SJ 3118-1988 Wafer carrier SJ3118-1988 standard download decompression password: www.bzxz.net

Ministry of Electronics Industry of the People's Republic of China Standard SJ3118-88 Wafer carrier Issued on April 8, 1988 Implementation on December 1, 1988 Ministry of Electronics Industry of the People's Republic of China Standard Wafer carrier 1. Subject content and scope of application SJ3118-88 This standard specifies the varieties, specifications, dimensions and technical requirements of wafer carriers for wafer packaging boxes, wafer transfer racks and wafer cleaning racks. This standard applies to wafer carriers used for packaging, transfer and cleaning of wafers in the production process of semiconductor materials, discrete devices and integrated circuits. 2 Wafer carrier terminology 2.1 Wafer packaging box: a wafer carrier used for packaging, storage and transportation of wafers in the production process of semiconductor materials, discrete devices and integrated circuits, which has the function of preventing wafer damage and contamination. 2.2 Wafer transfer rack: a wafer cutter used for automated processing and testing of wafers in the production process of semiconductor materials, discrete devices and integrated circuits. 2.3 Wafer cleaning rack: a wafer cutter used for cleaning wafers in the production process of semiconductor materials, discrete devices and integrated circuits.
3 Brands of wafer cutters
3.1 Brands of wafer cutters consist of the following parts: J
B, C, Q, C,
J—Wafer
C—Cutter
B-—Packaging box
-Transfer rack
Wafer type
The number represents the wafer diameter
Receiver code
Receiver category code
Wafer code
Q——Cleaning wafer rack
×× number——Wafer diameter
(P)——Polishing wafer
(M)——Grinding wafer
Approved by the Ministry of Electronics Industry of the People’s Republic of China on April 8, 1988 and implemented on December 1, 1988
3.2 Wafer receiver brand example
SJ3118-88
3.2.1 JBC75(P) indicates a 75mm diameter polished wafer packaging box receiver. 3.2.2 JBC75(M) indicates a 75mm diameter grinded wafer packaging box receiver. 3.2.3JCC-75 indicates a 75mm diameter wafer transfer rack holder. 3.2.4JQC75 indicates a 75mm diameter wafer cleaning rack holder. Wafer packaging box holder
Wafer packaging box holder schematic diagram 1 and 2. The variety, specification, size and marking of the wafer packaging box holder shall comply with the provisions of Table 1. The grinding wafer (wafer) packaging box holder has no slot, so there is no n, La, and b1s, bl6, he and other dimensions. SJ3118-—88||tt ||Figure 1 Schematic diagram of wafer packaging box (bottom) carrier 33
S33118—88
Figure 2 Schematic diagram of wafer packaging box (cover) carrier Diameter of crystal ding wafer
Jixin size
Mark mm
SJ3118—88
Table 1 Variety, specification, size and mark of wafer packaging box carrier 40
114.3±0.25
134.52±0.25
2.8 ±0.01 | |134.52±0.25
3.43#0.38
114.3±0.25|| tt||134.52±0.25
3.43±0.38
Wafer diameter
Device size
SJ3118-88
Continued Table 1
5 Wafer transfer rack and cleaning rack carrier 960
5.1 The schematic diagram of the wafer transfer rack and cleaning rack carrier is shown in Figure 3. 5.2 The types, specifications, sizes and markings of the wafer transfer rack and cleaning rack carrier shall comply with the provisions of Table 2. 6
SJ3118-88
Figure 3 Schematic diagram of wafer transfer rack and cleaning rack carrier SJ3118-88
Table 2 Varieties, specifications, dimensions and markings of wafer transfer rack and cleaning rack carrier Wafer diameterbzxZ.net
Cover size
144max
4.76±0.25
114.3±0.25
b g+0.5min
9.5max/7.9ml
2m up |14.55±0.25||tt ||or 14±0.25
47.6±0.25
6.3510.38
144max
4.76±0.25
114.3±0.25
11.2m8x/7.9mlm
2.7max/1.4min
1 04.6max/102.6min| | tt | ||4.76±0.25
114,3 ±0.25
ba+0.5min
12.7max/9.53min
2.7max/1.4min
128.5±1.0min
130.7±0.38
134.52±0.25
3.5610.38
4.3 2±0.5
10.11 ± 0.25 | | tt | | 14.55 ± 0.25 | 76±0.25
114.3±0.25| |tt||bg+0.5min
12.7max/9.5min
2.7max/1.4min
153.5±1.0
134.52±0.25
3.56-8.38
4.32±0.05
10.11±0.25|| tt||14.55±0.2 5
or 14±0.25
1.57±0.5
79.76±0.5
25.4±0.25
6.3520.38
6Technical requirements
SJ3118-88
6.1Safety: The packaging box should ensure that the wafers in the box are intact during transportation and can withstand the vibration of the third-level highway.
6.2Sealing: Put the polished wafers in the ultra-clean nitrogen environment, stick the sealing tape, and keep the wafers in the box free from contamination after half a year.
6.3Wafer loading capacity (n): The loading capacity of various specifications of carriers is 25 wafers. 6.4Location pins and positioning holes: The spacing size of the positioning pins and positioning holes of various specifications of carriers should meet the requirements of the drawings to ensure that the wafers of different types of carriers of the same specifications can be transferred to each other. 6.5 Materials: The cutter should be made of plastic with good thermal stability, chemical stability and non-contamination of silicon wafers. Wafer packaging box carriers are generally made of plastic injection molding such as polypropylene and high-impact polystyrene; wafer transfer rack carriers are generally made of plastic injection molding such as propylene; wafer cleaning racks are generally made of plastic injection molding such as soluble tetrafluoroethylene. The materials used should be both antistatic and non-antistatic. All types of carriers should have antistatic properties under specific requirements.
6.6 Transparency: The wafer packaging box carrier can be counted with the naked eye without destroying the seal.
6.7 Easy to use: Wafers of various carriers of the same specification should be able to be transferred to each other without the occurrence of card phenomenon: the upper cover and the base of the packaging box should be properly matched, and it is easy to disassemble and package; various carriers should be easy to clean. 6.8 Appearance: The appearance should be beautiful and generous; it can be stacked in a large packaging box, placed stably, and the surface should be clean and bright. 7 Inspection method
7.1 Appearance: Visual inspection
7.2 Size: Caliper, plug gauge
7.3 Surface roughness: Surface roughness meter
8 Inspection rules
8.1 The inspection department of the product manufacturer shall conduct 100% inspection in accordance with this standard and attach an inspection certificate: 8.2 When the user receives the product, he shall promptly check the packaging quality and the integrity of the product according to the product delivery order. Any product damage caused by packaging quality shall be negotiated with the supplier within two months from the date of arrival. 8.3 After receiving the product, the user may conduct 100% acceptance according to this regulation. If the product is found not to meet this standard, the user shall report it to the supplier within three months from the date of arrival, and conduct re-inspection after consultation between the two parties or hire a third party for arbitration. 9 Marking, packaging, transportation, storage
9.1 Products must be accompanied by a certificate of conformity before leaving the factory. The certificate of conformity shall indicate: 9.1.1 Product name, brand and number
9.1.2 Various technical indicators
9.1.3 Specifications and quantity
9.1.4 Inspector's signature and inspection date || tt||SJ3118--88
9.2 The packaging box should have anti-damage, anti-pollution and anti-vibration measures. 9.3 The packaging box shall be labeled and marked with:
9.3.1 Product brand
9.3.2 Product number
9.3.3 Date of manufacture
9.3.4 Manufacturing unit
9.4 The product cannot withstand pressure during transportation. 9.5 The product should be stored in a clean warehouse without heavy pressure. Additional instructions:
This standard was proposed by the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by the Standardization Institute of the Ministry of Electronics Industry, Factory 774 and Factory 742. 10
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