This specification specifies the technical requirements and inspection rules for semiconductor integrated circuit etched dual-row package lead frames. This specification is applicable to semiconductor integrated circuit plastic dual-row package lead frames, and other package lead frames can also be used as a reference. GB/T 15877-1995 Etched dual-row package lead frame specification GB/T15877-1995 Standard download decompression password: www.bzxz.net

National Standard of the People's Republic of China
Specification of DiP leadframes produced by etching1 Subject content and scope of application
GB/T 15877-1995
1.1 Subject content
This specification specifies the technical requirements and inspection rules for etched dual-row package leadframes for semiconductor integrated circuits (hereinafter referred to as leadframes).
1.2 Scope of application
This specification applies to plastic dual-row package leadframes for semiconductor integrated circuits, and leadframes of other packaging forms can also be used for reference. 2 Reference standards
GB7092-93 Outer dimensions of semiconductor integrated circuits GB/T14112-93 Specifications for stamped lead frames for plastic dual-row packages of semiconductor integrated circuits GB/T14113-93 Terminology for semiconductor integrated circuit packaging SJ/Z9007--87 Sampling plans and procedures for counting inspection 3 Terms, symbols and codes
The terms, symbols and codes used in this specification shall comply with the provisions of GB/T14113. 4 Technical requirements
4.1 Design
The outer dimensions of the lead frame shall comply with the relevant provisions of GB7092 and meet the requirements for lead frame design. 4.1.1 Measured area of ​​lead bonding area
The lead bonding area shall ensure that its width is not less than 0.2mm and its length is not less than 0.635mm. Since drilling in the etching process is difficult to avoid and will produce rounded ends, the length measurement should be calculated from 0.25mm from the end. 4.1.2 Spacing between metals
The distance between each inner lead of the lead frame and the distance between the inner lead and the chip bonding area shall not be less than 0.15mm4.2 Tolerance of lead frame shape and position
4.2.1 The lateral bend of the lead frame shall be less than 0.5% of the nominal strip length. 4.2.2 The curl of the lead frame shall be less than 0.3% of the nominal strip length. 4.2.3 Horizontal bend of the lead frame
The maximum horizontal bend size of the lead frame shall comply with the provisions of Table 1. Approved by the State Council Technical Supervision Commission on December 22, 1995, and implemented on August 1, 1996
Number of leads
4B and above 48
CB/T15B77—1995
24. 64 ~ 25. 40
27.18~~27.94
29. 72~30. 48
32. 26~-33. 02
37.34 ~~38+10
42.42~~43.18
56. 66~58- 42
60. 96-~67. 82
4.2.4 The distortion of the lead frame shall be less than 0.5mm. 4.2.5 The distortion of the inner lead of the lead frame shall not exceed 0.01mm. 4.2.6 The coplanarity of the end of the lead frame coining area shall not be less than 0.1mm. 4.2.7 The depth of the lead frame coining area shall not be greater than 1/3 of the material thickness. Horizontal bend (maximum value)
4.2.8 The slope of the chip bonding area is measured from the corner. Within each 2.54mm long or wide distance, the maximum slope for the uncoined bonding area is 0.025tnm, and the maximum slope for the coined bonding area is 0.050mm. 4.2.9 Flatness of the chip bonding area
The flatness between the four fixing points (two connecting ribs of the support bar) and the reference surface of the chip bonding area shall comply with the provisions of Table 2. Table 2
Number of leads
18~64
4.3 Appearance of lead frame
4.3.1 Burr
Flatness of bonding area
+0.070/—0.127
+0.152/ -0.076
Vertical burr at any position inside the lead frame rib shall not be larger than 0.025mm, and vertical burr at any position outside the rib and horizontal burr at any position shall not be larger than 0.051mm.
4.3.2 Pits
Within the range of 0.635mm at the end of the wire bonding area and 0.508mm around the perimeter of the die bonding area, there shall be no pit with a diameter larger than 0.013mm, a depth larger than 0.008mm, and a number greater than 1. There shall be no pits with a diameter greater than 0.130mm, a depth greater than 50% of the metal thickness, and a number greater than 2 in the functional area within 0.5mm of the die bonding area: there shall be no pits with a diameter greater than 0.5mm, a depth greater than 50% of the metal thickness, and a number greater than 3 in the other non-functional areas. 4.3.3 Scratches
There shall be no scratches with a maximum size of 0.050mm×0.025mm×0.010mm and a number greater than 1 in the effective area of ​​the lead frame lead bonding area and the die bonding area; there shall be no scratches with a maximum size of 0.150mm×0.075mm×0.030mm and a number greater than 3 in other areas.
4.3.4 Surface defects
The non-plated area shall be the original color of the metal material, without rust, flowery and other defects. 4.4 Lead frame plating
GB/T 15877—1995
4.4.1 Plating thickness
4.4.1.1 For lead frame with partial gold plating, the thickness of the gold plating shall not be less than 1.0um. 4.4.1.2 For lead frame with partial silver plating, the thickness of the silver plating shall not be less than 3.8um. ​​4.4.2 Plating appearance
The surface of the lead frame shall be dense, uniform in color and in the original color of the metal of the plating. Defects such as peeling, blistering, flaking, blooming, spots, foreign matter, scratches, stains, water marks and rust are not allowed.
4.4.3 Plating heat resistance
The plating shall not have obvious discoloration after high temperature test. Defects such as peeling, blistering, flaking, blooming and spots are not allowed. 4.4.4 Plating bonding strength
The lead bonding area within the lead frame should be easy to bond, and the bonding strength should be greater than 40mN. 4.5 Strength of the outer leads of the lead frame
The outer leads of the lead frame should not break after the bending test. 5 Inspection rules
5.1 Composition of inspection batches
An inspection batch can be composed of one production batch or several production batches that meet the following conditions. These production batches are manufactured using the same materials, processes, equipment, etc.+o
The inspection results of each production batch show that the quality of the materials and processes can ensure that the lead frames produced meet the predetermined quality level.
The time for several production batches to constitute an inspection batch is usually no more than one week, and unless otherwise specified, it shall not exceed one month at most. 5.2 Inspection Items and Requirements
The inspection items for lead frames are shown in Table 3. The tests marked with (D) are destructive tests. The test methods cited in Table 3 refer to the methods specified in the Appendix of GB/T14112. The AQL sampling plan is in accordance with the provisions of SJ/Z9007, and the number of samples is measured in strips. Mai 3
Inspection or testwwW.bzxz.Net
Geometric tolerance
Coating thickness
Coating heat resistance (D)
Bond strength()
External lead strength (D)
Test method
Visual inspection or measurement with measurement accuracy
Measurement element, burr is in accordance with Appendix A
Inspection requirements
According to 4.3 and 4.4:2 of this specification
Measure with a disc that meets the measurement accuracy. The distance between metals shall be in accordance with Appendix A
According to 4.1 of this specification
A1~A6, A8 of Appendix A and
Chain layer thickness gauge or other equivalent methods
B1 of Appendix B
B2 of Appendix B
B3 of Appendix B
According to 4.2 of this specification
According to 4.4.1 of this specification
According to 4.4.3 of this specification
According to 4.4.4 of this specification
According to 4.5 of this specification
6 Ordering information
GB/T 15877-1995
If there is no other stipulation, the following information is required at least when ordering lead frames: product model and specifications;
b. Quantity:
c. Product drawings and drawing numbers:
d. Material name and specifications,
e. Any other details (when applicable).
7 Marking, packaging, transportation, storage
7.1 Marking
The lead frame packaging box should have the following markings:a. Factory name or trademark;
b. Product name, model, specifications,
. Product standard number;
d. Quantity;
e. Production date;
1. Inspection batch identification code and inspector code. 7.2. Packaging
The inner packaging of the lead frame adopts neutral moisture-proof paper, and ensures that the product is not polluted and deformed. The intermediate packaging should adopt paper basins and plastic bags, with product certificates inside, and ensure that it is not damaged during transportation. The outer packaging adopts tile-board cartons or wooden boxes, and is marked with words such as "moisture-proof and worry-proof".
7.3 Transportation
The packaging of the product can adapt to the transportation of any means of transportation, and can prevent rain, moisture and damage during transportation. 7.4 Storage
7.4.1 The product should be stored in a ventilated, dry, and non-corrosive warehouse with an ambient temperature of 10℃～35℃ and a relative humidity of no more than 80%.
7.4.2 The shelf life of the plated lead frame is 3 months from the date of manufacture, and the shelf life of the unplated lead frame is 6 months. Additional remarks:
This standard is proposed by the Ministry of Electronics Industry of the People's Republic of China. This standard is under the jurisdiction of the National Integrated Circuit Standardization Technical Committee. This standard was drafted by Ningbo Integrated Circuit Component Factory and Xi'an Microelectronics Technology Research Institute. The main drafters of this standard are Chen Xueyao, Wang Xianrui and She Fengrong.
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