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1CS 31.220.01
Registration No.: 3916—1999
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Electronic Industry Standard of the People's Republic of China
SJ/T 11187-1998
Genera1 specification
for surface mounting adhesives1998-03-11 Release
1998-05-01Implementation
Ministry of Electronics Industry of the People's Republic of China
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Cited Standards
3 Definitions
4 Classification
5 Requirements
6 Test methods
7 Inspection rules
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8 Marking, packaging, transportation, storage
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Appendix A (Standard Appendix) Other technical conditions for surface mount adhesives YYKAONTKAca
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This standard is not equivalent to ANSI/IPC-SM-817-1989 <General Specification for Insulating Surface Mount Adhesives). The main technical differences between this standard and ANSI/IPC-SM-817-1989 are: (1) Added test methods for curing and storage period; (2) High temperature strength was added as an identification test item: (3) Two test solvents that are harmful to the environment in the solvent resistance test were deleted: 1,1.1-trifluoroethane and trifluoroethane; (4) This standard includes part of the contents of ANSI/IPC-SM-817\General Requirements in Appendix A. This standard Appendix A is the appendix of the standard.
This standard is under the jurisdiction of the Standardization and Chemical Research Institute of the Ministry of Electronics Industry. The drafting unit of this standard: the Technology Research Institute of the Ministry of Electronics Industry. The main drafters of this standard: Chen Peng, Yu Donglin. TYYKAONTKAca
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Electronic Industry Standard of the People's Republic of China
General Specification for Surface Mounting Adhesives
Genera1 Specirlcatlon
for surface mounting adhesivesScope
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SJ/T 11187--1998
This standard specifies the classification, requirements, test methods, inspection rules, marking, packaging, transportation and storage of surface mounting adhesives (hereinafter referred to as adhesives).
This standard is applicable to adhesives that can be cured by ultraviolet light, visible light, thermal radiation or other atmospheres by needle transfer, injection, printing and other methods.
2 Cited standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. At the time of publication of this standard, the versions shown are valid, all standards will be revised, and the parties using this standard should explore the possibility of using the latest versions of the following standards.
GB 191-90
GB 1409—88
GB 1401 --89
GB/T 2036—1994
GB/T 2423.3---93
GB 2413. 1690
GB/T 2794--1995
GB/T 2943--1994
GR 313188
GB 4677.10--84
GB 6753.1—86
GR 7124-86
SJ/T 10309---92
SJ/T 10668—1995
3 Definitions
Packaging and storage pictorial symbols
Test methods for relative dielectric constant and dielectric loss factor of solid insulating materials at power frequency, audio frequency and high frequency (including meter wavelength)
Test methods for volume resistivity and surface resistivity of solid insulating materialsTerms for printed circuits
Basic environmental test procedures for electrical and electronic productsTest Ca: Steady-state damp heat test method
Basic environmental test procedures for electrical and electronic productsTest J: Long test method
Determination of viscosity of adhesives
Terms for adhesives
Tin-lead solder
Test methods for coalability of printed boards
Determination of grinding fineness of coatings
Determination methods for tensile shear strength of adhesives (Jinping to Jinrun)Solder for printed boards
Terms for surface assembly technology
Approved by the Ministry of Electronics Industry of the People's Republic of China on March 11, 1998TYYKAONT KAca
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SJ/T 11187—1998
This standard adopts the following definitions, and other definitions are in accordance with the provisions of GB/T2943, GB/T2036, and SJ/T10668. 3.1 Initial strength greenstrength
The strength of the unhardened adhesive joint or assembly 3.2 Shelf life
Under specified conditions, the material or product can still meet the technical requirements and maintain appropriate performance. 3.3 Working time
The longest time that the adhesive can maintain the specified chemical and physical properties when exposed to the specified environment before gluing. 3.4 Viscosity
The property of an adhesive fluid to resist internal abrasion, which is proportional to the applied force. 3.5 Thixotropic ratio The ratio of the viscosities measured at two different shear rates, used to characterize thixotropy. 3.6 Slump
The distance an adhesive spreads during curing after application. 3.7 Spread
The distance an adhesive spreads at room temperature after application. 4 Classification and nomenclature
4.1 Types
Adhesives are classified into three types based on the curing method (see Table 1). Types of adhesives for surface assembly
4.2 Nomenclature
Curing method
Thermal curing (radiation, convection or conduction)
Light curing (ultraviolet light or visible light, with or without an auxiliary curing mechanism) Other curing conditions
Adhesives are labeled according to the curing method and viscosity. TPr
5 Requirements
5.1 Physical properties
××××
Adhesive viscosity, expressed in Pa.s
Adhesive type (or curing method)
The first capital letter combination of each Chinese character for "patch adhesive"Page:5/15
5.1.1 Appearance
It should be a colored opaque, uniform, viscous liquid. The color shall be agreed upon by the supplier and the screener, and should generally be easy to identify or check. 5.1.2 Viscosity
Unless otherwise specified by the supplier and the buyer, the adhesive viscosity should be around 400 Pa.s. The thixotropy rate of the adhesive for needle plate transfer should also be given.
5.1.3 Fineness
The fineness shall be agreed upon by the supplier and the screener.
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5.1.4 Placement time
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SJ/T 11187-1998
The placement time should be proposed by the adhesive manufacturer. 5.1.5 Spreading and slumping
When tested in accordance with 6.3, the increase in the diameter of the test glue point should not be greater than 10% of the original glue point diameter. 5.1.6 Shear strength
When tested in accordance with 6.4, the shear strength should not be less than 8.0MPac5.1.7 Shear strength after welding treatment
When tested in accordance with 6.5, the shear strength after the sample should not be less than 8.0MPaa5.2 Chemical properties·
5.2.1 Curing
When tested in accordance with 6.6, the surface of the cured adhesive should be smooth and shiny. 5.2.2 Solvent resistance
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When tested in accordance with 6.7, the surface of the cured adhesive should not be rough, swollen, sticky, bubbling, or change color. 5.2.3 Hydrolytic stability
When tested in accordance with 6.8, the adhesive should not be powdered, bubbling, cracked, or decomposed. The test severity is divided into three levels:
Level 1: (35±2), 4d:
Level 2: (85±2),7d
Level 3: (97±2)C,28d.
5.3 Electrical properties
5.3.1 Electrical strength
When tested in accordance with 6.9, the electrical strength of the sample should not be less than 10kV/mm5.3.2 Dielectric constant
When tested in accordance with 6.10, the dielectric constant of the sample should not be greater than 5.5.5.3.3 Dielectric loss factor
When tested in accordance with 6.11, the dielectric loss factor of the sample should not be less than 5.5. The dissipation factor shall not be greater than 0.035. 5.3,4 Volume resistivity
When tested in accordance with 6.12, the volume resistivity of the sample shall not be less than 1.0×10120-co 5.3.5 Surface resistivity
When tested in accordance with 6.13, the surface resistivity of the sample shall not be less than 5.0×1010n 5.4 Environmental performance
5.4.1 Heat resistance
When tested in accordance with 6.14, the surface resistivity of the sample shall not be less than 1×10°m. 5.4.2 High temperature strength
When tested in accordance with 6.15, the pasted components shall not be displaced. 5.4.3 Fungus resistance
When tested in accordance with 6.16, the test mixture shall reach the long every 0 level. 5.4.4 Electromigration
When tested in accordance with 6.17, the electromigration phenomenon of the sample shall not show an increasing trend. 5.5 Storage period
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The manufacturer shall specify the storage period and storage conditions. When the adhesive is stored according to the storage conditions and storage period specified by the manufacturer, the change range of the three properties of the adhesive, namely, viscosity, shear strength and curing, shall comply with the provisions of 5.1.2, 5.1.6 and 5.2.1. 6 Test method
6.1 Appearance
Use a non-color-fertilized 1.5/1.5 normal visual acuity to check whether the adhesive complies with the requirements of 5.1.1 or the detailed specification. 6.2 Viscosity and fineness
6.2.1 Viscosity
The viscosity of the adhesive shall be determined according to the method given in GB2794. 6.2.2 Fineness
The fineness of the adhesive shall be determined according to the method given in GB6753.1. 6.3 Spreading and slumping
6.3.1 Sample preparation
On a clean 76mm×25mm×1mm frosted glass slide, prepare three or more glue dots by dotting or printing. The diameter of the glue dots is 6.5mm and the thickness is 0.25mm. The thickness of the glue dots should be uniform. 6.3.2 Test procedure
Prepare two samples according to 6.3.1, which are used to measure the spreading and slumping respectively. Place the prepared 1\ sample in an environment with a temperature of (25±5)℃ and a relative humidity of (50±25)% for 50min~70min, measure the diameter of the glue spot, and calculate the percentage increase in the diameter of the glue spot, which is the spreadability of the adhesive. Cure the prepared 2\ sample according to the conditions specified by the manufacturer, and measure the diameter of the glue spot after curing. The percentage increase in the diameter of the glue spot is the spreadability of the adhesive. 6.4 Shear strength
The shear strength should be measured according to the method given in GB7124, and the test piece is 1Cr18Ni9T stainless steel or 45 carbon steel. If necessary, test pieces of other materials can also be used. In the event of quality doubts, the above steel test piece shall prevail. 6.5 Shear strength after welding treatment
The bonded sample is dip-welded according to GB4677.10. The treatment conditions are: solder temperature 235+5℃, dip-welding time (4±1)s, and neutral soldering flux. After treatment, it is measured according to 6.4. 6.6 Curing
Prepare the test sample according to 6.3.1, and place the sample in the environment specified by the adhesive manufacturer for curing. After the curing reaction is completed, observe and measure the surface smoothness and smoothness of the cured adhesive point with appropriate tools (metal fan or wooden fine surface): 6.7 Solvent resistance
Prepare the sample according to 6.3.1, and after the sample is cured according to the manufacturer's specified conditions, soak it in the solvents listed in Table 2 for 15 minutes each, take it out, and let it dry at room temperature for 10 minutes, and observe the surface with the naked eye. Table 2 Solvent resistance test
Isopropyl alcohol
(6D±5)C
2.10% alkaline detergent (PH13)
Note: The above test can be carried out with solvents that are not listed in Table 2 but will be exposed to it in the subsequent process of pasting, decomposition, maintenance and the final use environment of the printed board.
6.8 Hydrolysis stability
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6.8.1 Principle of the method
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The cured adhesive layer of the adhesive is placed in a specified temperature and temperature environment for a period of time to examine the stability of the adhesive layer to water vapor.
Reagents and test equipment
Process) Potassium sulfate: analytical grade;
Glass desiccator: diameter not less than 254mm; e)
Cotton swab;
Oven: 100±1).
6.8.3 Sample preparation
On a clean 102mm×102mm frosted glass sheet, apply a layer of adhesive with a thickness of (0.25+0.05)mm using printed polyester cloth, and cure according to the conditions specified by the adhesive supplier. The cured sample should be visually inspected under a strong light back spot, and there should be no air pools and pores.
6.8.4 Test conditions and procedures
Use distilled water to prepare a saturated solution of potassium sulfate at 85°C (about 35% by weight), and pour the solution into the desiccator with the liquid level slightly lower than the porcelain plate, retaining the folded sample body. The prepared sample is placed vertically on the porcelain plate in the lower blaster, and there should be no contact between the samples. Seal with grease and cover tightly. Put the desiccator into the oven and test according to the level agreed by the supplier and the buyer. 6.8.5 Evaluation
After the test, take out the sample, wipe the surface of the rubber layer with a cotton swab, observe whether there are solid particles on the weighing rod, and visually check the state of the rubber layer.
When necessary, the above inspection can be carried out in the oven. 6.9 Outgassing Strength
The electrical strength shall be measured according to the method of SJ/T1030g, and the test rubber layer thickness shall be (0.38±0.05)mm. The test frequency shall be 1kHz and 1MHz.
6.10 Dielectric Constant
The dielectric band number shall be measured according to the method specified in GB1409, and the test rubber layer thickness shall be (0.38±0.05)mm, and the test frequency shall be 1kHz and 1MHz.
6.11 Dielectric loss factor
The dielectric loss factor is measured according to the method specified in GB1409, the test glue layer thickness is (0.38±0.05)mm, the test frequency is 1kHz and 1MHz.
6.12 Volume resistivity
The volume resistivity is measured according to the method specified in GB1410, the test glue layer thickness is (0.38±0.0s)mm, the test frequency is 1kHz and 1MHz.
6.13 Surface resistance
Surface resistance is measured according to the method specified in GB1410, the test glue layer thickness is (0.38±0.05)mm, the test frequency is 1kHz and 1MHz.
6.14 Resistance to moisture and heat
6.14.1 Principle of the method
Apply the adhesive to the test pattern, cure it, and measure the insulation resistance of the test pattern after being placed in a specified temperature and humidity environment for a period of time to determine the resistance of the adhesive layer to the heat environment. 5
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SJ/T 11187—1998
6.14.2 Test equipment and reagents
High resistance meter: measuring range not less than 1015m, or other suitable measuring instruments, error should be less than 10% 1 DC power supply: output voltage not less than 100V, error should be less than 10%! Oven: (100±2);
Tidal hot test chamber:
Deionized water or steam water,
Isopropyl alcohol.
6.14.3 Sample preparation
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In the test, at least four samples should be prepared, including a non-polyester glue control sample. The test pattern is shown in Figure 1. Wire width: 0.635mm, wire center spacing: 1.27mm, printed board thickness: 1.5mm Note: If necessary, the wire width and spacing can be 0.8mm respectively. Figure 1 Insulation resistance test pattern
The measuring lead should be protected to minimize the influence on the insulation resistance measurement. Spray the specimen with deionized water or steamed filling water, clean the surface of the specimen thoroughly with clean isopropanol, and dry the specimen at 50℃～60℃ for 3h. The specimen that is not immediately tested should be placed in a clean plastic bag and tied tightly (not heat-sealed) for storage. Apply the adhesive on the pattern of the specimen. The thickness is (0.25±0.05)mm, and cure according to the conditions specified by the manufacturer. After curing, the specimen is placed at room temperature for 24h
The specimen should be clean, without fingerprints, dust or any other contamination, and the adhesive layer should be free of bubbles. 6.14.4 Test procedure
The test is carried out in accordance with the method given in GB/T2423.3, in which: a) The pretreatment procedure is in accordance with 6.14.3;
b) Initial test: The sample is treated at (50±5)℃, without humidification for 24h, cooled to room temperature, and the initial surface resistance is measured. Points 1, 3, and 5 of the test pattern are connected to the positive electrode, and points 2 and 4 are connected to the negative electrode. A 100V DC voltage is applied for 1min, then the power supply is disconnected and the reading is read;
The test pieces are placed vertically in the test box without contact with each other; c)
d) Cooling level: The temperature is (50±5)℃, the relative humidity is 90%, and the holding time is 7d;6
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SJ/T 11187 1998
e) During the conditional test period, add 100V DC power supply 1T) During the conditional test period, measure the insulation resistance once every 24 hours, and disconnect the power supply during measurement: g) Finally measure the insulation resistance, and disconnect the power supply before measurement: Page:10/15
b) Take out the sample, place the sample at room temperature for 24 hours, check whether there are white spots, bubbles, cracks and other damages on the surface of the adhesive layer, and measure the insulation resistance.
6.14.5 Evaluation
The resistance value detected at the end and the resistance value detected after unpacking are used as the test results. When the sample does not meet the requirements of 5.4.1, the results of the control sample should be referred to. When the control sample also does not meet the requirements of 5.4.1, if this test is invalid, the sample should be re-made for the above test. 6.15 High temperature strength
6.15.1 Principle of the method
The adhesive sample is tested in a welding environment, and the displacement degree of the bonded components is used to determine the high wet strength of the adhesive. 6.15.2 Test equipment and materials
Alloy bath: Solder according to Sn60 or Sn62 or Sn63 in GB3131, temperature (260±5) b)
3216 chip resistor. Www.bzxZ.net
6.15.3 Test specimen preparation
Apply 20 circular or rectangular glue dots on any side of the printed circuit board. Thermosetting adhesive can be made into glue dots with a diameter of 1.27mm and a thickness of 0.1mm by the travel printing method, and light-curing adhesive can be made into glue dots with a diameter of 2.0mm×0.76mm and a thickness of 0.1mm by the screen printing method.
Accurately stick the chip resistor to the glue dots and cure them according to the conditions specified by the adhesive manufacturer. 6.15.4 Test procedure
Treat the sample with the neutral additive in GB4677.10 and remove the excess fluorine. Place the sample with the component facing the alloy bath, about 12mm away from the surface of the molten metal, and place it (60±5)°. Then place the sample on the solder surface without oxide scale and float for 10s. There should be slight and continuous agitation during the floating period. Take out the sample, cool it, remove the residue, and visually check the displacement of the attached components. 6.15.5 Evaluation of test results
If any of the following conditions occurs, the component is considered to have displaced: a) Falling off the sample; b) Rotating more than 30° from the original mounting position; c) The attached component is lifted from the substrate surface and a gap of more than 1mm appears between the component and the substrate. 6.16 Shade resistance
The antibacterial test is carried out in accordance with the test J specified in GB2423.16, and the test days are 28 days. 6.17 Electromigration
6.17.1 Principle of the method
Apply the adhesive to the test pattern, and after curing, place it in a high humidity and heat environment for a period of time, and measure the hysteresis current of the test pattern to determine the degree of influence of the adhesive layer on the neutron migration. 6.17.2 Test equipment
DC power supply: maximum output current 1A, voltage 10V, error should be less than 5%: b)
Amperemeter: accuracy 1A or other suitable measuring instruments: 7
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SJ/T 11187-1998
Oven: (100±2) seven;
Glass dryer: diameter not less than 254mm, with air-sealed outlet; d)
Potassium sulfate: analytical grade;
Silicone rubber sealant:
Adjustable resistor: 10kN, 0.5W;
Microscope: 30 times;
The test graph is shown in Figure 2, the wire width is 0.635mm, the wire center distance is 1.27mm1od.c
6.17.3 Sample preparation
The sample preparation is carried out in accordance with 6.14.3.
6.17.4 Test procedure
Electromigration test graph
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a) Test conditions: (85±2)℃, 7d;
Use distilled water to prepare a saturated solution of potassium hydroxide (about 35% by weight) at 85℃, and pour the solution into the desiccator. b)
The liquid level is slightly lower than the porcelain plate, and the precipitated product is retained; e) The sample is placed vertically in the desiccator without contact with each other; d) Close the lid of the desiccator, lead the test line out of the air seal, seal the air seal with silicone rubber, and put the desiccator into the (85±2) oven;
Connect the circuit according to Figure 2, so that the limiting current is 1mA; e)
Turn on the power supply:
Before the test, measure the initial current. After the test, measure the test leakage current and record its changes. g
6.17.5 Evaluation of test results
After the seventh day, stop the test, measure the leakage current and convert it into the insulation resistance between the comb electrodes. Example: The hysteresis current measured on the sample is 1.0uA, then the resistance is 10.0M0 (R=E/1). Check the electron migration or other damage on the sample under a microscope8
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Storage period
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The storage period of the adhesive should be determined based on the time for the viscosity, shear strength and curing properties to remain unchanged. The storage conditions and storage period should be determined by the manufacturer, and the test methods should be carried out according to 6.2.6.4 and 6.6 respectively. 7
Inspection rules
Inspection responsibilities
Adhesive manufacturers shall inspect their products in accordance with the provisions of this standard. Ex-factory products shall comply with the requirements of this standard and be accompanied by a product quality certificate. Inspection can also be completed by an independent inspection agency. Adhesive users can inspect any items specified in this standard. The inspection report shall list all test results and be signed by the inspector. 7.2 Inspection classification
Inspection is divided into identification inspection and quality consistency inspection. 7.3 Identification test
Identification test is a series of complete tests on several samples of similar products to study whether the manufacturer is capable of producing products that meet the requirements of this standard. When the components are changed, the identification test should be carried out again. The identification test should be carried out in a laboratory approved by the relevant quality department. The items, requirements and methods of the identification and inspection are listed in Table 3: Table 3 Identification and inspection
Spreading/slump
Shear strength
Shear strength after joint treatment
Solvent resistance
Hydrolysis stability
Electrical strength
Dielectric constant
Dielectric loss factor
Volume resistivity
Surface resistance
Moisture and heat resistance
High temperature strength
Fungus resistance
Electromigration
Zhi Ben Tian Xiao
Requirement Article No.
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