GB/T 4588.1-1996 Sectional specification for single-sided and double-sided printed boards without metallized holes
Some standard content:
National Standard of the People's Republic of China
Single and double sided printed boards with plain holes
Scetional specification: single and double sided printed boards with plain holesGB/T 4588:1 1996
LEC/PQC89:1990
Agency GB 4588. 1-84
This standard is equivalent to the International Electrotechnical Commission's electronic component quality assessment system standard IEC/PQC89 & Single and double sided printed boards with plain holes (made in 1990). 1 Overview
IEC 326-4 is the IEC standard for single and double sided printed boards with plain holes. The following documents include this standard and the supplementary standards necessary for evaluating printed boards according to the European Committee for Electrotechnical Standardization (C.ENEL.EC) electronic component quality assessment system. These standards are consistent with GB/T162611996 General Specification for Printed Boards. 1.1 Scope and Purpose
This document is a section specification (SS) for single-sided and double-sided printed boards without metallized holes. When they are prepared to install components, their manufacturing methods do not need to be considered. This specification specifies the performance and test methods evaluated by capability approval tests and quality consistency inspections (batch by batch and periodic). 1.2 Related documents
IEC68 Basic Environmental Test Procedures
IEC 194 Printed Circuit Technical Specifications and Definitions
IEC 249 Metal foil substrates for printed circuits 1EC321 Guide to the design and use of components for mounting on printed boards IEC326-2 Test methods for printed boards
IEC326-3 Design and use of printed boards
GB/T16261—1996 General specification for printed boards
GB/T4588.2—1996 Sectional specification for single-sided and double-sided printed boards with metallized holes 2 General
This section specification (SS) applies to single-sided and double-sided printed boards without metallized holes: they must be made The following detailed specifications are defined as the basis for the capability detailed specification (CapIDS) It is applicable to special materials such as the provisions of IEC249-2 and is used in the capability approval process. If necessary, there should be a capability detailed specification (CapTS) for each material. The capability detailed specification (CapDS) can be issued by international or national organizations or manufacturers. User detailed specifications (CS) are formulated. It is applicable to the production of printed boards in accordance with Part 5 of GB/T15261-1996: It is usually formulated by the user and numbered in his own system. GB/T16261 and Part I of CECC 00114° specify advanced details. Adoption instructions:
1_The newly issued CEC core (0114 part is the original CECC0010 Part II, approved by the State Bureau of Technical Supervision on March 22, 1996 and implemented on October 1, 1996
GB/T 4588.1-1996
Table 1 specifies the basic properties that are generally considered to be important for single-sided and double-sided printed boards without metallized holes and the appropriate methods to prove these properties. Table I specifies additional properties that may be important for certain single-sided and double-sided printed boards without metallized holes and/or certain applications and the appropriate methods to prove these properties. If necessary, the relevant specifications can quote properties and methods from Table 1. For tests that must be specified in the relevant specifications, they are marked with an asterisk in the relevant column, and the provisions of these details should be consistent with (IEC326-2).
Table I specifies the properties that can be specified. The specified comprehensive test pattern (CTP) is used as the capability identification component. Table I specifies the data for quality consistency inspection. These tables specify the test sequence. Unless otherwise specified, the tests can be carried out in any order. 3 Test specimens
3.1 Capability approval
3.1.1 Basic capability
The basic capability test shall be carried out on the comprehensive test pattern specified in Chapter 8. 3.1.2 Enhanced capability
The performance specified in 3.5.3 of GB/T16261-1996 shall be used. The various arrangements of the comprehensive test pattern are shown in Chapter 8. 3.1.3 Maintenance of Capability Approval
The provisions of 3.8 of CB/T16261-1996 shall apply. 3.2 Quality-Conformity Inspection
Unless otherwise specified, batch-by-batch inspection and periodic inspection may use product boards and/or specially designed test patterns. Specially designed test patterns may be included in the panel. They may be designed based on the appropriate patterns in the comprehensive test diagram in Chapter 8. Agreement between the manufacturer and the user is usually necessary. 4 Related Specifications
The term "related specifications" means the product specifications for an actual printed board, that is, the specifications applicable to specific materials and technologies. The relevant specifications shall include the information necessary to clearly and completely specify the printed board, preferably in accordance with the provisions of IEC326-3. Care should be taken to avoid unnecessary provisions. The permissible deviations should be stated wherever they are really necessary. When the nominal value without deviation or the simple maximum or minimum value is sufficient, only the nominal value without deviation or the simple maximum or minimum value should be specified. When the deviation is required only in certain areas or parts of the printed board, only these areas or parts should be specified. If several levels of deviation are possible, it is best to choose from the levels specified in IEC 326-3. In the event of a discrepancy between the user's detailed specification (CDS) and any other related specifications (such as RS, GS or SS), the user's detailed specification (CDS) shall prevail.
5 Printed board properties
The basic properties of single-sided and double-sided printed boards without metallized holes are specified in Table I. The additional properties of single-sided and double-sided printed boards without metallized holes are specified in Table II. Performance
General inspection
Consistency, identification symbols
Appearance and processing quality
Defects on the wire
Residues between the wires
Dimension inspection
Dimensions of the cover
Printed board bridge head integrity
Slots, gaps
Wire width
Wire spacing
TEC: 326-2
Test conductor
1b or lc
GB/T 4588.1—1996
Basic performance
Comprehensive tests specified in the relevant specifications
Attached test
Graphic specimens
Graphics, markings, symbols, materials and coatings shall comply with the relevant specifications and shall not have obvious defects
They shall be properly tested according to the general best process.
Cracks or breaks shall be particularly noted. Defects such as holes or edge damage are permitted as long as the
width of the conductor or the
reduction of the leakage path between conductors does not exceed the provisions of the relevant specifications, such as 20% or 35%.
Where necessary, test method 2a shall be used and verified by dimensional inspection
as long as the reduction of the leakage path between conductors! Where necessary, it should not exceed 20% of the original design or be not less than the distance requirement of the circuit using test method 2a+. Residual metal particles are allowed to be verified by small size inspection. The size and tolerance of the outer shape should comply with the relevant specifications. The nominal thickness of the electrode should comply with the relevant specifications. The overall size and deviation of the board should comply with the relevant specifications. The nominal diameter and tolerance of the mounting holes and components should comply with the relevant specifications. The various specified sizes given in the relevant specifications should be combined. As long as the reduction of the wire width does not exceed the relevant specifications, such as 20 or 35%, defects such as holes or reverse edge loss are allowed. The length L of the defect shall not be greater than 5 or 5 of the wire width. mm, the smaller of the two tests shall prevail (see Figure 1). The dimensions of the support shall comply with those specified in the relevant specifications. The total plate thickness and deviation shall be in accordance with IEC:322. The recommended hole size and deviation series are given in the N-centering document IEC326-3. If there is no obvious difference, the corresponding hole size and deviation series in the IEC326-3 standard may be adopted. The misalignment of the plate and the position deviation of the hole center are measured. Electrical test Insulation resistance Pretreatment Measured under standard atmospheric conditions According to IEC 6S-2-3 test Ca Steady-state humidity heat treatment or according to
IEC 68-2-38 Test 2/AD:
Combination temperature/mixing cycle test
Under high temperature conditions
Mechanical property test
Peel strength
Measured under standard gas conditions
High overflow
Pull-off strength
Pull-off neck
Warp
Other tests
Bond layer to
Tape method
Layer thickness
Printed contact piece
Solderability
IEC 325-2
Test number
GB/T 4588.1—1996
Continued table!
There are tests specified in the relevant specifications
Except for the test pattern test
The connection plate should not be damaged, and the connection between the connection plate and the conductor should not be disconnected
The center of the hole should be within any deviation range specified in the relevant specifications
It should comply with the relevant regulations
The separation strength should comply with the relevant specifications
The peel strength should comply with the relevant specifications
During this operation, the connection salt should not fall off, and the pull-off strength should not be less than the specified value in the relevant specifications
The radius of curvature should not be less than the actual value in the relevant specifications
Except for the bond layer and the slippery part, there should be no bond sticking to it after the tape is pulled off the conductor
The thickness should comply with the requirements Relevant specifications: The solder should have smooth and uneven surfaces. Scattered defects such as pinholes, non-wetting pots or semi-wetting areas should not exceed about 3%. Defects should not be concentrated in one area. Measure the insulation limit at high temperature before and after environmental treatment as specified in relevant specifications. Relevant specifications stipulate appropriate processing conditions. A) When the supply and demand parties agree to use inactive flux, the acceptance conditions such as after rapid aging. B) When the supply and demand parties agree to use active flux, the acceptance conditions and after accelerated aging are accompanied by solvent resistance and flux resistance. Note: * Chapter 2 of Ni.
Test number of HEL:326-2
GR/T 4588.1-1996
Continued Table 1
Comprehensive test specified in relevant specifications
Additional test age pattern Test strip
Solderable: The test piece should be wetted within 2 seconds. When the test piece is coated with a temporary coating of protective agent, the sample should be wetted within 3 seconds. Non-active flux shall be in accordance with the provisions of 6.6.1 of TEC
68-2-20
"Semi-solderable: The sample is in contact with the molten solder for 5~6 s After that, there should be no semi-wetting phenomenon. The sample should be wetted within 4 seconds. Semi-weldable: the sample should be in contact with the molten solder for 5 to 6 seconds. After, there should be no semi-wetting phenomenon
When there is or is not provided with protective solderability
and soldering: the bottom of the specimen is wetted within 2s
Semi-solderability: After contacting with olefin molten solder for 5-6s, there should be no semi-wetting phenomenon
There should be no following phenomena:
Bubbling or delamination:
Irregular barrier layer or printed material area
Desorption:
Dissolution:
Obvious discoloration
Acceptable:
a) The mark is not damaged:
b) The mark is weakened; but it is still recognizable
Rejected:
a) The mark cannot be recognized or disappears;
6> There is doubt when identifying the mark. The mother may be wrong, such as: RP-T3; FF: CGO
Determine appropriate solder
Suitable flux (0.2%)
According to the provisions of 6.6.2 in TFC682.20
Determine appropriate conditions in the relevant specifications
Dimensional inspection
Graphic and position relative to reference
Standard position
Electrical test
Wire resistance
Withstand current
Withstand current
Withstand voltage
Frequency drift
According to the provisions of IEC 68-2-3 Test Ca: Steady-state damp heat
Parts treatment
Other tests
Layer adhesion
Friction method
CB/T 4588. 1-1996
[Defect length in the figure
Table additional performance (only for assessment when special requirements are required) Test guide for the comprehensive test specified in the relevant specification
IEC326-2: Additional test ridge graphic test selection
The position should comply with the details specified in the relevant specification
This is usually not measured in years
, because of its importance! The positional relationship between the energy pattern and the hole controls the minimum radial width of the connection plate. When special requirements are required, the deviation given in the IEC 326-3 standard should be adopted. The electrical insulation should comply with the relevant standard regulations. The wire should not be burned, there should be no discoloration, there should be no obvious overheating, there should be no spark discharge, the frequency shift should not exceed the limit specified in the specification, and there should be no signs of bubbling or shedding in the induction. Porosity Gas bomb test Porosity Rate
Electrical image method
Plating purity (parts other than plugs)
Note: *See Chapter 2.
6 Capacity test plan
TEC326-2
Test number
GB/T4588.11996
Continued Table 1
! Comprehensive test specified in relevant specifications
Additional test pattern selection
Should comply with relevant specifications
Should comply with relevant specifications
Should comply with relevant specifications
Performance and requirements to be identified in the capacity test, see Table 1 and Table 1 in Chapter 5 . The additional capacity should be in accordance with the provisions of 3.5.3 of GB/T16261-1996. The various arrangements of the comprehensive test pattern (CTP) specimens and the comprehensive test pattern are shown in Chapter 8 and Figure 2.
The capacity test plan is shown in Table 2.
Table Capacity Test Plan
Identification Symbols
Work Quality
Wire Defects
Residues between Wires
Dimension Inspection
Size of the Board||t t||Warp
Printed plug thickness
Wire width
Wire spacing
Uneven axis
Hole and land
Electrical test
Test number Allowable failure number
Sample for basic capability
Stimulation and test pattern
Before cutting
9 complete
Before cutting
9 complete
9 samples K
9 samples A|| tt||9 samples F
9 samples A
Explanation of additional capabilities
: Larger overall dimensions
Large plate thickness to aperture ratio
Minimum width
or greater distance
Insulation resistance
After hot flush
Mechanical tests
Residual strength
Pull-off strength
Non-metallized hole connection land
Other tests
Plating Adhesive strength
Coating thickness
Printed contact
Solderability
Connecting plate
Acceptance state.0.2% active flux
Connection number
Acceptance state, non-active flux
Connecting plate
After accelerated aging, non-active flux
Connecting plate
After accelerated aging, 0.2% active
Test number
The total number of failures allowed for all tests is 3.
7 Quality consistency inspection
GB/T4588.1-1996bZxz.net
Continued Table 1
Allowable number of failures
Test pieces for basic capability
Number and sample pattern
; 3 samples E
3 samples G
3 samples 」
3 samples K
3 samples K
9 samples H
9 samples A
The performance and requirements of the quality consistency test are shown in Table 1 and Table I of Chapter 5. The division of the inspection group is shown in Section 4.3 of GB/T16261-1996. Description of additional capability
Commercial
High mix
9 specimens H
i9 specimens A
9 specimens H
9 specimens A
9 specimens H
9 specimens A
For the composition of the inspection lot of printed boards, see 4.1 of GB/T 16261-1996. For the inspection lot of small batches of profitable (or) expensive printed boards, see 4.2 of GB/T 16261--1996.
For the assessment levels, see the table.
For the formation of assessment level B (any intermediate level between level A and level C), see 5.2.5 of GB/T 16261--1996. A higher assessment level D can be formed by using level C and specifying additional tests or more stringent II./AQL, see 5.2.5 of GB/T 16261-1996.
Age inspection group
A1 Group Visual inspection
Consistency
Chinese symbols
Machining quality
Wire defects
Wire loss
A2 Dimensional inspection
Board dimensions
Pants, defects11
Wire width
Wire spacing
Non-axiality of holes and lands
Deviation of hole center position
A3 Group Supplementary test spare group
Included information
Group dimensional interchangeability
B1 Group, thickness of printed board plug part
warpage
solderability
thermal shock
(not applicable)
mechanical property test
braking strength
standard test atmospheric conditions
pull-off strength
non-metallized random connection plate
surface coating test
coating adhesion
coating thickness
printed connector
136 Group of additional tests Applicable group
Included in
RCE
GB/T 4588.1-1996
Assessment level
Level A
5-21 2. 5
2２is１
14aS-2
13a $-12.5
According to 3. 2. 5 of GB/T 15261:-1996
Form
Results of A2 and A3
According to 2. Form of G1/T 162--1936
Or
from B2 groupResults from B1, B2, B1, R5, B6 groupResults from level C
$-4: 2.5
Results of A2 group
from BI, 2,
B5 periodResults from GB/T 5.3.5 Form of 16261-1996 Results of A2 and A3 groups According to (G3/T [626]-1996: .2.5 Form of 16261-1996 Results of B1, B2, R4, R5, B6 groups Verification and correction Test every 3 months Insulation resistance Before and after condensation test Flux and flux Test every 12 months (not applicable) Repeat interval spare group Information to be included in RCE B Test pattern - test board GR/T 4588.11996
Continued Table n
Level A
Results from C1 group
The pattern used for the test is the test pattern. The test pattern can be
a part of the conductive pattern on the product board formed
from C1, C2, C3 group
according to 5.2.5 of GB/T 16261--1996
(used when using printed boards): ——-Special test pattern specially designed and prepared only for the splash test day. The test pattern may be arranged on the following boards: Horizontal C
Results from C1
Formed according to 5.2.5 of CB/T16261-1996
Results from C1, C2, C3
Test coupon (printed board or part of the board, usually cut before the printed board is used, see 05-03 of IEC194); separate test board (see 05-02 of IFC194). 8.1 Application of test patterns and test boards
8.1.1 Capability approval test
The basic capability shall be tested using the integrated test pattern specified in 8.2. When the manufacturer considers that the board size (effective area) is larger than the size of the test board with an integrated test pattern (105mm×90mm) in terms of additional capability, the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T 16261-1996.8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. The use of special test patterns, whether part of the comprehensive pattern shown in 8.2 or specially designed, should be negotiated between the supplier and the buyer.8.1.3 Product testing
When testing product boards, the manufacturer can use any test pattern (conductive pattern on the product board or any specified test pattern).8.2 Comprehensive test pattern (CTP)
The comprehensive test pattern (CTP) should be used when assessing capability. See 3.5 of GB/T 16261-1996. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connecting pad solderability
Insulation resistance
Wire accuracy
Nominal aperture
Nominal connecting pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connecting pad
GB/T4588.1—1996
Nominal aperture
Nominal connecting pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.3. Explanation of additional capability
Commercial
High mix
9 specimens H
i 9 specimens A
9 specimens H
9 specimens A
9 specimens H
9 specimens A
The composition of the inspection batch of printed boards is shown in 4.1 of GB/T 16261-1996. The inspection batch of small batches of profitable (or) expensive printed boards is shown in 4.2 of GB/T 16261--1996.
The assessment levels are shown in the table.
The formation of assessment level B (any intermediate level between level A and level C) is shown in 5.2.5 of GB/T 16261--1996. A higher assessment level D can be formed by using level C and specifying additional tests or more stringent II./AQL, see 5.2.5 of GB/T 16261-1996.
Age inspection group
A1 Group Visual inspection
Consistency
Chinese symbols
Machining quality
Wire defects
Wire loss
A2 Dimensional inspection
Board dimensions
Pants, defects11
Wire width
Wire spacing
Non-axiality of holes and lands
Deviation of hole center position
A3 Group Supplementary test spare group
Included information
Group dimensional interchangeability
B1 Group, thickness of printed board plug part
warpage
solderability
thermal shock
(not applicable)
mechanical property test
braking strength
standard test atmospheric conditions
pull-off strength
non-metallized random connection plate
surface coating test
coating adhesion
coating thickness
printed connector
136 Group of additional tests Applicable group
Included in
RCE
GB/T 4588.1-1996
Assessment level
Level A
5-21 2. 5
2２is１
14aS-2
13a $-12.5
According to 3. 2. 5 of GB/T 15261:-1996
Form
Results of A2 and A3
According to 2. Form of G1/T 162--1936
Or
from B2 groupResults from B1, B2, B1, R5, B6 groupResults from level C
$-4: 2.5
Results of A2 group
from BI, 2,
B5 periodResults from GB/T 5.3.5 Form of 16261-1996 Results of A2 and A3 groups According to (G3/T [626]-1996: .2.5 Form of 16261-1996 Results of B1, B2, R4, R5, B6 groups Verification and correction Test every 3 months Insulation resistance Before and after condensation test Flux and flux Test every 12 months (not applicable) Repeat interval spare group Information to be included in RCE B Test pattern - test board GR/T 4588.11996
Continued Table n
Level A
Results from C1 group
The pattern used for the test is the test pattern. The test pattern can be
a part of the conductive pattern on the product board formed
from C1, C2, C3 group
according to 5.2.5 of GB/T 16261--1996
(used when using printed boards): ——-Special test pattern specially designed and prepared only for the splash test day. The test pattern may be arranged on the following boards: Horizontal C
Results from C1
Formed according to 5.2.5 of CB/T16261-1996
Results from C1, C2, C3
Test coupon (printed board or part of the board, usually cut before the printed board is used, see 05-03 of IEC194); separate test board (see 05-02 of IFC194). 8.1 Application of test patterns and test boards
8.1.1 Capability approval test
The basic capability shall be tested using the integrated test pattern specified in 8.2. When the manufacturer considers that the board size (effective area) is larger than the size of the test board with an integrated test pattern (105mm×90mm) in terms of additional capability, the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T 16261-1996.8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. The use of special test patterns, whether part of the comprehensive pattern shown in 8.2 or specially designed, should be negotiated between the supplier and the buyer.8.1.3 Product testing
When testing product boards, the manufacturer can use any test pattern (conductive pattern on the product board or any specified test pattern).8.2 Comprehensive test pattern (CTP)
The comprehensive test pattern (CTP) should be used when assessing capability. See 3.5 of GB/T 16261-1996. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connecting pad solderability
Insulation resistance
Wire accuracy
Nominal aperture
Nominal connecting pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connecting pad
GB/T4588.1—1996
Nominal aperture
Nominal connecting pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.3. Explanation of additional capability
Commercial
High mix
9 specimens H
i 9 specimens A
9 specimens H
9 specimens A
9 specimens H
9 specimens A
The composition of the inspection batch of printed boards is shown in 4.1 of GB/T 16261-1996. The inspection batch of small batches of profitable (or) expensive printed boards is shown in 4.2 of GB/T 16261--1996.
The assessment levels are shown in the table.
The formation of assessment level B (any intermediate level between level A and level C) is shown in 5.2.5 of GB/T 16261--1996. A higher assessment level D can be formed by using level C and specifying additional tests or more stringent II./AQL, see 5.2.5 of GB/T 16261-1996.
Age inspection group
A1 Group Visual inspection
Consistency
Chinese symbols
Machining quality
Wire defects
Wire loss
A2 Dimensional inspection
Board dimensions
Pants, defects11
Wire width
Wire spacing
Non-axiality of holes and lands
Deviation of hole center position
A3 Group Supplementary test spare group
Included information
Group dimensional interchangeability
B1 Group, thickness of printed board plug part
warpage
solderability
thermal shock
(not applicable)
mechanical property test
braking strength
standard test atmospheric conditions
pull-off strength
non-metallized random connection plate
surface coating test
coating adhesion
coating thickness
printed connector
136 Group of additional tests Applicable group
Included in
RCE
GB/T 4588.1-1996
Assessment level
Level A
5-21 2. 5
2２is１
14aS-2
13a $-12.5
According to 3. 2. 5 of GB/T 15261:-1996
Form
Results of A2 and A3
According to 2. Form of G1/T 162--1936
Or
from B2 groupResults from B1, B2, B1, R5, B6 groupResults from level C
$-4: 2.5
Results of A2 group
from BI, 2,
B5 periodResults from GB/T 5.3.5 Form of 16261-1996 Results of A2 and A3 groups According to (G3/T [626]-1996: .2.5 Form of 16261-1996 Results of B1, B2, R4, R5, B6 groups Verification and correction Test every 3 months Insulation resistance Before and after condensation test Flux and flux Test every 12 months (not applicable) Repeat interval spare group Information to be included in RCE B Test pattern - test board GR/T 4588.11996
Continued Table n
Level A
Results from C1 group
The pattern used for the test is the test pattern. The test pattern can be
a part of the conductive pattern on the product board formed
from C1, C2, C3 group
according to 5.2.5 of GB/T 16261--1996
(used when using printed boards): ——-Special test pattern specially designed and prepared only for the splash test day. The test pattern may be arranged on the following boards: Horizontal C
Results from C1
Formed according to 5.2.5 of CB/T16261-1996
Results from C1, C2, C3
Test coupon (printed board or part of the board, usually cut before the printed board is used, see 05-03 of IEC194); separate test board (see 05-02 of IFC194). 8.1 Application of test patterns and test boards
8.1.1 Capability approval test
The basic capability shall be tested using the integrated test pattern specified in 8.2. When the manufacturer considers that the board size (effective area) is larger than the size of the test board with an integrated test pattern (105mm×90mm) in terms of additional capability, the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T 16261-1996.8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. The use of special test patterns, whether part of the comprehensive pattern shown in 8.2 or specially designed, should be negotiated between the supplier and the buyer.8.1.3 Product testing
When testing product boards, the manufacturer can use any test pattern (conductive pattern on the product board or any specified test pattern).8.2 Comprehensive test pattern (CTP)
The comprehensive test pattern (CTP) should be used when assessing capability. See 3.5 of GB/T 16261-1996. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connecting pad solderability
Insulation resistance
Wire accuracy
Nominal aperture
Nominal connecting pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connecting pad
GB/T4588.1—1996
Nominal aperture
Nominal connecting pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.2.5.
Age inspection group
A1 Visual inspection
Consistency
Chinese symbols
Machining quality
Wire defects
Wire loss
A2 Dimension inspection
Board dimensions
Pants, defects
Wire width
Wire spacing
Non-coaxiality between hole and land
Deviation of hole center position
A3 Group Attached test spare group
Included information
Group dimensional interchangeability
B1 Group, thickness of printed board plug part
warpage
solderability
thermal shock
(not applicable)
mechanical property test
braking strength
standard test atmospheric conditions
pull-off strength
non-metallized random connection plate
surface coating test
coating adhesion
coating thickness
printed connector
136 Group of additional tests Applicable group
Included in
RCE
GB/T 4588.1-1996
Assessment level
Level A
5-21 2. 5
2２is１
14aS-2
13a $-12.5
According to 3. 2. 5 of GB/T 15261:-1996
Form
Results of A2 and A3
According to 2. Form of G1/T 162--1936
Or
from B2 groupResults from B1, B2, B1, R5, B6 groupResults from level C
$-4: 2.5
Results of A2 group
from BI, 2,
B5 periodResults from GB/T 5.3.5 Form of 16261-1996 Results of A2 and A3 groups According to (G3/T [626]-1996: .2.5 Form of 16261-1996 Results of B1, B2, R4, R5, B6 groups Verification and correction Test every 3 months Insulation resistance Before and after condensation test Flux and flux Test every 12 months (not applicable) Repeat interval spare group Information to be included in RCE B Test pattern - test board GR/T 4588.11996
Continued Table n
Level A
Results from C1 group
The pattern used for the test is the test pattern. The test pattern can be
a part of the conductive pattern on the product board formed
from C1, C2, C3 group
according to 5.2.5 of GB/T 16261--1996
(used when using printed boards): ——-Special test pattern specially designed and prepared only for the splash test day. The test pattern may be arranged on the following boards: Horizontal C
Results from C1
Formed according to 5.2.5 of CB/T16261-1996
Results from C1, C2, C3
Test coupon (printed board or part of the board, usually cut before the printed board is used, see 05-03 of IEC194); separate test board (see 05-02 of IFC194). 8.1 Application of test patterns and test boards
8.1.1 Capability approval test
The basic capability shall be tested using the integrated test pattern specified in 8.2. When the manufacturer considers that the board size (effective area) is larger than the size of the test board with an integrated test pattern (105mm×90mm) in terms of additional capability, the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T 16261-1996.8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. The use of special test patterns, whether part of the comprehensive pattern shown in 8.2 or specially designed, should be negotiated between the supplier and the buyer.8.1.3 Product testing
When testing product boards, the manufacturer can use any test pattern (conductive pattern on the product board or any specified test pattern).8.2 Comprehensive test pattern (CTP)
The comprehensive test pattern (CTP) should be used when assessing capability. See 3.5 of GB/T 16261-1996. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connecting pad solderability
Insulation resistance
Wire accuracy
Nominal aperture
Nominal connecting pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connecting pad
GB/T4588.1—1996
Nominal aperture
Nominal connecting pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.2.5.
Age inspection group
A1 Visual inspection
Consistency
Chinese symbols
Machining quality
Wire defects
Wire loss
A2 Dimension inspection
Board dimensions
Pants, defects
Wire width
Wire spacing
Non-coaxiality between hole and land
Deviation of hole center position
A3 Group Attached test spare group
Included information
Group dimensional interchangeability
B1 Group, thickness of printed board plug part
warpage
solderability
thermal shock
(not applicable)
mechanical property test
braking strength
standard test atmospheric conditions
pull-off strength
non-metallized random connection plate
surface coating test
coating adhesion
coating thickness
printed connector
136 Group of additional tests Applicable group
Included in
RCE
GB/T 4588.1-1996
Assessment level
Level A
5-21 2. 5
2２is１
14aS-2
13a $-12.5
According to 3. 2. 5 of GB/T 15261:-1996
Form
Results of A2 and A3
According to 2. Form of G1/T 162--1936
Or
from B2 groupResults from B1, B2, B1, R5, B6 groupResults from level C
$-4: 2.5
Results of A2 group
from BI, 2,
B5 periodResults from GB/T 5.3.5 Form of 16261-1996 Results of A2 and A3 groups According to (G3/T [626]-1996: .2.5 Form of 16261-1996 Results of B1, B2, R4, R5, B6 groups Verification and correction Test every 3 months Insulation resistance Before and after condensation test Flux and flux Test every 12 months (not applicable) Repeat interval spare group Information to be included in RCE B Test pattern - test board GR/T 4588.11996
Continued Table n
Level A
Results from C1 group
The pattern used for the test is the test pattern. The test pattern can be
a part of the conductive pattern on the product board formed
from C1, C2, C3 group
according to 5.2.5 of GB/T 16261--1996
(used when using printed boards): ——-Special test pattern specially designed and prepared only for the splash test day. The test pattern may be arranged on the following boards: Horizontal C
Results from C1
Formed according to 5.2.5 of CB/T16261-1996
Results from C1, C2, C3
Test coupon (printed board or part of the board, usually cut before the printed board is used, see 05-03 of IEC194); separate test board (see 05-02 of IFC194). 8.1 Application of test patterns and test boards
8.1.1 Capability approval test
The basic capability shall be tested using the integrated test pattern specified in 8.2. When the manufacturer considers that the board size (effective area) is larger than the size of the test board with an integrated test pattern (105mm×90mm) in terms of additional capability, the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T 16261-1996.8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. The use of special test patterns, whether part of the comprehensive pattern shown in 8.2 or specially designed, should be negotiated between the supplier and the buyer.8.1.3 Product testing
When testing product boards, the manufacturer can use any test pattern (conductive pattern on the product board or any specified test pattern).8.2 Comprehensive test pattern (CTP)
The comprehensive test pattern (CTP) should be used when assessing capability. See 3.5 of GB/T 16261-1996. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connecting pad solderability
Insulation resistance
Wire accuracy
Nominal aperture
Nominal connecting pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connecting pad
GB/T4588.1—1996
Nominal aperture
Nominal connecting pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.5 Formation
Results of A2 and A3
According to G1/T 162-1936
2. Form or
Results of B2 group obtained from B1, B2, B1, R5, B6
Level C
$-4: 2.5
Results of A2 group obtained from B1, 2, B5 period
According to GB/T 16261-1996
5. 3. 5 Formation
Results of A2 and A3 group
According to (G3/T [626]—1996
of: .2.5 Form skin
Results from B1, B2, R4, R5, B6
Test and correct
Test every 3 months
Insulation resistance
Before and after condensation test
Fluor and flux
Test once every 12 months
(Not applicable)
Repeat time interval spare group
Included in
RCE
B Test diagram - test board
GR/T 4588.11996
Continued Table n
Level A
Results from C1
The pattern used for the test is the test pattern. The test pattern can be
a part of the conductive pattern on the product board formed
from C1, C2, C3 according to 5.2.5 of GB/T 16261--1996
(used when using printed boards): ——-Special test pattern specially designed and prepared only for the splash test day. The test pattern can be arranged on the following boards: Level C
from C1 The result of the combination is formed according to 5.2.5 of CB/T 16261-1996. The result obtained from the combination of C1, C2 and C3 is formed. The test coupon (a printed board or a part of a printed board, usually cut before the printed board is used, see 05-03 of IEC 194); a separate test board (see 05-02 of IFC 194). 8.1 Application of test patterns and test boards 8.1.1 Capability approval test The basic capability shall be tested using the comprehensive test pattern specified in 8.2. When the manufacturer considers that the board size (effective area) is larger than the size of the test board with a comprehensive test pattern (105 mm × 90 mm) in terms of additional capability, the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T 16261-1996. 8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. Whether it is a part of the comprehensive pattern shown in 8.2 or a special design, it should be negotiated between the supply and demand parties. 8.1.3 Product testing
When testing product boards, the manufacturer can use any test pattern (conductive pattern on the product board or any specified test pattern). 8.2 Comprehensive test pattern (CTP)
The comprehensive test pattern (CTP) should be used when assessing capability. See 3.5 of GB/T16261--1996. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connecting pad solderability
Insulation resistance
Wire accuracy
Nominal aperture
Nominal connecting pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connecting pad
GB/T4588.1—1996
Nominal aperture
Nominal connecting pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.5 Formation
Results of A2 and A3
According to G1/T 162-1936
2. Form or
Results of B2 group obtained from B1, B2, B1, R5, B6
Level C
$-4: 2.5
Results of A2 group obtained from B1, 2, B5 period
According to GB/T 16261-1996
5. 3. 5 Formation
Results of A2 and A3 group
According to (G3/T [626]—1996
of: .2.5 Form skin
Results from B1, B2, R4, R5, B6
Test and correct
Test every 3 months
Insulation resistance
Before and after condensation test
Fluor and flux
Test once every 12 months
(Not applicable)
Repeat time interval spare group
Included in
RCE
B Test diagram - test board
GR/T 4588.11996
Continued Table n
Level A
Results from C1
The pattern used for the test is the test pattern. The test pattern can be
a part of the conductive pattern on the product board formed
from C1, C2, C3 according to 5.2.5 of GB/T 16261--1996
(used when using printed boards): ——-Special test pattern specially designed and prepared only for the splash test day. The test pattern can be arranged on the following boards: Level C
from C1 The result of the combination is formed according to 5.2.5 of CB/T 16261-1996. The result obtained from the combination of C1, C2 and C3 is formed. The test coupon (a printed board or a part of a printed board, usually cut before the printed board is used, see 05-03 of IEC 194); a separate test board (see 05-02 of IFC 194). 8.1 Application of test patterns and test boards 8.1.1 Capability approval test The basic capability shall be tested using the comprehensive test pattern specified in 8.2. When the manufacturer considers that the board size (effective area) is larger than the size of the test board with a comprehensive test pattern (105 mm × 90 mm) in terms of additional capability, the various arrangements shown in 8.3 may be used. See also 3.5 of GB/T 16261-1996. 8.1.2 Quality consistency inspection
Quality consistency inspection is usually carried out on product boards. Whether it is a part of the comprehensive pattern shown in 8.2 or a special design, it should be negotiated between the supply and demand parties. 8.1.3 Product testing
When testing product boards, the manufacturer can use any test pattern (conductive pattern on the product board or any specified test pattern). 8.2 Comprehensive test pattern (CTP)
The comprehensive test pattern (CTP) should be used when assessing capability. See 3.5 of GB/T16261--1996. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connecting pad solderability
Insulation resistance
Wire accuracy
Nominal aperture
Nominal connecting pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connecting pad
GB/T4588.1—1996
Nominal aperture
Nominal connecting pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.5. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connection pad solderability
Insulation resistance
Wire accuracy
Nominal hole diameter
Nominal connection pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connection pad
GB/T4588.1—1996
Nominal hole diameter
Nominal connection pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.5. The following tests can be carried out using a single comprehensive test pattern (see Figure 2): Sample
Connection pad solderability
Insulation resistance
Wire accuracy
Nominal hole diameter
Nominal connection pad diameter
Shaving strength
Conductor surface solderability
Anti-stripping amplitude
Non-metallized hole connection pad
GB/T4588.1—1996
Nominal hole diameter
Nominal connection pad diameter
Note: Figures A, E, FG, H, J and K in Figure 2 are equivalent to the comprehensive test pattern (positive and negative) of GB/F4588.2—1996. 8.3 Multiple Arrangements of Comprehensive Test Patterns (CTP) When a manufacturer claims that the board size (effective area) is larger than the size of a single comprehensive test pattern (105mm×90mm) and wishes to use comprehensive test patterns to demonstrate its additional capabilities, an appropriate arrangement of comprehensive test patterns may be used. When arranging, there should be a comprehensive test pattern at each corner of the effective area of the board, and unoccupied areas are allowed between each comprehensive test pattern, but they shall not exceed the size of one comprehensive test pattern. Examples of multiple arrangements of comprehensive test patterns (CTP) are as follows: Arrangement of 3 comprehensive test patterns
Arrangement of 6 comprehensive test patterns:
Arrangement of 12 comprehensive test patterns
Additional instructions:
GB/T 4588.1-1996
t． 。
Unit: mm
60oto0
T0000000.
o00900
If there is no other provision, the diameter of all holes is 0.8 mm (0.031 in). Figure 2 Comprehensive test pattern
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by Shanghai Radio Factory No. 2 and the Standardization Institute of the Ministry of Electronics Industry. The main initiators of this standard are Xu Jilan and Ce Xiaoming. This standard was first issued in July 2111, 1984 and revised for the first time in 1926.
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