SJ/T 11125-1997 Epoxy potting materials for electronic devices SJ/T11125-1997 Standard download decompression password: www.bzxz.net

ICS31-030
Record number: 694-1997
Electronic Industry Standard of the People's Republic of China
SJ/T11125-1997
Encapsulation materials of epoxy seriesfor use in electronic components
Issued on 1997-09-03
Implemented on 1998-01-01
Issued by the Ministry of Electronics Industry of the People's Republic of ChinaTYYKAONKAca
This standard is formulated to meet the needs of epoxy series encapsulation materials for electronic components. Since there is no corresponding international standard to follow, this standard is based on the data and experience accumulated by major domestic production and use units for many years in terms of technical indicators and test methods, and refers to the information of relevant foreign companies. It has certain advancement and mature implementation conditions.
The test methods of this standard adopt the published national industry standards as much as possible. Appendix A of this standard is the appendix of the standard.
This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by the Standardization Institute of the Ministry of Electronics Industry, the State-owned Beijing Third Radio Equipment Factory, and the Tianjin Synthetic Materials Research Institute.
The main drafters of this standard are: Wang Yongming, Li Xiaoying, Han Yanfen, and Wang Zeyang. YYKAONKAca
1 Scope
Electronic Industry Standard of the People's Republic of China
Encapsulation materials of epoxy seriesfor use in electronic components
Encapsulation materials of epoxy seriesfor use in electronic componentsSJ/T11125-1997
This standard specifies the classification, requirements, test methods, inspection rules, packaging, marking, transportation, and storage of epoxy series encapsulation materials for use in electronic components (hereinafter referred to as encapsulation materials). This standard is applicable to the encapsulation materials required for various electronic components that are encapsulated using metal or plastic molds or shells. 2 Referenced Standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards are subject to revision, and parties using this standard should explore the possibility of using the latest versions of the following standards.
GB1034--86
GB1036-89
GB1408—89
GB1409—88
GB1410—89
GB163479
GB2411--80
GB2794-81
GB6554—-86
SJ3262—89
SJ/7.9132—87
3 Classification and naming
Test method for water absorption of plastics
Linear expansion coefficient of plastics Number determination method
Test method for power frequency electrical strength of solid insulating materialsTest method for relative dielectric constant and dielectric loss factor of solid insulating materials at power frequency, audio frequency and high frequency (including meter wavelength)
Test method for volume resistivity and surface resistivity of solid insulating materialsTest method for heat deformation temperature (abbreviated as heat deformation temperature) of plastic bending loadTest method for Shore hardness of plastics
Method for determining viscosity of adhesives
Test method for electrical insulation coating powder
General technical conditions for encapsulation materials for electronic componentsFlammability test of plastic materials used in parts of various electrical devices and equipment. Product models and representation methods shall comply with the provisions of Chapter 3 of SJ3262-87. 4 Requirements
4.1 Liquid material properties
The appearance of the potting material is a viscous liquid with no visible impurities and foreign matter. Color, viscosity and gel time shall be in accordance with the provisions of the Ministry of Electronics Industry of the People's Republic of China approved on September 3, 1997 and implemented on January 1, 1998.
4.2 Properties of Cured Material
The properties of cured material shall comply with the provisions of Table 1.
Test method
Average linear expansion coefficient
Dielectric constant 1MHz
Hardness (Shore hardness)
Normal volume resistivity
SJ/T11125-1997
Normal 10°Hz dielectric loss tangent
Electrical strength
Heat deformation temperature
Flame retardancy
Water absorption
≤5×10-5
≥1×1015
≥100
Unless otherwise specified, the sample preparation and pretreatment in the test method shall be carried out in accordance with the provisions of Appendix A (Appendix to the standard). 5.1 Liquid
5.1.1 Appearance and color shall be inspected by visual inspection.
5.1.2Viscosity is tested according to GB2794
5.1.3Gelation time is tested according to the equipment specified in 1.5.1 of GB6554-86 or using HG-1 gel time tester; the temperature of the hot plate is 150℃±0.5℃: weigh 10g of component A, add component B according to the product manual, mix well and take about 1g of sample and place it in the center area of ​​the preheated hot plate, start the stopwatch at the same time, stir the sample continuously with a spatula, and stop the stopwatch immediately when the sample just cannot be drawn, and record the required time: parallel test twice, the difference should be less than 5s, and the average value is taken as the test result.
5.2Curing
5.2.1The average linear expansion coefficient is tested according to GB1036. 5.2.2The dielectric constant is tested according to GB1409.
Hardness is tested according to GB2411.
Normal volume resistivity is tested according to GB1410. 5.2.4
5.2.5Normal 10°Hz dielectric loss tangent is tested according to GB1409. 5.2.6Electric strength is tested according to GB1048.
Heat deformation temperature is tested according to GB1634.
Flame retardancy is tested according to SJ/Z.9132.
5.2.9Water absorption is tested according to GB1034. 5.3Packaging and marking are inspected by visual inspection, and the results shall comply with the requirements of 7.1 and 7.2. 6Inspection rules
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6.1Inspection responsibilities
SJ/T11125-1997
6.1.1The product shall be inspected by the supplier's technical supervision department to ensure that the product quality meets the requirements of this standard and fill in the product certificate.
6.1.2 The purchaser may inspect the products received. If the inspection results do not comply with the provisions of this standard, the purchaser shall submit the matter to the supplier within one month from the date of receipt of the product, and the two parties shall negotiate to resolve the issue. 6.2 Batch
Each batch submitted shall consist of products of the same model and produced under the same process conditions (with barrels as unit products). Each batch of products shall not exceed 5t.
6.3 Sampling
Three barrels shall be randomly selected from each submitted batch, and the total sample volume shall not be less than 1kg. The samples taken shall be mixed evenly. 6.4 Inspection classification
Product inspection is divided into delivery inspection and routine inspection. 6.4.1 Delivery inspection items shall be carried out in accordance with the provisions of Table 2. Table 2
Liquid appearance
Dielectric band number
Inspection or test items
Normal volume resistivity
Normal dielectric loss tangent
Electrical strength
Flame retardancy
Required chapter number
Test method clause number
6.4.2 If one item of the delivery inspection is unqualified, double sampling should be carried out for re-inspection of the unqualified item. If the re-inspection result is still unqualified, the batch of products is unqualified.
Routine inspection items shall be carried out in accordance with the provisions of Table 3
Liquid appearance
Inspection or test items
Average linear expansion coefficient
Dielectric constant
Normal volume resistivity
Normal dielectric loss tangent
Electrical strength
Heat deformation temperature
Flame retardancy
Required chapter numberwww.bzxz.net
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Test method clause number
SJ/T11125-1997
6.4.4 Routine inspection shall be carried out every six months. Routine inspection shall also be carried out when there are major changes in materials, processes, equipment, etc. 6.4.5 Routine inspection samples shall be selected from the products produced this year and passed the delivery inspection according to 6.3. If there is one item that fails in the sampling and inspection, the routine inspection will be deemed as unqualified. At the same time, the products within the cycle will be stopped from being delivered and the original prisoner should be analyzed, measures should be taken, and production can only be carried out after re-inspection.
7 Packaging, marking, transportation, storage
7.1 Packaging
7.1.1 The potting material should be sealed in an iron drum or plastic drum with a protective coating. Each color unit should not exceed 25kg, and the net weight of each package should be the same.
7.1.2 Each batch of products delivered should be accompanied by product instructions and quality certificates. 7.2 Marking
Each outer package of the product should be affixed with a label, which should indicate: a) product name and trademark;
b) product model;
e) net weight, kg;
d) number of this standard:
manufacturing date and manufacturer's name;
inspector's mark.
7.3 Transportation
The product should be transported under the condition of avoiding direct rain, snow, sunlight and mechanical damage. 7.4 Storage
The product should be stored in a dry and ventilated warehouse. The storage period at room temperature is half a year. YYKAONrKAa
Apparatus required for sample preparation
SJ/T11125-1997
Appendix A
(Appendix of the standard)
Sample preparation method of epoxy potting material for electronic components Balance: accuracy is 0.1g;
Beaker: select the beaker capacity according to the sampling amount; Oven: temperature fluctuation range ±0.5℃;
One set of vacuum degassing equipment:
One set of molds;
Stirring glass rod;
One electric furnace and one asbestos net.
Environmental conditions:
Environmental temperature: 20℃~35℃;
Relative humidity: 45%~75%.
A3 Sample preparation steps
Weigh a certain amount of components A and B according to the product manual, stir them thoroughly in a beaker, mix them evenly and heat them to a
specified temperature;
Degas the prepared mixture by vacuum; pour the degassed material into a mold coated with a release agent and heated to a specified temperature; put the mold filled with the material into an oven and heat it according to the specified curing conditions: stop heating after curing, and take the sample out of the mold after cooling to room temperature. YYKAONrKAcas
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