This standard applies to flame retardant copper-clad epoxy glass cloth laminates for military printed circuit boards. SJ 20224-1992 Detailed specification for flame retardant copper-clad epoxy glass cloth laminates for printed circuit boards SJ20224-1992 Standard download decompression password: www.bzxz.net

Military Standard of Electronic Industry of the People's Republic of China FL
For Printed Wiring Boards
SJ 20224—92
Detail specification for
epoxide woven glass fabric copper-clad laminatedsheets of flammability resistancefor printed wiring boards
1992-issued
1992-implemented
issued by the Commission of Science, Technology and Industry for National Defense
Military Standard of Electronic Industry of the People's Republic of China Detail specification for
epoxidewoVenglass fabric copper-clad laminatedsheets of flammabiliey resistancefor printed wiring baards
SJ 20224---92
All requirements for flame-retardant copper-clad epoxy glass cloth laminates for printed circuit boards specified in this specification are specified by this specification and the general specification GJB ××××. 1 Scope
1.1 Subject content
This specification specifies the performance requirements, condition treatment and test conditions for flame-retardant copper-clad epoxy glass cloth laminates (GF) for printed circuit boards.
1.2 Scope of application
This specification is applicable to flame-retardant copper-clad epoxy glass cloth laminates for military printed circuit boards. t.3 Classification
Thickness of foil-clad laminate mm
(expressed by substrate thickness)
Quality of steel foil
2 Referenced documents
GIB ××X
3 Requirements
38.76.[14,152,229,305,610,915,1220,1525 General specification for metal-clad laminates for printed circuit boards 3. 1 Performance requirements, conditioning and test conditions Performance requirements, conditioning and test conditions are specified in Table 1. 1992-－Promulgated by the National Defense Science, Technology and Industry Commission 1992-－Implementation
TYKAONKAca-
38gm2 copper
As-received state
After thermal stress
Under high humidity
After exposure to process bath
76g/m2 copper
As-received state
After thermal stress
Under high temperature
After exposure to process solution
114g/m2
Delivery state
After thermal stress
At high temperature
After exposure to process solution
152gm copper
Delivery state
After thermal stress
At high temperature
After exposure to process solution
229g/m2 copper
Delivery state
After thermal stress
At high temperature
After exposure to process solution
305gm2 copper
Acceptance state
After thermal stress
At high temperature
After exposure to process solution
SJ 20224-92
Table 1 Performance requirements and test conditions
Conditioning
Test conditions
125°℃
125°℃
125°℃
125°℃
125°℃
Thickness of cladding
(expressed in terms of base material thickness)
Requirement clauses in the general specification
|tt||Method clauses in the general specification
610g/m2 steel
Acceptance status
After thermal stress
At high temperature
After exposure to process solution
915, 1220 and
1525g/m2 copper
Acceptance status
After thermal stress
At high temperature
After exposure to process solution
2. Volume resistivity M2-cm
After room temperature and high humidity, not less than
After high temperature and high humidity, not less than
At high temperature, not less than
3. Surface resistivity MS2
After room temperature and high humidity, not less than
After high temperature and high humidity, not less than
At high temperature, not less than
4. Dimensional stability mm/mm
Not more than
After thermal stress
5. Water absorption %
Not less than
6. Breakdown creepage kv
(parallel to the board surface, step-by-step voltage rise)
Not less than
SJ 20224--92
Continued Table 1
Conditional treatment
Test conditions
125°℃
125°℃
C-96/35/90
E-24/1 25
C-96/35/90
E-24/125bzxZ.net
E-4/105+A
E-2/50+A
E-1/105+
des+D-|| tt||D-48/50+D
Jiangnan foil thickness
(expressed as base material thickness)
0.000750.0005
Thickness water absorption
General specification
General specification
Method clause
Requirement clause
TKAONYKACa-
7. Breakdown strength kV/mm
(perpendicular to the board surface) not less than
Dielectric constant
at 1 MHz is not greater than
Dielectric loss tangent
at 1MHz is not greater than
at 1MHz is not greater than
at 50 MHz is not less than
11.Bending strength MPa
longitudinal not less than
transverse not less than
12.Arc resistance S
not less than
13.Combustibility
(vertical method)
SJ 20224-92
Continued Table 1
Conditioning
Test conditions
D-48/50+D
C-40/23/50
C-40/23/50
D-24/23
D-48/30+D
E-24/125+
Note: 1) See GJB Section 4.7.1, 4.2 and Table 27. Foil thickness
(expressed in terms of substrate thickness)
The flame shall be extinguished before reaching the upper marking line
or in accordance with
relevant regulations
2) Test condition E-24/125+des is only applicable to specimens with a thickness of 0.5mm and thicker. 3.2 Internal markings
When required, the internal markings shall be red. Additional notes:
This specification is proposed by China Electronics Industry Corporation. This specification is under the jurisdiction of the Electronic Standardization Institute of the Ministry of Machinery and Electronics Industry. This specification was drafted by the Electronic Standardization Institute of the Ministry of Machinery and Electronics Industry and the State-owned Qiquan Factory. The main drafters of this specification: Tong Xiaoming, Zhu Hongjiao. Project code: Science and Technology Commission Project No.: 90152. -4—
In the general specification, the
Requirement clauses
In the general specification, the
Method clauses
are
4.8.3.17.1
4.8.3.17.2
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