SJ 20633-1997 Specification for Self-extinguishing Epoxy Powder Encapsulant SJ20633-1997 Standard download decompression password: www.bzxz.net

Military Standard of the Electronic Industry of the People's Republic of China FL5973
SJ20633-97
Specification for epoxide powder encapsulatingmaterial of self-extinguishingPublished on June 17, 1997
Implementation on October 1, 1997Approved by the Ministry of Electronics Industry of the People's Republic of ChinaMilitary Standard of the Electronic Industry of the People's Republic of ChinaSpecification for epoxide powder encapsulatingmaterial of self-extinguishing1Scope
1.1Subject Content
SJ20633-97
This specification specifies the requirements, quality assurance provisions, delivery preparation and instructions for self-extinguishing epoxy powder encapsulating materials (hereinafter referred to as encapsulating materials) for electronic components.
1.2 Scope of application
This specification applies to the outer packaging materials used for electronic components such as ceramic capacitors, varistors, molybdenum electrolytic capacitors, monolithic capacitors, resistor networks and thick film circuits.
1.3 Classification and naming
The classification and model naming method of packaging materials shall comply with the provisions of Chapter 3 of SJ3262. 2 Referenced Documents
GB1034---86
GB1036—89
GB1408—89
GB1409-88
GB1410-89
GB2411-80
GB655486
SJ3262—89
SJ/Z9132—87
3 Requirements
3.1 Qualification Appraisal
Test Method for Water Absorption of Plastics
Test Method for Linear Expansion Coefficient of Plastics Determination method
Test method for power frequency electrical strength of solid insulating materialsTest method for relative dielectric constant and dielectric loss factor of solid insulating materials at power frequency, audio frequency and high frequency (including metric waves)
Test method for volume resistivity and surface resistivity of solid insulating materialsTest method for Shore hardness of plastics
Test method for electrical insulation coating powder
General technical conditions for encapsulation materials for electronic componentsFlammability test of plastic materials for parts in various electrical devices and equipmentProducts submitted in accordance with this specification shall be qualified or approved by finalization. 3.2 Performance
The powder performance and solidified performance of the encapsulation material shall comply with the provisions of Table 1 and Table 2. Issued by the Ministry of Electronics Industry of the People's Republic of China on June 17, 1997 and implemented on October 1, 1997
SJ20633-97
Powder properties of encapsulating materials
(through 80 mesh sieve)
Apparent density
Softening point
Gel time (160℃)
Horizontal flow rate (150℃)
Note: When there are special requirements for particle size, the supply and demand parties shall negotiate to resolve it. To be
in powder form, with uniform color, no lumps, no visible impurities,
60~200
Table 2 Properties of cured encapsulation materials
Average linear expansion coefficient
Hardness (Shore hardness)
Volume resistivity
Permittivity (dielectric constant)
(1MHz)
Dielectric loss tangent
(1MHz))
Electrical strength
Temperature shock resistance (~55℃~125℃) times
Smooth surface, no bubbles, no pinholes, no impurity points.
≤5×10-5
≥1×1015(normal state)
≥1×1013(after moisture)
≤0.025(normal state)
≤0.07(after moisture)
No cracking after 5 cycles
4 Quality Assurance Provisions
4.1 Inspection Responsibility
SJ20633—97
Continued Table 2
Water absorption (soaking for 24h)
Solvent resistance
Flame retardancy
Edge and corner coverage
No swelling, cracking, or peeling
V-0 grade
Unless otherwise specified in the contract or order, the contractor shall be responsible for completing all inspections specified in this specification. When necessary, the ordering party or the superior appraisal agency has the right to inspect any of the inspection items described in this specification. 4.1.1 Responsibility for Conformity
All products must comply with all requirements of Chapter 3 and Chapter 5 of this specification. The inspections specified in this specification shall become an integral part of the contractor's entire inspection system or quality program. If the contract includes inspection requirements not specified in this specification, the contractor shall also ensure that the products submitted for acceptance meet the requirements of the contract. Quality consistency sampling does not allow the submission of products that are known to be defective, nor can the ordering party be required to accept defective products. 4.2 Inspection classification
The inspections specified in this specification are divided into:
a. Appraisal inspection;
b. Quality consistency inspection.
4.3 Environmental conditions
If not otherwise specified in the contract or order, all inspections shall be carried out under the following standard atmospheric conditions: temperature: 15~35℃;
Relative humidity: 45%~75%;
Air pressure: 86~106kPao
4.4 Identification inspection
4.4.1 Identification inspection shall be carried out before the product is officially put into production, and identification inspection shall also be carried out when there are major changes in raw materials or manufacturing processes.
4.4.2 Identification inspection shall be carried out in a laboratory (test station) approved by the superior authority or the competent department. The samples for identification inspection shall be products produced by equipment, processes and materials normally used in future production. Samples shall be randomly selected, not less than three packages, and the total sample amount shall not be less than 1kg, and they shall be mixed evenly. Sample preparation shall be prepared according to Appendix A (Supplement) or the encapsulated products shall be used directly as samples.
4.4.3 The items for identification and inspection shall be in accordance with the provisions of Table 1 and Table 2 of this specification. 4.4.4 When the encapsulating material is tested according to the test method specified in Article 4.7 of this specification, if the indicators of all samples meet the provisions of Table 1 and Table 2 of this specification, the encapsulating material is considered to have passed the identification and inspection. 4.4.5 In order to maintain the qualification for identification, the contractor shall submit batch-by-batch and periodic test data every year. 4.5 Quality consistency inspection
Quality consistency inspection includes batch-by-batch inspection and periodic inspection. 4.5.1 Batch inspection
4.5.1.1 Inspection batch
An inspection batch consists of encapsulating materials with the same formula, continuously produced under the same conditions and submitted for inspection at the same time. Each batch shall not exceed 500kg.
4.5.1.2 Inspection Items
When the encapsulation materials are delivered, they must be inspected batch by batch. The inspection items are the appearance, particle size, gel time, horizontal flow rate in Table 1 and the permittivity, normal dielectric loss tangent, normal volume resistivity, dielectric strength and flame retardancy in Table 2. 4.5.1.3 Sampling
The sampling method and sample quantity shall comply with the provisions of Article 4.4.2 and the corresponding test methods. 4.5.1.4 Judgment Rules
If one or more of the inspection results do not meet the requirements of Table 1 and Table 2, double sampling should be carried out from the batch, and the unqualified items should be re-inspected. If the re-inspection still fails, the batch of products shall be unqualified. 4.5.2 Periodic Inspection
4.5.2.1 Inspection Items and Periodicity
In order to determine whether the encapsulation material meets the requirements of this specification, the contractor shall conduct periodic inspection according to the items specified in Table 1 and Table 2, and the periodic inspection shall not be less than once a year. Periodic inspection shall also be carried out when the manufacturing process or raw materials are significantly changed. 4.5.2.2 Sampling and Sample Preparation
Samples shall be sampled and prepared in accordance with the provisions of Article 4.4.2 and the corresponding test methods from the products that have passed the batch inspection. 4.5.2.3 Judgment Rules
When the encapsulation material is inspected according to the inspection method specified in Section 4.7 of this specification, if the indicators of all the samples meet the provisions of Table 1 and Table 2 of this specification, the encapsulation material is considered to be qualified. If one sample does not meet any requirement of this specification during the inspection, the unqualified items shall be re-inspected with twice the number of samples made from the same batch of encapsulation materials. If the re-inspection still fails, the encapsulation material is considered to be unqualified. 4.6 Packaging Inspection
The packaging and marking requirements specified in Chapter 5 of this specification shall be inspected visually. Any transport packaging box that does not meet the requirements of Chapter 5 shall be deemed to have failed the packaging inspection. 4.7 Inspection method
4.7.1 Appearance
The appearance of the encapsulating material shall be inspected by visual inspection. 4.7.2 Particle size
The particle size shall be inspected in accordance with the provisions of Article 1.3 of GB6554. 4.7.3 Apparent density
The apparent density shall be inspected in accordance with the provisions of Article 1.1 of GB6554. 4.7.4 Softening point
The softening point shall be inspected in accordance with the provisions of Article 1.4 of GB6554. 4.7.5 Gel time
SJ20633—97
Gel time shall be inspected in accordance with the provisions of Article 1.5 of GB6554. 4.7.6 Horizontal flow rate
The horizontal flow rate shall be inspected in accordance with the provisions of Article 1.6 of GB6554. 4.7.7 Average linear expansion coefficient
The average linear expansion coefficient shall be inspected in accordance with the provisions of GB1036. 4.7.8 Hardness
Hardness shall be tested in accordance with the provisions of GB2411. 4.7.9 Volume resistivity
Volume resistivity shall be tested in accordance with the provisions of GB1410. The volume resistivity after moisture is tested by placing the sample in a wet heat box at a temperature of 40℃±2℃ and a relative humidity of 90%~95% for 504h, and then testing it in accordance with the provisions of GB1410. 4.7.10 Permittivity
Permittivity shall be tested in accordance with the provisions of GB1409. 4.7.11 Dielectric loss tangent
Dielectric loss tangent shall be tested in accordance with the provisions of GB1409. The dielectric loss tangent after moisture is tested by placing the sample in a wet heat box at a temperature of 40℃±2℃ and a relative humidity of 90%~95% for 504h, and then testing it in accordance with the provisions of GB1409. 4.7.12 Dielectric strength
Dielectric strength shall be tested in accordance with the provisions of GB1408. 4.7.13 Temperature shock resistance
Use 18 encapsulated products (diameter ≥ 20mm, thickness h ≥ 1mm) to cycle 5 times under the following conditions, and then use the visual method to test.
-55℃-3
4.7.14 Solvent resistance
→>125℃+3
≤1min
Solvent resistance Use 10 encapsulated products (diameter 2mm, thickness h ≥ 1mm) to soak in a mixed solution of acetone and xylene = 1:1 for 1h, and then test. 4.7.15 Water absorption
Water absorption shall be tested in accordance with the provisions of GB1034. 4.7.16 Corner coverage
Corner coverage shall be tested in accordance with the provisions of GB6554. 4.7.17 Flame retardancy
Flame retardancy shall be tested in accordance with the provisions of SJ/Z9132. 5 Delivery Preparation
5.1 Marking
5.1.1 The packaging bag of the encapsulating material shall be filled with the certificate of conformity, which shall indicate: Name of the manufacturer;
b. Product name;
c. Trademark;
Product model or mark;
SJ20633-97
Manufacturing date (or number) and production batch number: f. Standard code;
Inspector's seal. The outer packaging of the encapsulating material shall have the following markings, and shall be marked with "moisture-proof" and "heat-resistant" marks. Name of the manufacturer;
Product name or model specification code;
c. Trademark;
Product model or mark;
Manufacturing date and production batch number.
5.2 Packaging
The encapsulating materials shall be first packed into polyethylene or polypropylene plastic bags, heat-sealed, and then packed into plastic barrels or fiberboard barrels. The weight of each barrel shall not exceed 30kg.
5.3 Transportation
The encapsulating materials can be transported by any means of transportation. During transportation, they shall be protected from moisture, damage, sunlight and high temperature. 5.4 Storage
The encapsulating materials shall be stored in a ventilated, dry warehouse with a temperature not exceeding 25°C. The product storage period is 4 months. 6 Notes
6.1 Intended use
The encapsulating materials specified in this specification are intended for the outer packaging of electronic components such as ceramic capacitors, varistors, molybdenum electrolytic capacitors, monolithic capacitors, inductors, resistor networks and thick film circuits. 6.2 Contents of ordering documents
The following contents shall be stated in the contract or order: a. The name and number of this specification;
b. Product model and name;
c. Quantity.
d. Other contents that need to be explained.
SJ20633—97
Appendix A
Sample preparation method of epoxy powder encapsulation material for electronic components (supplement)
A1 Apparatus required for sample preparation
Small vertical injection molding machine;
Transfer injection mold (should be matched with injection molding machine); b.
c. Press machine;
Pre-pressed cylindrical ring mold (its diameter is not larger than the diameter of the injection molding machine bin); d.
Oven: the temperature fluctuation range is not more than ±1℃. 2 Sample preparation steps
Before sample preparation, conduct mechanical and power inspections on the injection machine; a.
Preheat the mold and perform demoulding treatment on the inner surface of the mold. The preheating temperature is generally higher than the softening point of the encapsulation material by 1020℃; b.
c. Take an appropriate amount of powder encapsulation material and pre-press or cylindrically shape it at room temperature. Its diameter should be smaller than the diameter of the silo; put the pre-pressed material block into the silo;
Start the injection machine, close the mold, and inject the material in the silo into the mold. The injection pressure is selected according to the type of encapsulation material. The encapsulation material injected into the mold must be kept in the mold for a certain time, generally not more than 2 minutes; f.
g: Take out the injection molded sample from the mold and heat and cure it again. The curing temperature and time shall be in accordance with the provisions of the product manual. The cured powder encapsulation material is the sample required for the test. Additional instructions:
This specification is under the jurisdiction of the China Electronics Technology Standardization Institute. This specification was drafted by China Electronics Standardization Institute, State-owned Factory No. 704, and State-owned Factory No. 798. The main drafters of this specification are: Wang Yugong, Li Xiaoying, Wang Yongming, and Liu Nianjie. Project code: B55004.1. The packaging bag of the encapsulating material shall be filled with the certificate of conformity, which shall indicate: the name of the manufacturer;
b. Product name;
c. Trademark;
Product model or mark;
SJ20633-97
Manufacturing date (or number) and production batch number: f. Standard code; www.bzxz.net
Inspector's seal.
The outer packaging of the encapsulating material shall have the following marks, and shall be marked with "moisture-proof" and "heat-resistant" marks. The name of the manufacturer;
Product name or model specification code;
c. Trademark;
Product model or mark;
Manufacturing date and production batch number.
5.2 Packaging
The encapsulating material shall first be packed into polyethylene or polypropylene plastic bags, heat-sealed, and then packed into plastic barrels or fiberboard barrels. The weight of each barrel shall not exceed 30kg.
5.3 Transportation
The encapsulating material can be transported by any means of transportation. During transportation, it should be protected from moisture, damage, sunlight and high temperature. 5.4 Storage
The encapsulating material should be stored in a ventilated, dry warehouse with a temperature not exceeding 25℃. The product storage period is 4 months. 6 Explanations
6.1 Intended use
The encapsulating material specified in this specification is intended for the outer packaging of electronic components such as ceramic capacitors, varistors, molybdenum electrolytic capacitors, monolithic capacitors, inductors, resistor networks and thick film circuits. 6.2 Contents of ordering documents
The following contents should be stated in the contract or order: a. The name and number of this specification;
b. Product model and name;
c. Quantity.
d. Other contents that need to be explained.
SJ20633—97
Appendix A
Sample preparation method of epoxy powder encapsulation material for electronic components (supplement)
A1 Apparatus required for sample preparation
Small vertical injection molding machine;
Transfer injection mold (should be matched with injection molding machine); b.
c. Press machine;
Pre-pressed cylindrical ring mold (its diameter is not larger than the diameter of the injection molding machine bin); d.
Oven: the temperature fluctuation range is not more than ±1℃. 2 Sample preparation steps
Before sample preparation, conduct mechanical and power inspections on the injection machine; a.
Preheat the mold and perform demoulding treatment on the inner surface of the mold. The preheating temperature is generally higher than the softening point of the encapsulation material by 1020℃; b.
c. Take an appropriate amount of powder encapsulation material and pre-press or cylindrically shape it at room temperature. Its diameter should be smaller than the diameter of the silo; put the pre-pressed material block into the silo;
Start the injection machine, close the mold, and inject the material in the silo into the mold. The injection pressure is selected according to the type of encapsulation material. The encapsulation material injected into the mold must be kept in the mold for a certain time, generally not more than 2 minutes; f.
g: Take out the injection molded sample from the mold and heat and cure it again. The curing temperature and time shall be in accordance with the provisions of the product manual. The cured powder encapsulation material is the sample required for the test. Additional instructions:
This specification is under the jurisdiction of the China Electronics Technology Standardization Institute. This specification was drafted by China Electronics Standardization Institute, State-owned Factory No. 704, and State-owned Factory No. 798. The main drafters of this specification are: Wang Yugong, Li Xiaoying, Wang Yongming, and Liu Nianjie. Project code: B55004.1. The packaging bag of the encapsulating material shall be filled with the certificate of conformity, which shall indicate: the name of the manufacturer;
b. Product name;
c. Trademark;
Product model or mark;
SJ20633-97
Manufacturing date (or number) and production batch number: f. Standard code;
Inspector's seal.
The outer packaging of the encapsulating material shall have the following marks, and shall be marked with "moisture-proof" and "heat-resistant" marks. The name of the manufacturer;
Product name or model specification code;
c. Trademark;
Product model or mark;
Manufacturing date and production batch number.
5.2 Packaging
The encapsulating material shall first be packed into polyethylene or polypropylene plastic bags, heat-sealed, and then packed into plastic barrels or fiberboard barrels. The weight of each barrel shall not exceed 30kg.
5.3 Transportation
The encapsulating material can be transported by any means of transportation. During transportation, it should be protected from moisture, damage, sunlight and high temperature. 5.4 Storage
The encapsulating material should be stored in a ventilated, dry warehouse with a temperature not exceeding 25℃. The product storage period is 4 months. 6 Explanations
6.1 Intended use
The encapsulating material specified in this specification is intended for the outer packaging of electronic components such as ceramic capacitors, varistors, molybdenum electrolytic capacitors, monolithic capacitors, inductors, resistor networks and thick film circuits. 6.2 Contents of ordering documents
The following contents should be stated in the contract or order: a. The name and number of this specification;
b. Product model and name;
c. Quantity.
d. Other contents that need to be explained.
SJ20633—97
Appendix A
Sample preparation method of epoxy powder encapsulation material for electronic components (supplement)
A1 Apparatus required for sample preparation
Small vertical injection molding machine;
Transfer injection mold (should be matched with injection molding machine); b.
c. Press machine;
Pre-pressed cylindrical ring mold (its diameter is not larger than the diameter of the injection molding machine bin); d.
Oven: the temperature fluctuation range is not more than ±1℃. 2 Sample preparation steps
Before sample preparation, conduct mechanical and power inspections on the injection machine; a.
Preheat the mold and perform demoulding treatment on the inner surface of the mold. The preheating temperature is generally higher than the softening point of the encapsulation material by 1020℃; b.
c. Take an appropriate amount of powder encapsulation material and pre-press or cylindrically shape it at room temperature. Its diameter should be smaller than the diameter of the silo; put the pre-pressed material block into the silo;
Start the injection machine, close the mold, and inject the material in the silo into the mold. The injection pressure is selected according to the type of encapsulation material. The encapsulation material injected into the mold must be kept in the mold for a certain time, generally not more than 2 minutes; f.
g: Take out the injection molded sample from the mold and heat and cure it again. The curing temperature and time shall be in accordance with the provisions of the product manual. The cured powder encapsulation material is the sample required for the test. Additional instructions:
This specification is under the jurisdiction of the China Electronics Technology Standardization Institute. This specification was drafted by China Electronics Standardization Institute, State-owned Factory No. 704, and State-owned Factory No. 798. The main drafters of this specification are: Wang Yugong, Li Xiaoying, Wang Yongming, and Liu Nianjie. Project code: B55004.
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