title>GB/T 15879-1995 Mechanical standardization of semiconductor devices Part 5: Recommended values ​​for tape automated bonding (TAB) of integrated circuits - GB/T 15879-1995 - Chinese standardNet - bzxz.net
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GB/T 15879-1995 Mechanical standardization of semiconductor devices Part 5: Recommended values ​​for tape automated bonding (TAB) of integrated circuits

Basic Information

Standard ID: GB/T 15879-1995

Standard Name: Mechanical standardization of semiconductor devices Part 5: Recommended values ​​for tape automated bonding (TAB) of integrated circuits

Chinese Name: 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值

Standard category:National Standard (GB)

state:in force

Date of Release1995-01-02

Date of Implementation:1996-08-01

standard classification number

Standard ICS number:Electronics>>31.200 Integrated Circuits, Microelectronics

Standard Classification Number:Electronic Components and Information Technology>>Microcircuit>>L55 Microcircuit Comprehensive

associated standards

Procurement status:IEC 191-5:1987

Publication information

publishing house:China Standards Press

Publication date:1996-08-01

other information

Release date:1995-12-22

Review date:2004-10-14

Drafting unit:Standardization Institute of the Ministry of Electronics Industry

Focal point unit:National Semiconductor Device Standardization Technical Committee

Publishing department:State Bureau of Technical Supervision

competent authority:Ministry of Information Industry (Electronics)

Introduction to standards:

This standard specifies the recommended values ​​for integrated circuit tape automated bonding (TAB). GB/T 15879-1995 Mechanical standardization of semiconductor devices Part 5: Recommended values ​​for integrated circuit tape automated bonding (TAB) GB/T15879-1995 Standard download decompression password: www.bzxz.net