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Military Standard of the Electronic Industry of the People's Republic of China FL5971
SJ20634-97
Test methods for electronic pastes performance1997-06-17Published
1997-10-01Implementation
Approved by the Ministry of Electronics Industry of the People's Republic of China1 Scope
1.1 Subject content
1.2 Scope of application
2 Reference documents
3 Definition
4 General requirements
4.1 Test conditions
4.2 Test report
4.3 Provisions for test method numbers
5 Detailed requirements
Method 101
Method 102
Method 103
Method 104
Method 201
Method 202
Method 203
Method 204
Method 205
Method 206
Method 207
Method 208
Method 301
Method 302
Method 303
Method 401
Method 402
Method 403
Method 404||tt ||Test method for viscosity of electronic paste
Test method for solid content of electronic paste
Test method for thickness of sintered film of electronic pasteTest method for square resistance of electronic paste…
Test method for temperature coefficient of resistor paste
Test method for short-time overload of resistor pasteTest method for constant temperature placement of electronic paste
Test method for power load of resistor paste
Test method for noise of resistor paste
Test method for steady-state leg heating of resistor paste
Test method for voltage coefficient of resistor paste
Test method for electrostatic discharge of resistor paste
Test method for adhesion of conductor paste
Test method for wettability of conductor paste
Test method for resistance to solder erosion of conductor pasteTest method for dielectric loss of dielectric paste
Test method for capacitance of dielectric paste
Test method for breakdown voltage of dielectric paste
Test method for insulation resistance of dielectric paste
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Military standard of the electronics industry of the People's Republic of ChinaTest methods for electronic pastes performance
Test methods for electronic pastes performance1 Scope
1.1 Subject content
This standard specifies the test method for the performance of electronic pastes. 1.2 Scope of application
This standard applies to the test of the performance of resistor paste, conductor paste and dielectric paste. Referenced documents
No provisions in this chapter
3 Definitions
No provisions in this chapter.
4 General requirements
4.1 Test conditions
Unless otherwise specified. All tests shall be conducted under the following conditions: 4.1.1 Standard atmospheric conditions for the test
- Ambient temperature: 15~35℃
b, relative humidity: 45%-75%;
SJ 20634-97
Air pressure: 86～106kPac
4.1.2 All tests shall be conducted in a clean laboratory without strong mechanical shock, vibration, electromagnetic interference, or chemically harmful atmosphere.
4.2 Test report
The test report shall include the following contents:
Sample number, type, batch number:
b, test environment temperature, humidity, air pressure; instrument model or accuracy:
d. Measurement results:
e. Operator;
The Ministry of Electronics Industry of the People's Republic of China issued on June 17, 1997 and implemented on October 1, 1997
f. Date.
4.3 Provisions on test method numbering
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The electronic paste performance test method (series) adopts independent abbreviations, and the numbering method is as follows: a. Method 100 series (101~104): General performance test method for electronic paste; b. Method 200 series (201~208): Resistance paste performance test method; e. Method 300 series (301~303): Conductor paste performance test method; d. Method 400 series (401~404): Dielectric paste performance test method. 5 Detailed requirements
Method 101
Test method for viscosity of electronic paste
1 Purpose
The purpose of this method is to determine the viscosity of the paste to ensure the printing performance of the paste. 2
Method summary
This method uses a suitable rotor to be inserted into the paste. The rotor is supported by a spring and driven by a motor to rotate at a certain speed in the paste. The spring is twisted due to the stress of the rotor rotating in the paste. This stress is detected by the rotation sensor and the viscosity value is directly displayed by the display. 3 Test cases
3.1 Water tank temperature: constant temperature (generally 25±1℃) or as specified in relevant standards. 3.2 Ambient temperature: 20~25℃ According to relevant standards 4
Test instruments and apparatus
Viscometer: Accuracy is ±1Pa*sa
4.2 Constant temperature circulating water tank: Connected to the water jacket of the viscometer test room, constant mixing circulating water, with an accuracy of ±1℃. 4.3 Tools: One rod-shaped overflow meter, one pair of tweezers and one sampling spoon. 5 Test procedure
Take 20g of finished slurry from a test batch and put it in a ground-mouth sample bottle. 5.2 Open the constant temperature circulating water tank to circulate the water in the water tank, test with a thermometer, and confirm that the water temperature reaches 25±1℃5.3 Place the sample bottle in the constant temperature water and let it stand for 48h. 5.4 Open the valve between the water tank and the viscometer test room to circulate the water. 5.5 Use alcohol cotton to clean the viscometer test tank and rotor respectively, and blow dry. 5.6 Take the sample bottle out of the warm water, adjust the viscometer level, put the sample into the test tank, and fix the rotor (use No. 14 rotor, the speed is 10z/min).
5.7 Turn on the power of the viscometer, wait for the digital display to stabilize, reset it to zero, and make various necessary settings. 2
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5.8 Turn on the rotor motor, press the stop button after 60s, read the data, and make a record. 5.9 Turn off the power of the viscometer and turn off the circulating water. 6 Allowable difference
The difference between two test results measured by the same operator in the same laboratory is not greater than 5Pa.So7 Notes
7.1 The instrument used in this method is Brookfield Digital Visco Meter (Eadol DV.I1). The test results will be different when using different types of instruments, rotors and speeds to test the viscosity of the slurry. 7.2 When installing the rotor, the rotor should be lowered into the liquid to be tested. Be careful not to generate bubbles when immersed, do not let the rotor collide with the wall of the wave container, and do not add force to the axis to avoid affecting the test results. Method 102
Test method for solid content of electronic slurry
1 Purpose
The purpose of this method is to determine the total amount of solid material so as to compare it with the amount of organic carrier in the slurry to obtain the relative weight. This method can check the weighing errors in the production of slurry, and can also be used to determine the loss of solvent in the slurry during use and storage.
2 Method Summary
This method changes the weight of the slurry under the condition of constant temperature increase in a certain temperature range through the volatilization of organic matter. The weight loss curve is printed by a printer, and the solid content is directly read from the weight loss curve. 3 Test instruments and apparatus
3.1 Microthermal balance: sensitivity is 0.001mg/min. 3.2 Microcomputer: with test software and printer. 3.3 Tools: tweezers, special spoon, special lead oxide glass set. 4 Test procedure
4.1 Turn on the power, turn on the microcomputer, and preheat the instrument for about 45 minutes. 4.2 Make appropriate adjustments to the various functions of the instrument. 4.3 Put the pre-burned aluminum oxide crucible with constant weight into the balance main unit, adjust the electric code, and reset it to zero. 4.4 Take it out from the balance, put the sample into the crucible, and put it into the balance. 4.5 Put the test floppy disk into the microcomputer and set the test sequence (set the temperature range, heating rate, etc. according to the regulations). 4.6 Turn on the power of the furnace (the temperature starts to rise at this time, and the temperature, sampling point, and weight loss line of the heating process are displayed on the microcomputer screen) and turn on the cooling fan.
4.7 When the reaction is over, the microcomputer screen will directly display it and turn off the power of the furnace. 3
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4.8 Place the printing paper, turn on the printer power, and automatically print out the slurry weight loss curve. 4.9 Turn off the power of all instruments.
5 Result calculation
The solid content of the slurry is directly read from the slurry weight loss curve. 6 Allowable difference
The difference between two test results measured by the same operator in the same laboratory is not more than ±3%. 7 Notes
7.1 The instrument used in this method is a WRT-2 microthermal balance. 7.2 The oxidation exhaust required for the test must be pre-burned at above 750°C and kept warm for 30 minutes before the test to achieve the desired effect and improve the accuracy of the test.
Method 103
Test method for the thickness of the sintered film of electronic slurry 1 Purpose
The purpose of this method is mainly to determine the thickness of the sintered film of the slurry. At the same time, it can also observe the surface roughness and the contour of the film of the slurry sintered film, monitor the quality of printing, etc. 2 Method Summary
The surface analyzer used in this method is designed to provide rate display and calculate average error, predict average height, and surface measurement. It uses a moving sensor to drive the diamond probe to pass over the surface of the film to be tested. The surface of the film is displayed by the recorder. The height between the reference plane and the film surface is determined by the recorder, which is the film thickness. 3 Testing Instruments
Surface shape analyzer and its matching recorder, with a resolution of 0.01um. 4 Product Preparation
4.1 Take a small amount of finished product slurry and screen print it on a 96% alumina ceramic substrate at 200-325 to form a certain geometric pattern.
The printed film is naturally leveled (10-15min), baked at (125℃, 10min), and sintered (the peak temperature and time are determined according to relevant regulations).
4.3 Number the samples to be tested.
5 Test procedure
5.1 Turn on the power of the surface analyzer and recorder, set the range (u level) and paper feed speed. 4
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SI2063497
5.2 Stack the sample firmly under the quartz probe, adjust the probe so that the pressure of the probe on the left and right sides of the membrane is balanced, put down the recording pen, and turn on the needle and paper feed switches.
5.3 After the quartz needle passes through the surface of the measured film, stop the needle and paper feed, and raise the recording pen. 5.4 Repeat steps 5.2 to 5.3 to measure all samples. 5.5 Turn off the power of the analyzer and recorder.
6 Nesting calculation
6.1 On the recording paper, mark the substrate surface position and the membrane surface position according to the compensation method. 6.2 Measure the distance between the two surface positions, which is the actual film thickness h. 6.3 Repeat this process for all samples.
6.4 Obtain the average thickness h:
Where: h is the average thickness.um;
h=hitw+hn
++(103—-1)
h1\-h.—the thickness of the nth sample, umn is the number of samples.
7 Allowable difference
The difference between two test results measured by the same operator in the same laboratory shall not exceed ±1μm. Notes
8.1 The instrument used in this method is TypeSF101 surface shape analyzer and recorder. 8.2 When testing the slurry sintering film thickness, it is mainly affected by the following factors: the area, shape, surface conditions (including relative cleanliness, roughness, hardness) of the film and the quality of the porcelain substrate. These factors should be considered when printing and measuring. Method 104
Test method for electronic paste square resistance
1
Paste square resistance is one of the main parameters of electronic paste. Accurate measurement is of great significance for manufacturing, use and research of electronic paste.
2 Method Summary
The principle of this method is that for printed sintered resistor (including conductor) film, its resistance ohm expression is: 1=0.1
Wherein: R—resistance value, α;
p——resistivity, n·cm
...(104-1)
L—film length, cm;
hfilm thickness, cm;
W—film width, cm;
Sfilm cross-sectional area, cm.
SJ 20634—97
When the printed sintered film is made of the same material and the same process conditions, the values of and can be approximately consistent, and the resistance value R only depends on the product). This ratio is called the square number (N). The average square resistance is calculated based on the square number of the graphic design and the measured resistance. For aspect ratio (g
Testing instruments
3.1 Ohmmeter: a digital meter with an accuracy of 0.1%, and a set of supporting test fixtures. 3.2 Film thickness meter: a film thickness tester with a resolution of 0.01um, and a supporting recorder. Sample preparation
The preparation method is shown in Method 103.
5 Test procedure
Turn on the power of the multi-purpose digital meter, preheat for 5 minutes, and make resistance test settings. Place the sample firmly on the fixture, and turn on the fixture and the multi-purpose digital meter. 5.2
Measure the resistance of all samples in turn by moving the fixture chuck and make records. 5.3
Turn off the power of the multi-purpose digital meter.
Use Method 103 to measure the film thickness of the actual sample. 5.5
Result calculation
According to the number of squares in the graphic design and the measured resistance value, the average square resistance R is calculated using the following formula: 6.1
Wherein: R-
average square resistance, 0/口;
N——number of squares;
#——number of resistors;
R—the first resistance value, 0
6.2According to the film thickness of the measured sample, the average value is calculated using method 103. 6.3Convert to the standard film thickness according to the following formula: RR,=
Wherein: R-standard square resistance, 0/
R-average square resistance, Q/;
h-measured average film thickness.μm:
h.standard film thickness, μm.
..·(104— 2)
(104—3)
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The standard film thickness of several pastes are shown in the table below:
Type of paste
Type of film
Thickness of film
7 Allowable difference
SJ20634—97
Paste for thick film pedals
Paste for chip resistors
The difference between two test results measured by the same operator in the same laboratory shall not exceed ±5%. 8 Notes
8.1 This method is used to test the square resistance of resistor paste and conductor paste. Resistor
8.2 The standard square resistance of the paste is calculated by converting the actual sintered film thickness, standard film thickness and actual square resistance, so accurate testing of sintered film is not allowed. The thickness of the conjunctiva can improve the test accuracy of this method. 8.3 The test samples of this method are generally specified to be 8, and the dispersion between samples is controlled within ±15%, or in accordance with relevant regulations. Method 201
Test method for temperature coefficient of resistor paste
1 Purpose
The purpose of this method is to determine the temperature coefficient of resistance of the resistor paste, so as to determine the relative change of the resistance value of the resistor at the test temperature to the resistance value at the reference temperature, that is, the change of the resistance value for every 1 degree change (increase or decrease) of temperature, and the temperature coefficient (TCR) is used to characterize this characteristic (the calculation formula is shown in 201-1). 2 Test miscellaneous parts
2.1 Reference temperature
The reference temperature (t) is 25 or in accordance with relevant standards. 2.2 Test temperature
The test temperature is divided into high temperature and low temperature.
High temperature: 125±3℃.
Low temperature: -55±3℃.
3 Test instruments
3.1 High and low temperature box: a high-precision temperature control box with an accuracy of ±1°C, and a set of matching sample taking and setting tools. 3.2 Ohmmeter: a digital meter with an accuracy of 0.1%. 3.3 Refrigeration cylinder: a liquid carbon dioxide cylinder or liquid nitrogen cylinder and other coolant cylinders and a set of matching pipes. Sample preparation
4.1 Take a small amount of finished resistor slurry and print it on a 96% aluminum oxide substrate with pre-fired electrodes through a 200~325 mesh screen to form a resistor film.
SJ20634—97
4.2 The printed film is naturally leveled (10~15min), dried (125C, 10min), and sintered (peak temperature and time are in accordance with relevant regulations).
4.3 Weld a 6~10cm tinned copper lead wire (0.6Smm) to each resistor to be tested, and clean it with alcohol for later use. 5 Test Procedure
5.1 Open the high and low temperature chamber door, take out the sample test slot, connect the lead wire of the test sample to the test slot, and clamp the lead wire with a hexagonal wrench.
5.2 Push in the test mold, close the chamber door, turn on the power of the temperature chamber, and set the reference temperature of 105 on the temperature controller.3 Turn on the heating or cooling switch. If cooling, the coolant cylinder should be turned on in advance. 5.4 After the temperature reaches the set temperature t, turn on the multi-purpose digital meter and make the value test setting. 5.5 After the temperature stabilizes for 30 minutes, measure its resistance value R1 and make a record. 5.6 Set temperature 2 on the camera controller. Generally, t is set to 125℃ or -55℃. 5.7 After the temperature reaches the set temperature t2 and stabilizes for 30 minutes, measure its resistance value Rz and make a record. 5.8 Turn off the power supply of the temperature box and the multi-purpose digital meter. Result calculation
Calculate the resistance temperature coefficient TCR according to the following formula: TCR - RR.
Where: TCR——resistance temperature coefficient 10-6/C; Rt—resistance value at base push temperature, Q;
R2——resistance rent value at test temperature, 0
t1——reference temperature,;
t2-test temperature,℃.
7 Allowable difference
t2 - ti
The difference between two test results measured by the same operator in the same laboratory shall not exceed ±10%. B Notes
-(201-1
8.1 The accuracy of the instrument used to measure resistance and the accurate measurement of the temperature value actually felt by the test sample are important factors in accurately testing the temperature coefficient of resistance.
8.2 Use correct test techniques, measuring wires of suitable materials and excellent fixtures to minimize resistance measurement errors caused by contact resistance, wire resistance and moisture condensation within the test range. 8.3 This method generally stipulates that the number of test samples is 8, and the difference between samples is controlled at ±15%, or in accordance with relevant regulations. 8
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1 Purpose
SJ 20634—97
Method 202
Test method for short-time overload of resistor paste The purpose of this method is to check the ability of resistors to withstand short-time overload. 2 Method Summary
This method is to apply a 5s overload voltage (the voltage is the smaller of 2~5 times the rated voltage and 2 times the component limit voltage) to the sintered resistor film and measure the resistance change rate. The overload voltage is generally: U = 2.5 YPR or U = 20Um, take the smaller one: P——rated power, W;
R—measured resistance, n;
U——overload voltage, V;
Um——component (electrode) maximum working voltage, V. 3 Test instruments
3.1 Overload voltage device: adjustable DC regulated power supply-station, timer. 3.2 Sample rack, a set of special test fixtures. 3.3 Ohmmeter: the loudness is 0.01%.
Sample preparation
Preparation method see method 201.
Test procedure bzxz.net
Turn on the adjustable DC regulated power supply for preheating.
5.2 Use a multi-purpose digital meter to measure the resistance value R1.
5 .3 Clamp the resistor on the fixture, connect the fixture to the voltage regulator. 5.4 Adjust the voltage regulator so that the output voltage is the required value (calculated in advance according to the overload voltage method). 5.5 Turn on the timer and set the timing. 5.6 Turn on the output switch to pressurize the product and turn on the timer. 5. After 75s, the output voltage is automatically disconnected.
5.8 Clamp another resistor on the fixture, adjust the applied voltage for 5s, and disconnect. 5.9 Repeat this process to measure all samples.
The sample to be tested should recover for at least 30 minutes, and then measure its resistance value Rz. 5.103
Result calculation
Calculate the resistance change rate △R/R according to the following formula:
. (202-1)
SJ20634-97
R2-RI×100%
AR/R(%)=
Where:△R/R——Change rate of value before and after pressure,%;R1—Resistance value before pressure,;
R2——Resistance value after pressure,0
7Allowable difference
The difference between two test results measured by the same operator in the same laboratory shall not exceed ±10%. Notes
(202-2)
8.1This method generally stipulates that the number of test samples is 8, and the difference between samples is controlled at 15%, or in accordance with relevant regulations. Method 203
Resistor paste constant temperature placement test method
1Self
The purpose of this method is to determine the influence of temperature on the performance of the resistor after the resistor has worked under constant temperature conditions for a period of time, so as to evaluate the quality of the resistor.
2 Method Summary
This method uses the resistance of the product to be measured before and after long-term constant temperature placement, and calculates the resistance change rate to evaluate the constant temperature placement performance.
3 Test conditions
3.1 Test temperature: generally 25±2C, or 125±3℃. 3.2 Test time: generally 1000h, or in accordance with relevant regulations. 4 Test instruments
4.1 Oven: a 0-300℃ temperature-controlled oven. 4.2 Ohmmeter: accuracy is 0.01%.
5 Sample preparation
Preparation method see method 201.
6 Test procedure
6.1 Turn on the oven and control the temperature to the required value (25℃ or 125C)6.2 Put the sample into the oven (note that the printed sintered film side is facing up). Keep it for 30min, measure its value R1, make a record, and start timing.
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SJ20634-97
R2-RI×100%
AR/R(%)=
Where:△R/R——Change rate of value before and after pressure,%;R1—Resistance value before pressure,;
R2——Resistance value after pressure,0
7Allowable difference
The difference between two test results measured by the same operator in the same laboratory shall not exceed ±10%. Notes
(202-2)
8.1This method generally stipulates that the number of test samples is 8, and the difference between samples is controlled at 15%, or in accordance with relevant regulations. Method 203
Resistor paste constant temperature placement test method
1Self
The purpose of this method is to determine the influence of temperature on the performance of the resistor after the resistor has worked under constant temperature conditions for a period of time, so as to evaluate the quality of the resistor.
2 Method Summary
This method uses the resistance of the product to be measured before and after long-term constant temperature placement, and calculates the resistance change rate to evaluate the constant temperature placement performance.
3 Test conditions
3.1 Test temperature: generally 25±2C, or 125±3℃. 3.2 Test time: generally 1000h, or in accordance with relevant regulations. 4 Test instruments
4.1 Oven: a 0-300℃ temperature-controlled oven. 4.2 Ohmmeter: accuracy is 0.01%.
5 Sample preparation
Preparation method see method 201.
6 Test procedure
6.1 Turn on the oven and control the temperature to the required value (25℃ or 125C)6.2 Put the sample into the oven (note that the printed sintered film side is facing up). Keep it for 30min, measure its value R1, make a record, and start timing.
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SJ20634-97
R2-RI×100%
AR/R(%)=
Where:△R/R——Change rate of value before and after pressure,%;R1—Resistance value before pressure,;
R2——Resistance value after pressure,0
7Allowable difference
The difference between two test results measured by the same operator in the same laboratory shall not exceed ±10%. Notes
(202-2)
8.1This method generally stipulates that the number of test samples is 8, and the difference between samples is controlled at 15%, or in accordance with relevant regulations. Method 203
Resistor paste constant temperature placement test method
1Self
The purpose of this method is to determine the influence of temperature on the performance of the resistor after the resistor has worked under constant temperature conditions for a period of time, so as to evaluate the quality of the resistor.
2 Method Summary
This method uses the resistance of the product to be measured before and after long-term constant temperature placement, and calculates the resistance change rate to evaluate the constant temperature placement performance.
3 Test conditions
3.1 Test temperature: generally 25±2C, or 125±3℃. 3.2 Test time: generally 1000h, or in accordance with relevant regulations. 4 Test instruments
4.1 Oven: a 0-300℃ temperature-controlled oven. 4.2 Ohmmeter: accuracy is 0.01%.
5 Sample preparation
Preparation method see method 201.
6 Test procedure
6.1 Turn on the oven and control the temperature to the required value (25℃ or 125C)6.2 Put the sample into the oven (note that the printed sintered film side is facing up). Keep it for 30min, measure its value R1, make a record, and start timing.
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