GB/T 15615-1995 Test method for bending strength of silicon wafer

Basic Information

Standard ID: GB/T 15615-1995

Standard Name: Test method for bending strength of silicon wafer

Chinese Name: 硅片抗弯强度测试方法

Standard category:National Standard (GB)

state:Abolished

Date of Release1995-07-12

Date of Implementation:1996-02-01

Date of Expiration:2005-10-14

standard classification number

Standard ICS number:Metallurgy>>Metal Material Testing>>77.040.01 Metal Material Testing General

Standard Classification Number:Metallurgy>>Methods for testing physical and chemical properties of metals>>Methods for testing H23 metal processing properties

associated standards

Publication information

other information

Review date:2004-10-14

Drafting unit:Central South University of Technology

Focal point unit:National Technical Committee for Standardization of Semiconductor Materials and Equipment

Publishing department:State Bureau of Technical Supervision

competent authority:National Standardization Administration

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Introduction to standards:

This standard specifies the test method for the bending strength of silicon single crystal cutting, grinding and polishing wafers. This standard is applicable to the measurement of the bending strength of CZ and FZ silicon single crystal wafers with crystal orientation of <111> and <100> at room temperature. The thickness of silicon wafer is 250～900μm. GB/T 15615-1995 Test method for bending strength of silicon wafer GB/T15615-1995 Standard download decompression password: www.bzxz.net