This standard specifies the commonly used terms and definitions in the vacuum ion plating profession. This standard applies to vacuum ion plating and processes related to vacuum ion plating. JB/T 7505-1994 Ion Plating Terminology JB/T7505-1994 Standard download decompression password: www.bzxz.net
This standard specifies the commonly used terms and definitions in the vacuum ion plating profession. This standard applies to vacuum ion plating and processes related to vacuum ion plating.

Mechanical Industry Standard of the People's Republic of China
JB/T7505-94
Ion Plating Terminology
1994-10-25 Issued
Ministry of Machinery Industry of the People's Republic of China
1995-10-01 Implementation
Mechanical Industry Standard of the People's Republic of China
Ion Plating Terminology
This standard specifies the commonly used terms and definitions in the vacuum ion plating profession. This standard applies to vacuum ion plating and processes related to vacuum ion plating. 1 General Concepts
Mo vacuum coating
1.1 Vacuum coating
A method of obtaining a covering layer on a base surface through a vapor deposition process under vacuum conditions. Physical vapor deposition (PVD method) physical vapor deposition1.2
JB/T750594
A method of vaporizing the coating material and depositing it on the surface of the substrate to form a covering layer by physical methods (such as evaporation, sputtering, etc.). Substrate substrate
The supporting body of the coating.
Synonym: coating body.
Coating material coating material
The original material used to make the coating.
Synonym: coating material.
Sputtering material sputtering material
The material used as a sputtering target.
Synonym: target material.
Coating material coatings material
The material constituting the coating.
Synonym: coating material.
Coating rate coating rate
The amount of coating material deposited on a unit area of ​​the substrate surface per unit time. Synonym: deposition rate.
1.8Incident angle incident angle
The angle between the direction of the particle incident on the substrate surface and the normal of the incident point. evaporatingangle
Evaporation angle
The solid angle formed by the vapor flow leaving the evaporator surface. 1.10Sputtering
The process of using the momentum transferred by the energized particles to make the atoms of the coating material enter the gas phase. Ion bombardmentionbombardment
The process of ions impacting the electrode surface and interacting with the electrode. Ion bombardment cleaningionbombardmentcleaning1.12
The process of purifying and activating the substrate surface with the help of ion bombardment. Film-substrateinterfacefilm-substrateinterface1.13
Approved by the Ministry of Machinery Industry on October 25, 1994
Implemented on October 1, 1995
The interface formed between the film and the substrate.
Ionization rateionizationrate
JB/T7505-94
The percentage of ionized particles in the total number of particles in the ion plating process. Activation pole activationpole
In the ion plating device, an electron emitter added to increase the ionization rate. Evaporation rate evaporatingrate
The amount of coating material evaporated from the evaporation source per unit area per unit time. Bias bias
The bias voltage applied to the substrate that deviates from the zero potential. 2 Methods
2.1 Vacuum evaporation vacuum evaporating A vacuum coating method of heating and evaporating the coating material. 2.2 Reactive vacuum evaporation reactivevacuum evaporating A vacuum evaporation method of obtaining a covering layer of the desired chemical composition and structure through a gas phase reaction. 2.3 Simultaneous evaporation simultaneousevaporating A vacuum coating method in which different evaporation materials from one or more evaporation sources or sputtering sources are deposited on the substrate at the same time. 2.4 Induction evaporation inductionevaporating A coating method of evaporating the coating material by induction heating. 2.5 Electron beam evaporation electronbeamevaporating A coating method of evaporating the coating material by electron beam heating. Laser beam evaporationlaser beam evaporating2.6
A coating method of evaporating a coating material by heating with a laser beam. resistance heating evaporatingresistance heating evaporating
A coating method of evaporating a coating material by heating with resistance. 2.8 Arc evaporatingarce evaporating
A coating method of evaporating a coating material by arc discharge. 2.9 Ion beam evaporationion beam evaporatinga coating method of evaporating a coating material by heating with an ion beam. Hollow cathode plasma electron beam evaporationhollow cathode plasma-electron beam evaporating2.10
A coating method of evaporating a coating material by heating with a high-density plasma electron beam drawn from a hollow cathode. Hot cathode plasma electron beam evaporationhot cathode plasma-electron beam evaporating2.11
A film method of evaporating a coating material by heating with a high-density plasma electron beam drawn from a hot filament. Sputtering
A method of depositing a covering layer by sputtering.
Reactive sputteringReactive sputteringSputtering that introduces a chemical reaction.
2.14Bias sputteringSputtering that applies a bias voltage to the substrate.
2.15DC diode sputteringSputtering that applies a DC voltage between the two electrodes. 2.16AsymmetricAC sputtering
AsymmetricAC sputteringSputtering that applies an asymmetricAC voltage between the two electrodes. 2
RF diode sputteringSputtering that applies an RF voltage between the two electrodes. Triode sputteringTriode sputtering
Sputtering that introduces an active electrode between the two electrodes. Ion beam sputteringIon beam sputteringSputtering using an ion beam source.
Magnetron sputteringJB/T7505-94
Sputtering using a magnetic field to constrain the movement of electrons near the target surface. Ion platingionplating
A vacuum coating method in which a bias voltage is applied to the substrate to produce a continuous bombardment of ions on the substrate and the covering layer. Synonym: ion deposition.
Reactive ion platingreactiveionplatingion plating that introduces chemical reactions.
activated reactiveevaporationActive reactive ion plating (ARE)
Reactive ion plating using electron beam evaporation and activation by an activating electrode. Hollow cathode ion plating (HCD)hollowcathodedepositionion plating using hollow cathode evaporation.
Hot cathode ion platinghotcathodedepositionion plating using hot cathode evaporation.
Radio frequency ion plating (RFIP)radiofrequencyionplating2.26
Ion plating activated by radio frequency glow discharge. 2.27
Magnetron sputtering ion platingmagnetronsputteringionplatingion plating using magnetron sputtering evaporation source. 2.28Arc ion platingarcionplating
Ion plating using arc evaporation.
Cluster beam ion platingionizedclusterbeamdeposition2.29
Ion plating using heating evaporation to eject the coating material in the form of atomic clusters. 3 Apparatus
3.1Evaporation sourceevaporationsource
Device used to produce coating material.
Synonym: evaporator.
3.2 Target target
Electrode composed of sputtering material in a sputtering device. Magnetron target magnetrontarget
Target used for magnetron sputtering.
Arc source arcsource
Source used for arc evaporation.
Substrate holder substrateholderwwW.bzxz.Net
Device used to directly hold the substrate.
Heating device heating device
Device that heats the substrate to the required temperature. 3.7 Cooling device cooling device
Device that cools or limits the substrate to a certain temperature. Additional remarks:
JB/T7505-94
This standard was proposed by the National Technical Committee for Standardization of Metallic and Non-metallic Coatings. This standard is under the jurisdiction of the Wuhan Institute of Materials Protection, Ministry of Machinery Industry. This standard was drafted by Dalian University, Shenyang Institute of Metals, and Wuhan Institute of Materials Protection. The main drafters of this standard are Zhu Yingchen, Chen Weirong, Zhou Futang and Wen Lishi. People's Republic of China Machinery Industry Standard Ion Plating Terminology JB/T7505--94 Published by the Machinery Standardization Research Institute of the Ministry of Machinery Industry Printed by the Machinery Standardization Research Institute of the Ministry of Machinery Industry (PO Box 8144, Beijing 100081) Copyright reserved No reproduction allowed Format 880×12301/16 Printing Sheet 1/2 2 Words 8.000 First Edition October 1995 First Printing October 1995 Printing 00.001-500 Pricing 3.00 Yuan Number 94-282
Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.