SJ 20642/7-2000 Semiconductor optoelectronic devices Detailed specification for GR1325J long wavelength light emitting diode components
Some standard content:
Military Standard of the Electronic Industry of the People's Republic of China FL5980
SJ 20642/7-—2000
Semiconductor optoelectronics devices
Detailed specification for type GR1325J light emitting diode module
Published on 2000-10-20
Implemented on 2000-10-20
Approved by the Ministry of Information Industry of the People's Republic of China Military Standard of the Electronic Industry of the People's Republic of China Semiconductor optoelectronics devices
Detailed specification for type GR1325J light emitting diode module
1 Scope
1.1 Subject Content
This specification specifies the detailed requirements for GR1325J long wavelength light emitting diode modules. 1.2 Scope of Application
SJ20642/7-—2000
This specification applies to the development, production and procurement of GR1325J long wavelength light emitting diode modules (hereinafter referred to as "modules").
1.3 Classification
1.3.1 Product Grade
The product quality assurance grade provided by this specification is M1 grade as specified in SJ20642-97 "General Specification for Semiconductor Optoelectronic Modules".
2 Referenced Documents
GB/T12507.1-2000 Optical Fiber and Cable Connectors Part 1: General Specifications GB/T15651-1995 Semiconductor Devices Discrete Devices and Integrated Circuits Part 5 Optoelectronic Devices GJB150.3-86 Environmental Test Methods for Military Equipment High Temperature Test GJB150.4-86 Environmental Test Methods for Military Equipment Low Temperature Test GJB179A95 Counting Sampling Procedures and Tables
GJB548A-96 Test Methods and Procedures for Microelectronic Devices GJB601A-98 General Specifications for Thermistors
GJB1919--94 Environment-Resistant Neutral Circular Optical Fiber General specification for optical cable connectors GJB1428A-99 General specification for optical cables
3 Test methods for semiconductor light-emitting devices
SJ2355--83
SJ2658-86
5 Test methods for semiconductor infrared light-emitting diodes Ministry of Information Industry of the People's Republic of China Issued on October 20, 2000 Implemented on October 20, 2000
SJ20642/7-2000
SJ20642-97 General specification for semiconductor optoelectronic modules 3 Requirements
3.1 Detailed requirements
Each requirement shall comply with the provisions of M1 level in SJ20642 and this specification. 3.2 Design, structure and material requirements
3.2.1 Design
The design of the component shall meet the requirements of the performance indicators and technical drawings. 3.2.2 Structure
3.2.2.1 Module structure
The module is composed of light-emitting diode chip, semiconductor cooler, thermistor, multi-mode optical cable, FC type active connector, etc.
3.2.2.2 Appearance structure and dimensions
The appearance structure of the module is shown in Figure 1, and the appearance dimensions are shown in Table 1. D
Minimum value
Nominal value
Maximum value
Nominal value
Maximum value
Figure 1 Appearance structure
Table 1 Appearance dimensions
3.2.2.3 Package
SJ20642/7--2000
The module adopts metallized coupling, dual in-line package, and pigtail output, as shown in Figure 2. Pigtail
3.2.2.4 Arrangement of lead ends
Metal conduit
Figure 2 Packaging form
Metal tube shell
Facing the lead pins, make the optical port point to the left, and count from the upper left corner in clockwise direction. The lead wires are 1, 2, .·14. See Figure 3, and the pin functions are shown in Table 2.
mother mother mother mother mother
123456
4321098
mother mother mother mother
Figure 3 Lead terminal arrangement
Table 2 Pin function
3.2.3 Materials
Refrigerator (+)
Shell grounding
Light emitting diode (-)
Light emitting diode (+), shell grounding
Thermistor
Thermistor
Refrigerator (-)
The materials used in the components are qualified materials inspected according to relevant standards or relevant regulations. And the materials used are evaluated according to the provisions of SJ20642.
3.2.3.1LED chip material
SJ20642/7—2000
LED chip material: InGaAsP/InP. 3.2.3.2Multimode optical cable
Multimode optical cable shall comply with the provisions of GJB1428A. 3.2.3.3FC type active connector
FC type active connector shall comply with the provisions of GB/T12507. 3.2.3.4Thermistor
Thermistor shall comply with the provisions of GJB601A. 3.2.3.5Lead material and plating
Lead material is Kovar alloy, and lead shall be gold plated. If the user requires to select other plating, it can be specified in the contract (see 6.2).
3.2.4Mass (weight)
Mass (weight) of the component: 30g±5g. 3.3 Appearance quality
The appearance quality of the module shall comply with the provisions of Article 3.4.4 of SJ20642. 3.4 Absolute maximum ratings and main optoelectronic characteristics 3.4.1 Absolute maximum ratings
The absolute maximum ratings are shown in Table 3.
Storage temperature
Working environment temperature
Welding temperature)
Minimum bending radius of the tail cable 21
Maximum axial tension of the tail cable 31
Reverse voltage
Maximum DC forward current
Cooling current
Note: 1) Time 10s, distance 1.5mm;
2) At least 2cm to the output end;
3) Time 1min.
3.4.2 Main optoelectronic characteristics (Tmb=25℃) The main optoelectronic characteristics are shown in Table 4.
Forward voltage
Radiant power
Peak emission wavelength
Spectral radiation bandwidth
Reverse current
Rise time
Thermistor
3.5 Mark
Test methodwww.bzxz.net
SJ2358.12
SJ2658.12
SJ2658.11
This specification 4.5.1
SJ20642/7—2000
Test conditions
ls=50mA
I,=100mA
@er=0.05mW
@.,=0.05mW
Ve=2 v
Pulse width 10nsPoint-to-space ratio 1:1
≤200μA
The marking shall comply with the provisions of SJ20642-97 and this specification: a. Model;
Quality assurance level:
Unit name or code;
Inspection batch number and tube number;
e. Others.
4 Quality assurance provisions
Sampling and inspection
Sampling and inspection shall comply with the provisions of SJ20642 and this specification. Parameter value
4.1.1 Sampling shall be carried out according to the single sampling plan specified in GJB179A, the inspection level shall be the general inspection level II, and the qualified quality level AQL shall be 1.0.
4.1.2 Samples can be taken from the batch that has passed the A group inspection and the B and C group inspections can be carried out at the same time. 4.1.3
The total sample quantity for identification test (referring to the number of batches that have passed the inspection of group A) shall be at least equal to 24.2 of the number of samples taken from groups B and C
It shall be in accordance with 4.10 and the provisions of Table 5 of this specification are subject to 100% screening inspection, 5
Test Item Date
Aging before sealing (not
applicable)
Internal visual inspection (cap
Stability baking
Temperature cycling
Mechanical shock
Swept frequency vibration
Photoelectric performance test
Radiant power
Forward voltage
Final photoelectric test
Radiant power
Forward voltage
Rough leak detection
Test method
Test condition B
SJ20642/7---2000
Table 5 Screening
GJB548A
T=70°C, t=168 h
Except the highest temperature of 70℃ and the lowest temperature of -40℃, the rest are as per the test conditions A, direction Y1
Test conditions A, direction Y1
Tamb=25℃
1=100mA
l=50mA
Tm=70℃C, refrigerator working,
1=120mA
t=96 h
l=100mA
I,=50mA
Test condition C, fluorine oil temperature: 70℃
Identification inspection
The verification inspection shall be carried out in accordance with the provisions of Table 6, Table 7, Table 8 and Table 9. 4.4 Quality consistency inspection
4.4.1 Group A inspection
It shall be carried out in accordance with the provisions of 4.12.1 and Table 6 of SJ20642. 6-
Limit value
Inspection items
Normal temperature test
High temperature test
Radiation power
Low temperature test
Forward voltage
4.4.2 Group B inspection
Test method
SJ20642/7-2000
Table 6 Group A inspection Test
Test conditions
Limit value
Tamb=25℃
See 3.4.2
Tm=70℃Refrigerator operation
See 3.4.2
Tamb=-40°CRefrigerator operation
See 3.4.2
Should be carried out in accordance with the provisions of 4.12.2 and Table 7 of SJ20642. Maximum
Meet the requirements of 3.4.2
Table 7 Group B test
Physical dimensions
Solvent resistance 1) 2)
Internal daily inspection and mechanical inspection
Bond strength
Chip shear strength
Solderability 1)
Note: 1) Unqualified products with electrical characteristics in the same inspection batch can be used. 2) Laser marking does not require this test.
4.4.3 Group C test
GJB548A
Test condition D
Sampling requirements
Omit pretreatment 245°C±5°C, 10s
Distance 1.5mm
Should be carried out in accordance with 4.12.3 of SJ20642 and Table 8 of this specification. AQL
15 (0)
15 (0)
External visual inspection
Temperature cycle
Mechanical shock
Axial tension of optical cable
Rough leak detection
End point photoelectric test
Low air pressure (not applicable)
Steady-state life test
End point photoelectric test
4.4.4D group test
SJ20642/7—2000
Table 8C group test
GJB548A
GJB1919
Test condition B
Except Except the maximum temperature of 70℃ and the minimum temperature of -40℃, the rest are as per test condition A
Test condition A, direction Y1
clamping method b, no traction speed required, F=10N, f=10min
Test condition C, fluorine oil temperature 70℃
see Table 10, steps 1 and 2
Tm=70C, refrigerator working, t=1000h, Is=120mA
see Table 10, steps 3 and 4
should be carried out in accordance with the provisions of 4.12.4 of SJ20642 and Table 9 of this specification. Table 9 D group test 1)
Heat shock
Stability baking
Lead firmness
Rough leak detection
GJB548A
Except the highest temperature of 70°℃C, the rest are in accordance with test condition A, number of cycles 15 times
Ts=70℃,=1 h
Test condition A
Test condition C, fluorine oil temperature: 70℃
Note: 1) D test group can use products with unqualified optoelectronic parameters in the same test batch. Table 10 C group electrical test
Radiation power. r
Forward voltage V
Radiation power.
Forward voltage V
Tamb=25 °C
Is=100mA
I,=50mA
=100mA
l=50mA
Note 1) Samples that do not meet the specified values in Article 3.4.2 are not allowed to be provided to users. 8
Limit value
4.5 Inspection and test methods
SJ20642/7--2000
Inspection and test methods shall comply with the provisions of SJ20642 and this specification. 4.5.1 Test of thermistor
Under the specified temperature conditions, connect the two ends of the thermistor to a digital voltmeter and read the resistance of the thermistor directly from the digital voltmeter.
Delivery preparation
The requirements for packaging, storage and transportation shall comply with the provisions of Article 5 of SJ20642. 6 Notes
Intended use
Components that comply with this specification are mainly used in military short-distance communication systems. 6.2
Order document content
The following contents shall be stated in the contract or order: a. Model and name of the product;
b. Number and release date of the detailed specification; c. Inspection data;
d. Order quantity;
If the lead is not gold-plated, the plating layer shall be specified (see 3.2.3.5); e.
f. Others.
6.3 Definitions
The terms, symbols and definitions used in this specification shall comply with the provisions of SJ2658, SJ2355 and GB/T15651. Additional Notes:
This standard is under the jurisdiction of China Electronics Technology Standardization Institute. This standard was drafted by the 44th Institute of Electronics Industry Department. The main drafters of this standard are Guo Ping, Li Chunfang, Wei Jin, and Deng Luqing. Project code: B81011.2
Tamb=-40°CRefrigerator operation
See 3.4.2
Should be carried out according to the provisions of 4.12.2 and Table 7 in SJ20642. Maximum
Meet the requirements of 3.4.2
Table 7 Group B inspection
Physical dimensions
Solvent resistance1)2)
Internal daily inspection and mechanical inspection
Bond strength
Chip shear strength
Solderability1)
Note: 1) Unqualified products with electrical characteristics in the same inspection batch can be used. 2) Laser marking does not require this test.
4.4.3 Group C inspection
GJB548A
Test conditions D
Sampling requirements
Omit pretreatment 245°C±5°C, 10s
Distance 1.5mm
Should be carried out in accordance with the provisions of 4.12.3 of SJ20642 and Table 8 of this specification. AQL
15 (0)
15 (0)
External visual inspection
Temperature cycle
Mechanical shock
Axial tension of optical cable
Rough leak detection
End point photoelectric test
Low air pressure (not applicable)
Steady-state life test
End point photoelectric test
4.4.4D group test
SJ20642/7—2000
Table 8C group test
GJB548A
GJB1919
Test condition B
Except Except the maximum temperature of 70℃ and the minimum temperature of -40℃, the rest are as per test condition A
Test condition A, direction Y1
clamping method b, no traction speed required, F=10N, f=10min
Test condition C, fluorine oil temperature 70℃
see Table 10, steps 1 and 2
Tm=70C, refrigerator working, t=1000h, Is=120mA
see Table 10, steps 3 and 4
should be carried out in accordance with the provisions of 4.12.4 of SJ20642 and Table 9 of this specification. Table 9 D group test 1)
Heat shock
Stability baking
Lead firmness
Rough leak detection
GJB548A
Except the highest temperature of 70°℃C, the rest are in accordance with test condition A, number of cycles 15 times
Ts=70℃,=1 h
Test condition A
Test condition C, fluorine oil temperature: 70℃
Note: 1) D test group can use products with unqualified optoelectronic parameters in the same test batch. Table 10 C group electrical test
Radiation power. r
Forward voltage V
Radiation power.
Forward voltage V
Tamb=25 °C
Is=100mA
I,=50mA
=100mA
l=50mA
Note 1) Samples that do not meet the specified values in Article 3.4.2 are not allowed to be provided to users. 8
Limit value
4.5 Inspection and test methods
SJ20642/7--2000
Inspection and test methods shall comply with the provisions of SJ20642 and this specification. 4.5.1 Test of thermistor
Under the specified temperature conditions, connect the two ends of the thermistor to a digital voltmeter and read the resistance of the thermistor directly from the digital voltmeter.
Delivery preparation
The requirements for packaging, storage and transportation shall comply with the provisions of Article 5 of SJ20642. 6 Notes
Intended use
Components that comply with this specification are mainly used in military short-distance communication systems. 6.2
Order document content
The following contents shall be stated in the contract or order: a. Model and name of the product;
b. Number and release date of the detailed specification; c. Inspection data;
d. Order quantity;
If the lead is not gold-plated, the plating layer shall be specified (see 3.2.3.5); e.
f. Others.
6.3 Definitions
The terms, symbols and definitions used in this specification shall comply with the provisions of SJ2658, SJ2355 and GB/T15651. Additional Notes:
This standard is under the jurisdiction of China Electronics Technology Standardization Institute. This standard was drafted by the 44th Institute of Electronics Industry Department. The main drafters of this standard are Guo Ping, Li Chunfang, Wei Jin, and Deng Luqing. Project code: B81011.2
Tamb=-40°CRefrigerator operation
See 3.4.2
Should be carried out according to the provisions of 4.12.2 and Table 7 in SJ20642. Maximum
Meet the requirements of 3.4.2
Table 7 Group B inspection
Physical dimensions
Solvent resistance1)2)
Internal daily inspection and mechanical inspection
Bond strength
Chip shear strength
Solderability1)
Note: 1) Unqualified products with electrical characteristics in the same inspection batch can be used. 2) Laser marking does not require this test.
4.4.3 Group C inspection
GJB548A
Test conditions D
Sampling requirements
Omit pretreatment 245°C±5°C, 10s
Distance 1.5mm
Should be carried out in accordance with the provisions of 4.12.3 of SJ20642 and Table 8 of this specification. AQL
15 (0)
15 (0)
External visual inspection
Temperature cycle
Mechanical shock
Axial tension of optical cable
Rough leak detection
End point photoelectric test
Low air pressure (not applicable)
Steady-state life test
End point photoelectric test
4.4.4D group test
SJ20642/7—2000
Table 8C group test
GJB548A
GJB1919
Test condition B
Except Except the maximum temperature of 70℃ and the minimum temperature of -40℃, the rest are as per test condition A
Test condition A, direction Y1
clamping method b, no traction speed required, F=10N, f=10min
Test condition C, fluorine oil temperature 70℃
see Table 10, steps 1 and 2
Tm=70C, refrigerator working, t=1000h, Is=120mA
see Table 10, steps 3 and 4
should be carried out in accordance with the provisions of 4.12.4 of SJ20642 and Table 9 of this specification. Table 9 D group test 1)
Heat shock
Stability baking
Lead firmness
Rough leak detection
GJB548A
Except the highest temperature of 70°℃C, the rest are in accordance with test condition A, number of cycles 15 times
Ts=70℃,=1 h
Test condition A
Test condition C, fluorine oil temperature: 70℃
Note: 1) D test group can use products with unqualified optoelectronic parameters in the same test batch. Table 10 C group electrical test
Radiation power. r
Forward voltage V
Radiation power.
Forward voltage V
Tamb=25 °C
Is=100mA
I,=50mA
=100mA
l=50mA
Note 1) Samples that do not meet the specified values in Article 3.4.2 are not allowed to be provided to users. 8
Limit value
4.5 Inspection and test methods
SJ20642/7--2000
Inspection and test methods shall comply with the provisions of SJ20642 and this specification. 4.5.1 Test of thermistor
Under the specified temperature conditions, connect the two ends of the thermistor to a digital voltmeter and read the resistance of the thermistor directly from the digital voltmeter.
Delivery preparation
The requirements for packaging, storage and transportation shall comply with the provisions of Article 5 of SJ20642. 6 Notes
Intended use
Components that comply with this specification are mainly used in military short-distance communication systems. 6.2
Order document content
The following contents shall be stated in the contract or order: a. Model and name of the product;
b. Number and release date of the detailed specification; c. Inspection data;
d. Order quantity;
If the lead is not gold-plated, the plating layer shall be specified (see 3.2.3.5); e.
f. Others.
6.3 Definitions
The terms, symbols and definitions used in this specification shall comply with the provisions of SJ2658, SJ2355 and GB/T15651. Additional Notes:
This standard is under the jurisdiction of China Electronics Technology Standardization Institute. This standard was drafted by the 44th Institute of Electronics Industry Department. The main drafters of this standard are Guo Ping, Li Chunfang, Wei Jin, and Deng Luqing. Project code: B81011.
f. Others.
6.3 Definitions
The terms, symbols and definitions used in this specification shall comply with the provisions of SJ2658, SJ2355 and GB/T15651. Additional remarks:
This standard is under the jurisdiction of the China Electronics Technology Standardization Institute. This standard was drafted by the 44th Institute of the Electronics Industry Department. The main drafters of this standard are: Guo Ping, Li Chunfang, Wei Jin, and Deng Luqing. Project code: B81011.
f. Others.
6.3 Definitions
The terms, symbols and definitions used in this specification shall comply with the provisions of SJ2658, SJ2355 and GB/T15651. Additional remarks:
This standard is under the jurisdiction of the China Electronics Technology Standardization Institute. This standard was drafted by the 44th Institute of the Electronics Industry Department. The main drafters of this standard are: Guo Ping, Li Chunfang, Wei Jin, and Deng Luqing. Project code: B81011.
Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.