This standard specifies the technical requirements, inspection methods and markings for electroformed thin plate test sieves. This standard applies to round or square hole test sieves with mesh sizes of 5 to 500 μm as specified in GB/T 6005. GB/T 6003.3-1999 Electroformed thin plate test sieves GB/T6003.3-1999 Standard download decompression password: www.bzxz.net
This standard specifies the technical requirements, inspection methods and markings for electroformed thin plate test sieves. This standard applies to round or square hole test sieves with mesh sizes of 5 to 500 μm as specified in GB/T 6005.

GB/T6003.3—1999
This standard is equivalent to ISO3310-3:1990 "Technical requirements and tests for test sieves Part 3: Electroformed thin plate test sieves". Compared with international standards, this standard adds the provisions for test sieve marking. This standard is part of the "Technical requirements and tests for test sieves" series of standards. This series of standards includes: GB/T6003.1—1997 Metal woven wire mesh test sieve GB/T6003.2-1997 Metal perforated plate test sieve GB/T6003.3--1999 Electroformed thin plate test sieve Appendix A of this standard is a prompt appendix.
This standard was proposed by the State Machinery Industry Bureau. This standard is under the jurisdiction of the National Screen Screening Standardization Technical Committee. The drafting unit of this standard: Mechanical Science Research Institute. The main drafters of this standard: Yu Fang, Deng Yue. 173
GB/T6003.3-1999
ISOForeword
ISO (International Organization for Standardization) is a joint organization of national standard bodies (ISO member states) around the world. The work of international standards is usually undertaken by ISO technical committees. Each international organization, government and private sector that ISO collaborates with also participates in the drafting of standards. In terms of electrotechnical standardization, ISO also works closely with the International Electrotechnical Commission (IEC). The draft international standards approved by the technical committee must also be voted on by member states. As a formal standard publication, it requires at least 75% of member states to vote in favor.
International Standard ISO3310~3 was developed by ISO/TC 24 Technical Committee on Screens, Sieving and Other Particle Sorting Methods. Under the general title of "Technical requirements and tests for test sieves", ISO 3310 consists of the following parts: Part 1: Test sieves of woven wire mesh
- Part 2: Test sieves of perforated metal sheet
Part 3: Test sieves of electroformed sheets
Appendix A to this part of ISO 3310 is for reference only. 174
1 Specification
National Standard of the People's Republic of China
Test sieves of electroformed sheetsbzxZ.net
Test sieves of electroformed sheets This standard specifies the technical requirements, test methods and marking for test sieves of electroformed sheets. GB/T 6003.3—1999
eqyIso 3310-3:1990
This standard applies to round or square test sieves with a mesh size of 5 to 500 μm as specified in GB/T 6005. 2 Referenced standards
The clauses contained in the following standards constitute the clauses of this standard by being referenced in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and parties using this standard should explore the possibility of using the latest versions of the following standards. GB/T5329--1985 Test sieves and sieving test terms GB/T6005-1997 Test sieves Wire mesh, perforated plates and electroformed sheets GB/T10061-1988 Method for marking sieve holes in sieve plates 3 Terms
The terms used in this standard can be found in GB/T5329. 4 Marking
4.1 Marking method
Basic size of sieve holes
The size of the sieve frame should be marked first, and then the basic size of the electroformed sheet sieve hole (see Table 1, in mm), with a slash mark between the two, and then the shape of the sieve hole, with R for round holes and S for square holes; leave one space, and finally mark the national standard number. 4.2 Marking example
The marking of the round hole test sieve with a sieve frame size of $200mm×50mm and a basic sieve hole size of 0.09mm is: Φ200X50/0.09R GB/T 6003.3-1999The marking of the square hole test sieve with a sieve frame size of 200mm×50mm and a basic sieve hole size of 0.09mm is: $200X50/0.09S GB/T 6003.3--19995Electroformed sheet
5.1. Technical requirements
5.1.1 Sieve hole size, hole spacing and plate thickness
The basic sieve hole size, tolerance, hole spacing and plate thickness shall be in accordance with the provisions of Table 1. Approved by the State Administration of Quality and Technical Supervision on September 3, 1999 and implemented on March 1, 2000
Basic dimensions of sieve holes
Main dimension series
GB/T6003.3-1999
Table 1 Sieve hole dimensions, hole spacing and plate thickness
Pitch P
Supplementary dimension series
5.1.1.1 Tolerance of sieve hole dimension w
Preferred dimension
Allowable selection range
Preferred plate thickness
The tolerance of all measured hole dimensions shall not be greater than ±2um. This tolerance applies to the values ​​measured at the middle cross-sectional width of a square hole or at 176
GB/T 6003.3-1999
of a round hole diameter, including the measurement of the sieve hole closest to the edge of the sieve surface (i.e. applicable to the minimum sieve hole size, see Figure 5). 5.1.1.2 Hole spacing P
The hole spacing dimensions given in column 4 of Table 1 are applicable to both round holes and square holes and should be used preferentially. If other hole spacing dimensions are selected, they should also be within the limits given in Table 1. 5.1.1.3 Plate thickness e
The preferred plate thickness specified in column 7 of Table 1 is applicable to both round holes and square holes of electroformed sheets. If there is a support mesh, the measurement should avoid the support mesh.
5.1.2 Arrangement of sieve holes
Arrangement of sieve holes on electroformed sheets:
a) Round holes should be arranged in the T-shape as specified in GB/T 10061 (see Figure 1); b) Square holes should be arranged in the U-shape as specified in GB/T 10061 (see Figure 2). Figure 1
Arrangement of round holes
Figure 2 Arrangement of square holes
5.2 Inspection method
5.2.1 General inspection
Observe the screen surface of the electroformed sheet on a uniform lighting background. During the inspection, rotate the screen parallel to the axis parallel to the arrangement of the screen holes. If the size of the screen holes is found to be uneven, the test screen is unqualified. 5.2.2 Inspection of screen hole size
GB/T 6003.3—1999
After the test screen passes the general inspection, the screen hole size inspection should be continued. Divide the screen surface into 9 measurement areas as shown in Figure 3 and measure the screen holes. At least 5 screen holes should be measured in each area according to the longitudinal and transverse dimensions. The inspection of each screen hole should meet the dimensional tolerance specified in 5.1.1.1. Figure 3 Measuring area of ​​sieve hole size
For the inspection of sieve hole size greater than 32μm, a digital display tool microscope with a magnification of 50~200 times should be used for measurement. The instrument measurement accuracy shall not be less than ±0.5μm.
For the inspection of sieve hole size less than or equal to 32um, the above instrument is not applicable. 6 Test sieve frame
The test sieve frame should be round and made of stainless steel or other materials suitable for the material to be screened. The dimensions and tolerances of the test sieve frame shall be in accordance with the provisions of Table 2 (see Figure 4). Table 2 Dimensions and tolerances of test sieve sieve plates
Nominal dimensions of test sieves
100-8:3
1) A deeper sieve frame may be required for wet screening. D
Effective screening area diameter
≥185
Figure 4 Sectional view of electroformed sheet test sieve
Structure of test sieve
Depending on the production process, the electroformed sieve plate can have two sections, type A or type B, as shown in Figure 5. Screen palm
Depth (approximate value)
25 or 50
Electroformed sheet
When the sieve plate with type A section is fixed in the sieve frame, the small end of the sieve hole should face upward to facilitate the smooth passage of the material under the sieve. mm
If the electroformed sheet requires a support net, the mesh of the support net and the sieve hole of the sieve plate should be arranged in the same direction. The combination position of the support net and the electroformed sheet can be fixed on the upper or lower side of the electroformed sheet according to the different needs of the user, and no gap is allowed at the combination to prevent particles from being retained in the gap. 178
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The screen frame should be flat and smooth, and can be easily stacked with other screens, covers and receiving trays of the same basic size as the screen frame. The connection between the electroformed screen plate and the screen frame should prevent leakage of the material to be screened. Hoof surface
a) Type A
b) Type B
Figure 5 Schematic diagram of the cross section of the electroformed screen plate
8 Marking of the test sieve
There should be a fixed and clear metal nameplate on the screen frame, including the following: a) Basic size (in mm) and shape of the sieve hole; b) Implementation standard:
c) Materials of the electroformed sheet and screen frame:
d) Name and logo of the manufacturer;
e) Others.
GB/T 6003.3-1999
Appendix A
(Suggestive Appendix)
Maintenance of Electroformed Test Sieve
Test sieves for electroformed sheets should be used carefully to prevent damage. Unless otherwise recommended by the manufacturer, the test sieve should be vertically immersed in a suitable liquid for cleaning. The liquid used should be alcohol, deionized water with or without trace amounts of non-corrosive surfactants, and cleaned in an ultrasonic cleaning basin for 15 to 20 seconds (frequency not less than 40kHz, input power not more than 40W). Then rinse the test sieve with clean water and dry it at a temperature not higher than 80℃.
Electroformed sheets must not be cleaned with a brush or compressed air. Electroformed sliding plate test sieves should be periodically inspected in accordance with the provisions of Article 5.2 of this standard. 180
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