SJ/T 10225-1991 Electronic Devices Graphic Library - Electromechanical Devices Graphics SJ/T10225-1991 Standard Download Decompression Password: www.bzxz.net

Industry Standard of the People's Republic of China for Electronic Industry Graphic base of electronic components Graphic base of electronic components
Components--graphic of electro-mechanical components Subject content and scope of application
SJ/T10225-91
This standard specifies the design specifications for electromechanical component graphics in the electronic component graphic library for computer-aided design of printed circuit boards (PCBs).
This standard applies to computer-aided design of printed circuit boards. Manually designed printed circuit boards can also be used as a reference.
2 Referenced standards
GB4 728 Graphic symbols for electrical diagrams
GB5094 Item codes in electrical technology
GB5489
3 Terminology
Printed board drawing
3.1 Electromechanical component
electro--mechanicalcomponent A component that produces electrical transformation (connection, disconnection or conversion) when electrical energy is input or mechanical force is applied. 3.2 Connector
connector
A component used to terminate a conductor, which can be plugged and connected with a corresponding mating component. Separation, making the circuit open and close. 3.2.1 Plug
Connector whose electrical contacts are in a contained state after mating. 3.3.2 Socket
socket
Connector whose electrical contacts are in a contained state after mating. 3.3 Switch
switch
Component with a drive mechanism and multiple contacts (contact points) to make the circuit open and close. Approved by the Ministry of Machinery and Electronics Industry of the People's Republic of China on May 28, 1991 and implemented on December 1, 1991
3.4 ​​Relay
SJ/T1022 5--91
When its input parameter (i.e. excitation quantity such as electricity, magnetism, heat, sound, light, etc.) reaches the specified requirements, its output parameter will change in a leap-like manner (thereby achieving the purpose of control, protection, regulation or information transmission, etc.) An automatic intermittent control element. 3.5 Transformer
transformer
A transformer that converts the grid voltage into the voltage required for the power supply of electronic equipment or is used to transmit, transform and memorize electrical signals or to transmit, form, transform and memorize pulse signals. 3.6 Conversion element
convesion element
Electronic components with conversion functions refer to components used to convert energy such as sound waves or vibration waves into electrical signals or to convert electrical energy into sound energy via mechanical energy. 3.7 Jumper
jumper
Components used to connect and short-circuit circuits on printed boards. 3.8 Filter
filter
Components that allow electrical signals within a certain frequency range to pass through and prevent electrical signals outside this frequency range from passing through. 4 Electromechanical component graphic structure
The block diagram of the electromechanical component graphic structure is shown in Figure 1.
Each electromechanical component graphic structure must include two parts: a text description of the electromechanical component structure and the graphic parameters of the electromechanical component in the PCB design. It is also required that the graphics established according to this graphic structure can be converted into physical components through functional assembly. 4.1 Mechanical and electrical component structure description
The left part of Figure 1 specifies the text attributes of the mechanical and electrical component structure description, including the classification name, subclass name, model name, logical name (project code), connection node, text node, appearance parameters and positioning method of the mechanical and electrical component. 4.2 Graphic parameters of mechanical and electrical components in PCB design The right part of Figure 1 specifies the graphic parameters of mechanical and electrical components, including silk screen graphics (marker symbol graphics), assembly graphics, connection pads and hole diagrams.
4.3 Representation of mechanical and electrical component graphics
The various parts of the mechanical and electrical component graphics in Figure 1 can also be represented by Tables 1 and 2; Table 1 includes the types and parameters of the connection pads and hole diagrams of the mechanical and electrical component graphics, see Appendix A Table 2 includes examples of text attributes, silk screen graphics and assembly graphics of mechanical and electrical component graphics, see Appendix B. 4.4 Mechanical and electrical component graphic structure parameters
A mechanical and electrical component graphic structure parameter should be stored in the electronic component graphic library as a graphic element set. 2
SJ/T10225--91
Connection pad
Assembly graphic
Silk screen graphic
Positioning method
Appearance parameters
Text node
Connection node
Logical name
Model name
Isolation disk
Ground grid graphic
Power supply graphic
Resistance (helper) pad
Internal layer connection pad
Surface layer pad
Other positioning
Center positioning
Foot positioning
Appearance dimensions
Mounting hole
Surface layer pad
Internal layer
Connector
Resistance (Auxiliary) pad
Isolation pad
Power supply and
Ground grid graphic
Wire mesh graphic
Assembly graphic
SJ/T10225-91
Table 1 Mechanical and electrical component structure description table
Geometric parameters
Classification name
Model name
Text node
Font parameters
Appearance parameters
Positioning method
Connection pad, hole diagram type and parameters
Ellipse
Mechanical and electrical component structure description table 1 Text attributes, silk screen graphics and assembly graphics subclasses
Logical name
Internal font
Note: The graphic line width is generally 0.30mm.
Mounting hole
Selected font
Oval
Dimensions
5 Principles and methods of layering of electromechanical component graphics 5.1 Layering principles
SJ/T10225—91
Graphic layering should be conducive to library management; it is conducive to data extraction for computer-aided design, manufacturing and testing of PCBs. 5.2 Layering methods
Each physical layer of a printed circuit board contains many graphic elements of different properties. The computer-aided design system should store these graphic elements according to their properties on each logical layer of the system. The logical layer can be divided into the following according to the different types and uses of electromechanical component graphics: b.
Component layer (logical layer for component call-in and positioning); b.
Surface layer pad graphic layer:
Internal layer connection pad graphic layer;
Resistance (auxiliary) pad graphic layer;
Power supply graphic layer;
Ground grid graphic layer;
Logic name layer;
Model name layer;
Silk screen graphic layer;
Assembly graphic layer;
Hole layer layer;
Connection node layer;
Pin number layer;
Other layers.
Provisions for the graphic structural parameters of electromechanical components
Each parameter in Table 1 and Table 2 is stipulated item by item as follows: 6.1 Classification name
Connector:
Switch,
Relay:
Transformer,
Transducer;
Jumper,
Filter;
Other.
6.2 Subclass
Subclass of connector
Rectangular;
Bar;
Circular;
Other.
Subclass of switch
Rotary switch,
Toggle switch;
Push button switch;
Board switch;
Toggle switch;
Slide switch;
Other.
Subclasses of relays
Rectangular;
Circular;
Other.
Subclasses of transformers
Rectangular:
Circular:
Other.
Subclasses of transducers
Peak buzzers;
Loudspeakers;
Microphones:
Other.
Subclasses of jumpers
Jumper wires;
Jumper elements;
Other.
Subclasses of filters
Rectangular,
Circular:
Other.
6.3 Model name
Refers to the model of the electromechanical component.
6.4Logical name
SJ/T10225—91
refers to the project code of electromechanical components. The project code is selected according to the provisions of GB5094. 6.5Text node
Used to write model name, logical name and other text attributes. 6.6 Font
You can use the computer system's default font or the self-selected font. The font size is generally selected as follows: character height ≥1.5mm, character width ≥1.0mm, font line width ≥0.2mm. 6.7 Number of pins
Refers to the total number of lead-out terminals of electromechanical components.
6.8 Pin spacing
SJ/T10225-—91
Refers to the distance between two adjacent lead-out terminals of the actual electromechanical components on the PCB. 6.9 Pin numbering
Generally, it is numbered with consecutive positive integers starting from the number 1, and the position of the first pin is determined as needed. 6.10 Pin size
The diameter of the circumscribed circle of the pin cross section or the size of the cross section. 6.11 Outline size
Refers to the maximum outline size of the component top view during layout. 6.12 Mounting hole
The hole for mounting electromechanical components on the PCB.
6.13 Silkscreen graphics
The silkscreen graphics shall be represented by the graphic symbols or simplified shapes specified in GB4728, and may be marked with pin numbers when necessary (see Table B1 to Table B12 in Appendix B). Special markings shall be given to directional components at key positions. 6.14 Assembly graphicswww.bzxz.net
Use graphics similar to the silkscreen graphics of similar electromechanical components and indicate the pin positions (see Table B1 to Table B12 in Appendix B).
Draw the printed board assembly drawing in accordance with the provisions of GB5489. 6.15 Electromechanical component graphics positioning method
6.15.11 Pin positioning: The position of the electromechanical component graphics on the PCB is determined by the position of the first pin as the drawing origin. 6.15.2 Center positioning: The position of the electromechanical component graphics on the PCB is determined by the symmetric center of the component as the drawing origin. 6.15.3 Other positioning: In addition to the 1-pin positioning and the center positioning, other specific positions are used as the drawing origin to determine the position of the electromechanical component graphics on the PCB.
7 Basic grid and connection plate geometry
7.1 Basic grid
Use 2.54mm or 2.50mm.
7.2 Connection plate geometry
7.2.1 Surface layer pads can be circular, rectangular, elliptical and oblong. When the pin diameter d≤0.8mm, its graphic parameters are selected according to the provisions of Table A1 in Appendix A. When 0.8mm
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