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JB/T 5781-1991 Specifications for profile heat sinks for power semiconductor devices

Basic Information

Standard ID: JB/T 5781-1991

Standard Name: Specifications for profile heat sinks for power semiconductor devices

Chinese Name: 电力半导体器件用型材散热器 技术条件

Standard category:Machinery Industry Standard (JB)

state:in force

Date of Release1991-10-17

Date of Implementation:1992-10-01

standard classification number

Standard Classification Number:Electrical Engineering>>Power Transmission and Transformation Equipment>>K46 Power Semiconductor Devices and Components

associated standards

Publication information

publishing house:Mechanical Industry Press

Publication date:1992-09-01

other information

drafter:Du Jimei, Qin Xianman, Chen Zhenyun, Liu Wei, Qiu Minxian

Drafting unit:Xi'an Power Electronics Technology Research Institute of the Ministry of Machinery and Electronics Industry, Jiangyin Thyristor Accessories Factory and Shanghai Rectifier General Factory

Focal point unit:Xi'an Power Electronics Technology Research Institute of the Ministry of Machinery and Electronics Industry

Proposing unit:Xi'an Power Electronics Technology Research Institute of the Ministry of Machinery and Electronics Industry

Publishing department:Ministry of Machinery and Electronics Industry of the People's Republic of China

Introduction to standards:

This standard specifies the technical parameters and inspection rules for profile heat sinks for power semiconductor devices. This standard applies to extruded profile heat sinks for power semiconductor devices. JB/T 5781-1991 Technical conditions for profile heat sinks for power semiconductor devices JB/T5781-1991 Standard download decompression password: www.bzxz.net

Some standard content:

Mechanical Industry Standard of the People's Republic of China
Technical Conditions for Profile Heat Sinks for Power Semiconductor Devices 1 Subject Content and Scope of Application
This standard specifies the technical parameters and inspection rules for profile heat sinks for power semiconductor devices. This standard applies to extruded profile heat sinks for power semiconductor devices. 2
Cited standards
GB/T11456
GB6892
GB3190
GB3199
3Technical requirements
Test methods for thermal resistance and flow resistance of heat sinks for power semiconductor devices Heat sinks for power semiconductor devices Insulation parts and fasteners for power semiconductor devices Profile heat sink dimensions for power semiconductor devices Industrial aluminum and aluminum alloy hot extrusion profiles
Chemical composition of aluminum and aluminum alloy processed products Packaging, marking, transportation and storage of aluminum and aluminum alloy processed products 3.1 Dimensions and deviations
JB5781—91
The cross-sectional view and dimensions of the heat sink of the profile heat sink shall comply with the provisions of GB/T11456. The deviation of the dimensions shall comply with the provisions of GB6892. 3.2 Appearance and surface quality
3.2.1 Appearance
The surface of the profile heat sink is not allowed to have defects such as cracks and scratches. 3.2.2 Surface quality
The surface roughness of the profile heat sink is Ral1.6μm. The surface roughness of the heat sink is Ra25μm. The surface of the profile heat sink should meet the tolerance grade 9 accuracy. The verticality of the axis to the table should meet the tolerance grade 11 accuracy. The screw hole depth and installation slot size meet the requirements of Table 1. Table
Approved by the Ministry of Machinery and Electronics Industry in 1991—10—17 mm
Numbers and indicators
Installation dimensions
Installation slot dimensions
M5×12
M10×14
M12X16
M16X(1.5)×18
M20×(1.5)×18
Width×Height
10.0×4.0
Implementation in 1992—10—01
3.3 Insulation, fasteners and installation requirements
JB5781—91
Continued Table 1
Installation dimensions||t t||M12X16
M16×(1.5)X18
M20×(1.5)X18
M16X(1.5)X18
M20×(1.5)X18
M24X(1.5)X22
M20×(1.5)X18
M24X(1.5)X22
M30×(2.0)X24
M24×(1.5)×22
M30X(2.0)X24
3.3.1 Insulating parts and peripheral parts dedicated to radiator shall comply with the relevant provisions of GB8446.3. mm
Slot size
Width×Height
14.2×6.5
15.0×4.0
3.3.2The firm torque or firm pressure when installing the heat sink and the power semiconductor device shall comply with the provisions of the relevant detailed specifications. 3.3.3The size of the installation center positioning hole of the XF series heat sink table is 3.5mm in diameter and not less than 1.5mm in depth. 3.4Main performance parameters
3.4.1After the XF series heat sink is assembled with the simulation device (insulated tube core), it is tested for 1min under the conditions of ambient temperature 25±10C and relative humidity 85%. The withstand voltage between the cathode and anode shall not be lower than the following provisions, and there shall be no flashover phenomenon. When the distance between the cathode and anode is less than 26mm, it is 5000V (effective value), and when the distance between the cathode and anode is greater than or equal to 26mm, it is 8000.V (effective value).
: The main parameters of the radiator shall comply with the provisions of Table 2. 3. 4. 2
Parameters and indicators
(L=30,M5)
(L=60,M8)
(L-80,M10)1.9
(L=100,M10)
(L=70,M12)
(Z=100.M20)
(L=125,M20)
(L=150,M30)
JB5781—91
Continued Table · 2
(L=110)
(L=140)
(L=140)
(Z=180)
(L160)
and indicators
3.4.3The radiator manufacturer shall provide the characteristic curves of radiator thermal resistance, flow resistance and wind speed, radiator temperature rise and dissipated power in the technical documents related to the radiator.
3.4.4Material of radiator
It is recommended to use aluminum alloy with code LD31 or equivalent performance, and its chemical composition shall comply with the provisions of GB3190. Inspection rules
Radiator inspection is divided into two categories: quality consistency inspection and identification inspection. 4.1 Quality consistency inspection
4.1.1 Group A inspection (avoid batches)
Each batch of radiators must be inspected according to the items specified in Table 3 before leaving the factory. Table 3
Inspection items
Dimensions
Surface quality
Inspection method
Measure with a vernier caliper
Flatness and verticality are carried out in accordance with GB1958, and surface consistency is in accordance with relevant standards
Qualification criteria
Conform to GB/T11456.1
Conform to Article 3.2.1
Conform to Article 3.2.2
Sampling plan
Inspection level
Note: The specific sampling number of AQL is shown in Appendix A. If the batch inspection fails the initial submission, it can be resubmitted for re-inspection according to the strict inspection method, but it can only be resubmitted once.
4.1.2 Group C inspection (cycle)
The heat exchangers produced by finalization must be inspected at least every two years according to the items specified in Table 4. Table 4
Inspection items
Thermal resistance and flow resistance
Insulation test
Inspection method
According to GB8446.2
Add adjustable AC voltage to the specified value
In the sampling plan, n and c are the number of samples and the number of qualified judgments respectively. Qualified judgment
Conform to Article 3.4.2
Conform to Article 3.4.1
Identification inspection If the first sampling fails, it can be inspected again by adding samples according to Appendix B, but only once. ②
Identification inspection
Identification inspection is a series of complete inspections conducted on several samples of this series, and its purpose is to determine whether the manufacturer is capable of producing products that meet the requirements of the standard.
JB5781—91
When the design, process, or material is changed or when the production is resumed after suspension, an identification test shall be conducted. The identification test items shall be carried out in accordance with the items specified in Article 4.1. 5 Packaging, transportation, storage, and marking
5.1 Packaging
After the radiator has passed the inspection and obtained the certificate of conformity, it shall be properly packaged in accordance with the provisions of GB3199. This standard recommends the use of box packaging, 5.2 Transportation
The radiator shall be strictly protected from severe vibration and magnetic field during transportation to avoid damage. 5.3 Storage
The radiator should be stored in a dry and well-ventilated place. 5.4, ​​Marking
The following markings should be marked on the outside of the packaging box; a.
Product model and specifications:
Net weight;
Should be marked with the word "moisture-proof" or logo;
Address and name of the receiving unit;
Name of the shipping unit;
Date of shipment.
Certificate of conformity
The radiator must be accompanied by a certificate of conformity when it leaves the factory. Its contents include: a.
Name of the manufacturer;
Product model;Www.bzxZ.net
Product batch number:
Conclusions on the inspection of various indicators and the official seal of the inspection department; Standard number or contract number;
Date of inspection.
5.6 Acceptance
After receiving the radiator, the purchaser shall conduct an acceptance inspection in a timely manner. If any problems are found, they shall be raised to the supplier within three months and the supply and demand parties shall negotiate and deal with them.
JB5781—91
Appendix·A
AQL (acceptable quality level) sampling table
(Supplement)
AQL (acceptable quality level) sampling see Table A1
Number of samples
$·10~25
.51~90
151~280
281~500
501~1200
12013200
3201~10000
See Table B1 for additional sampling.
Initial sampling
Additional sampling
Additional number
(ng-n)
Appendix B
Additional sampling table
(supplement)
Qualified number
Self-cooling thermal resistance and heat sink weight of air-cooled radiator
Additional instructions:
JB5781—91
Appendix c
Self-cooling thermal resistance and heat sink weight of air-cooled radiator (Xin test piece)
This weight is shown in Table C1,
Heat sink weight (single piece, after drilling)||t t||(L=30,M5)
(L60,M8)
(L=100,M10)
(L=70,M12)
(L100,M20)
(L=125,M20)
(L=150,M30)
(L=110)
(L=140)
(L=140)
(L=160)
This standard is proposed and managed by the Xi'an Power Electronics Technology Research Institute of the Ministry of Machinery and Electronics Industry. This standard was drafted by the Xi'an Power Electronics Technology Research Institute of the Ministry of Machinery and Electronics Industry, Jiangyin Thyristor Accessories Factory and Shanghai Rectifier General Factory. The main drafters of this standard are Du Jimei, An Xianman, Chen Zhenyun, Liu Wei and Qiu Minxian.
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