GB/T 15877-1995 Specification for etched dual-row package lead frame

Basic Information

Standard ID: GB/T 15877-1995

Standard Name: Specification for etched dual-row package lead frame

Chinese Name: 蚀刻型双列封装引线框架规范

Standard category:National Standard (GB)

state:in force

Date of Release1995-01-02

Date of Implementation:1996-08-01

standard classification number

Standard ICS number:Electronics>>31.200 Integrated Circuits, Microelectronics

Standard Classification Number:Electronic Components and Information Technology>>Microcircuit>>L55 Microcircuit Comprehensive

associated standards

Procurement status:SEMI G19:1984

Publication information

publishing house:China Standards Press

Publication date:1996-08-01

other information

Release date:1995-12-22

Review date:2004-10-14

Drafting unit:Ningbo Integrated Circuit Factory

Focal point unit:National Semiconductor Device Standardization Technical Committee

Publishing department:State Bureau of Technical Supervision

competent authority:Ministry of Information Industry (Electronics)

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Introduction to standards:

This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit etched dual-row package lead frames. This specification is applicable to semiconductor integrated circuit plastic dual-row package lead frames, and other package lead frames can also be used as a reference. GB/T 15877-1995 Etched dual-row package lead frame specification GB/T15877-1995 Standard download decompression password: www.bzxz.net