184-1996 Tolerances of shape and position, without tolerance values ​​GB/T2828-1987, sampling procedures and sampling tables for batch inspection (applicable to inspection of continuous batches) JB/T8071-1995 Inspection of die frame accuracy 3 Technical requirements
3.1 The parts that make up the die frame must meet the corresponding standard requirements and technical conditions. 3.2 The accuracy of the sliding guide die frame is divided into Class I and Class II; the accuracy of the rolling guide die frame is divided into Class 0I and Class 0II. The die frames of each level of accuracy must meet the various technical indicators specified in Table 1. Table 1 Technical indicators of mold frame classification
Measured dimensions
Inspection items
Parallelism of the upper plane of the upper mold base to the lower plane of the lower mold baseVerticality of the axis of the guide column to the lower plane of the lower mold base Note: Tolerance grade shall comply with the provisions of GB/T1184. mm
≤400
Mold frame accuracy grade
oⅡ,Ⅱ grade
o1:1 grade
Tolerance grade
The fit clearance value (or interference) of each pair of guide columns and guide sleeves (including removable guide columns and guide sleeves) installed in the mold frame shall comply with the provisions of Table 2. 3.3
3.3.1·Mold frames with grade I accuracy must comply with the fit clearance values ​​given in Table 2 when the fit accuracy of guide sleeves and guide columns is H6/h5. 3.3.2 The mold frame with grade II accuracy must meet the matching clearance value given in Table 2 when the matching accuracy of the guide sleeve and guide column is H7/h6. 3.4 After the mold frame is assembled, the upper mold seat should move up and down along the guide column smoothly and without stagnation. 3.5 After the guide column is assembled, the fixed end face should keep a distance of 1~2mm from the lower plane of the lower mold seat. When the B-type guide sleeve is selected, the fixed end face should be 1~2mm lower than the upper plane of the upper mold seat after assembly. 3.6 The working surfaces of the various parts of the mold frame are not allowed to have cracks and defects such as sand holes, shrinkage holes, and mechanical damage that affect the use. 3.7 Under the condition of ensuring the quality specified in this standard, it is allowed to fix the guide column and guide sleeve by other process methods, and the structural dimensions of its parts are allowed to be modified accordingly. Approved by the State Machinery Industry Bureau on August 6, 19992
2000-01-012

JB/T8050-1999
3.8 Complete mold bases are generally not equipped with mold handles.
Technical requirements other than those specified above shall be agreed upon by the supplier and the buyer. 3.9
Match form
Sliding fit
Rolling fit
Acceptance rules
2 Guide pin and guide sleeve fit clearance (or interference) Table 2
Mold base accuracy grade
Guide pin diameter d
18
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