This standard specifies the electrical, mechanical and other performance requirements of copper-clad epoxy glass cloth laminates for printed circuits. This standard applies to foil-clad laminates made of alkali-free glass fiber cloth impregnated with epoxy resin, copper foil on one or both sides, and hot-pressed (hereinafter referred to as foil-clad laminates). GB 4725-1992 Copper-clad epoxy glass cloth laminates for printed circuits GB4725-1992 Standard download decompression password: www.bzxz.net

UDC621.316.616-415:621.3.049.75190
National Standard of the People's Republic of China
GB/T4721-472292
GB 4723~-4725—92
Copper-clad laminated sheets for printed circuits
Copper-clad laminated sheets for printed circuits
Published on July 8, 1992
National Technical Supervision Bureau
Implemented on April 1, 1993
National Standard of the People's Republic of China
Copper-clad woven glass fabrics for printed circuits cireuits
B4725-92
Replaces GB472584
This standard refers to the Inter-American Electrical and Mechanical Association standard 1EC249-2 (1987>Molding substrates for printed circuits Part 2: Specifications for corresponding plastic numbers in the visual specification,
Main content and scope of application
Implementation of the standard provisions, printed circuit board with epoxy foil drum glass cloth expansion board electrical, micro-machine and other service requirements, standard for electrical alkali-free glass fiber cloth with epoxy resin Copper foil laminate (hereinafter referred to as main board) made of resin, one or both sides of the board, and hot pressed. 2 Reference standards G/4721 General specification for printed circuit board laminates GB/T1732 Test method for printed circuit board for medical copper foil GB5230 Electrolytic foil 3 Product classification 3-1 Models and characteristics The board models and their characteristics included in this standard are shown in Table 1. Table 1 GERGC-3R CHP 3282 Note: 1) CEPGC-31 type material is made of IEC-245-2-4 type, 2) CEPCC-31FC-24S-2-5-FV3.2 Material structure The board is composed of one or both sides of the insulating substrate. 3.2.1 Insulation material
General
Electrical insulation laminate with ring-shaped glue as the fine agent and glass fiber reinforced cloth as the reinforcing material. 3.2.2 Saw
For electrical insulation copper pedals of digital cabinets, the technical requirements shall comply with the current provisions of (D230). 3.3 Product marking
The product marking shall comply with the provisions of Article 11.1 of GB/T4721. Approved by the State Bureau of Technical Supervision on July 8, 1992 and implemented on April 1, 1993
4 Technical requirements
4.1 Electrical properties of the cabinet cover
The copper foil shall have the electrical properties listed in item 2. Serial number
Index name
, M not greater than
15 μm bzxz.net
35 μm Hujiu
75m steel m
table electricity, M2 less than
self-determined wet heat treatment box
in (for optional specification)
surprise product heat treatment recovery
125C time
live accumulation heart book M mouth·T.
not less than
long fixed heat treatment matching grab
m (for optional A
determined heat treatment recovery after Beijing
East 135C inch|| tt||Recovery after heat treatment
Not less than
Resistance to heat treatment
Not greater than
Surface separation
Reverse corrosion, positive electrode is not inferior
Negative electrode is not inferior
4.2 Non-electrical properties of standard board
4.2.1 Appearance
1.2.1.1 Conventional surface appearance
CH ±725—92
Test force method
G1/T 472392
Meaning
10 coc
su eok
16 ong
towards the middle without fan 2 牧
1. The end face of the micro box board should be neat, without delamination and cracks. b. The foil surface is not allowed to have bubbles, lines, pinholes, deep scratches, pits and amine spots that affect the use. Any discoloration or stains should be easily removed with a hydrochloric acid with a density of 1.2g/* or organic drop agent. The core laminate surface is not allowed to have bubbles, pits, scratches, cavities and foreign impurities that affect the use. 4.2.1.2 High-quality surface appearance (for selection) When there is a requirement for the high-quality appearance of the box board, the supply and demand parties can negotiate to add this item. The requirements are in accordance with the provisions of Article 6.2 of GB/?21.
4.2.2 Size
GA 4725-92
4.2.2, 1 The recommended nominal area and the difference of the wing box plate should comply with the provisions of Table 3, Table 3
Estimated nominal flow area (26)
1 000×1 G
1200×1000
Note: If there is a difference in the recommended nominal area, it can be negotiated by the supplier and the buyer. 4.2.2. 2 Thickness
Summer foil plate standard thickness and single point connection test GB/T4722 Chapter 23, its value should be in accordance with the provisions of Table 4 Table 4
Standard European thick house
Consider
Single point fan difference
Nominal thickness
Note: Non-nominal thickness can be adjusted by negotiation between the supplier and the supplier. For some of the above, please refer to the nominal value. 4.2.3 For more nominal thickness of box board, please refer to GB/T4722 Chapter 24 single test, the core value should comply with Table 5. 5
1000X1000
: 2x×1 000
4.2.2 Warping
Single point light trap
Treckle
+0, 1s
The micro-super plate agent number, curvature value and twist out true value shall be calculated according to G/T4722 Section 14 test report board when L-1000m is connected, the d value shall not exceed the provisions of the table.
center 8 to 1.2
-, above 1.1
1. Above 2.2
3.2 to 6. 1
Hysteresis board
single-sided shade board
double-sided glaze
syu μm
GB4725-92
Note, the maximum bending and twisting requirements are applicable to the size of the version before and after the initial opening. The length, weight and length of the version are not less than 10450mm. This table is suitable for the standard thickness of the period not more than. 4.2.5 Other non-electrical requirements
Required boxes should meet the other non-electrical performance requirements listed in Table? Table 7
Test method
Tensile temperature, N
Name
Separation strength, N,/mm
Not less than
Not less than
2C limit after welding 235um steel dip
16m copper dip
185 C dry heat 335 μm copper mold
1Em copper box
In 1.1,1-trioxygen, alcohol
ethane solvent after banana gas
After mold batch electrical dyeing 2=35 μm After processing
13μm fine box
at 125℃235m processing box
18m cutting box
at 26℃
35μm steel
B steel
2Cs saturation test after heat shock
instant
lubricity test
35um steel
plate thickness c, s mm to 1. trD.
Plate rate 1.mm to 6.4mm
Half wet test
Punching performance
GB/T4722-92
Note: 1> When the material is not sintered, the agent is good, the supply and demand parties negotiate, 2: Choose one of them,
No delamination, no application
No delamination, no super bubble
According to the supply and demand parties negotiate, 3) When the steel base is greater than 7um or the thickness is greater than %.4mm, the wetting and half wet time are negotiated by the supply and demand parties, 4.3 After the copper foil is removed, the non-electrical properties of the substrate are recorded. 4.3.1 The material is not allowed to have pits, holes, cavities, self-, follow-up and foreign impurities (including the cured resin surface) that affect the use. The color should be uniform and the least random changes are allowed. 4.3.2 After all the copper foil is removed according to the provisions of Chapter 3 of GB/T4722, the performance of the green base material shall comply with the provisions of Table 8. 60
Indicator name
Flexural strengthMIPa
Board thickness 1.0mm or above
Expected, grade
to direct method
Water-based·mg
Reporting .5um
Not less than
Not less than
GB 4725-92
Test method
GD/4728-92
Note, 1) The grass is solid and uniform, non-standard thickness, can be thicker than the nominal value, 5 Inspection rules
The inspection rules shall comply with the provisions of Chapter 10 of GB/T4721. 6. Marking, packaging, transportation and storage. Marking, packaging, transportation and storage shall comply with the provisions of Chapter 11 of GB/T472I. Additional remarks: This standard was proposed by the Ministry of Machinery and Electronics Industry of the People's Republic of China. The above standard was submitted by the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry. This standard was drafted by the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry. The drafter of the revised standard was Lin Zhenru. CEPGC No filter, no tray, no product classification
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