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General specification for soldering pasts

Basic Information

Standard ID: SJ/T 11186-1998

Standard Name:General specification for soldering pasts

Chinese Name: 锡铅膏状焊料通用规范

Standard category:Electronic Industry Standard (SJ)

state:Abolished

Date of Release1998-03-11

Date of Implementation:1998-05-01

Date of Expiration:2010-01-01

standard classification number

Standard ICS number:Electronics>>Electromechanical components for electronic and telecommunications equipment>>31.220.01 General electromechanical components

Standard Classification Number:General>>Standardization Management and General Provisions>>A01 Technical Management

associated standards

alternative situation:Replaced by SJ/T 11186-2009

Procurement status:ANSI/J-STD 005-1995 NEQ

Publication information

publishing house:Electronic Industry Press

Publication date:1998-04-01

other information

drafter:Zhu Yunhe, Liu Fugui, Xing Huafei, Liu Chunguang, Li Xuejin, Tong Xiaoming, Liang Yongsheng, Jing Xiaoli

Drafting unit:Technology Research Institute and Standardization Research Institute of the Ministry of Electronics Industry

Focal point unit:Standardization Institute of the Ministry of Electronics Industry

Publishing department:Ministry of Electronics Industry of the People's Republic of China

Introduction to standards:

This standard specifies the classification and naming, requirements, test methods, inspection rules and marking, packaging, transportation and storage of tin-lead paste solder (referred to as solder paste) for surface mount components and electronic circuit interconnection. This standard applies to all types of tin-lead solder paste used for soft soldering when surface mount components and electronic circuits are interconnected. SJ/T 11186-1998 General Specification for Tin-Lead Paste Solder SJ/T11186-1998 Standard Download Decompression Password: www.bzxz.net
This standard specifies the classification and naming, requirements, test methods, inspection rules and marking, packaging, transportation and storage of tin-lead paste solder (referred to as solder paste) for surface mount components and electronic circuit interconnection. This standard applies to all types of tin-lead solder paste used for soft soldering when surface mount components and electronic circuits are interconnected.

GB/T 1480-1995 Determination of particle size composition of metal powders-Dry sieving method
GB/T 2794-1995 Determination of viscosity of adhesives
GB 3131-88 Tin-lead solder
GB/T 3375-1994 Welding terminology
GB 5231-85 Chemical composition and product shape of processed copper
GB 9491-88 Liquid flux for soldering (rosin based)
GB 10574-89 Chemical analysis method for tin-lead solder
SJ/T 10668-1995 Terminology of surface mounting technology

Some standard content:

1cs31.220.01
Customer request number: 3915-1999
Electronic Industry Standard of the People's Republic of China
S1/T11186-1998
General specification for soldering pasts1998-03-11issued
1998-05-01implemented
Issued by the Ministry of Electronics Industry of the People's Republic of ChinaYKhK
Test and delivery
Inspection rules
Marking, installation, transportation and marketing
This standard adopts the industrial standard ANSI/-STD-0051995) for commercial solder pastes and is now in effect) and is valid until the 1st year.
The main differences between this standard and the ANSI/-STD-OS standard are: (1) Classification and expression method: The classification of alloys and raw materials does not follow the relevant national standards, and the classification of lead solder should follow the Chinese standard G3131); the classification of glaze does not follow the national standards but follows the Chinese standard GB949 (liquid glaze). In order to coordinate and unify the domestic standards,
(2) Test force method: In addition to the optical image analysis method of solder powder particle size distribution in the relevant national standards, the method with relatively complex operation is used.
(3) Evaluation method: The "film comparison method" used in the United States is adopted, and the "dry spot classification method" suitable for domestic and foreign use is adopted. (4) Classification method: The classification of solder with sound waves is based on the international standards. The provisions of the law are not in accordance with the G1574 (chemical method of tin-lead solder).
The formulation of this standard will guide the production of high-quality solder products in my country, promote the development of my country's mounting technology, and benefit the development of domestic and foreign economic and trade.
This standard is under the jurisdiction of the Institute of Standardization of the Ministry of Electronics Industry. The drafting units of this standard: the Institute of Technology Research and the Institute of Standardization of the Ministry of Electronics Industry. The main drafters of the standard are Song Yunhe, Liu Hushi, Bang Hua, Wen Cunguang, Li Xuehua, Zha Xiaojiao, Liang Yong, and Qi Xiaofu.
1 Scope
Electrical Industry Standard of the People's Republic of China
General Specification for Tin-Lead Paste Solder
Generat speed Fur soldering 1.1 Subject
SJ/T11186—1998
This standard specifies the classification and naming, requirements, test methods, inspection specifications and marking, installation, operation and storage of cast aluminum solders (SMD solders) suitable for surface mounted components and electronic circuits. 1.2 Scope of application
This standard is applicable to various types of aluminum solders used for soldering when surface mounted components and electronic circuit interconnection. 1.3 Classification and naming
The classification and specification of solder pastes shall be in accordance with the following provisions: HG
1 .The bright viscosity value expressed as P\"
The alloy type in the solder paste (see 4.2.1, Table 1) The percentage of alloy in the solder paste
The type of flux in the solder paste (see 4.1.1)
The alloy content in the solder paste (4.1.2)
"Goods" Each Chinese character is a capital letter. For example, a good solder alloy must be H1SPA, the baking agent type is the gold content in the plate is BS% (the alloy powder size is 1 stroke. The viscosity is B0Pas, which is cut as: HGIIISrSPbAgA - R - B5 -1 - 8002 Referenced Standards
The following standards contain provisions that are selected for reference in this standard and constitute the referenced parts of the standard. At the time of publication of this standard, all versions are valid. All parties to the standard should consider the possibility of using the latest version of the following standards.
GB/T148—1995 Determination of particle size composition of powder by sieving method GH/T 2794—1995
GB 3131—BB
GH/T 3375—1994
GR 523185
GB 9491—S
GB 10S74-89
Determination of viscosity of amine adhesives
Design solder
Good quality
Process chemical composition and product form
Filtration of rosin-based solder
Chemical analysis method of lead solder
Ministry of Electronics Industry of the People's Republic of China1998-D3.11Approved on 1998-05-01
S1/111186-1998
SI/T10668—1995 Terminology of long-distance assembly technology 3 Definitions
This standard adopts the following definitions. Other definitions shall be in accordance with the provisions of GB3375 and S/T10668. 3.1 Drying
The process of removing volatile components in solder paste by heating or at room temperature (which will not cause melting of resin or pine). 3.2 Thinning
Liquid chemical or liquid substance with or without activator, which is added to solder paste to adjust the viscosity and solid content.
3.3 Bridging
The phenomenon that the solids on the printed material become difficult to connect during the solder paste drop test, which is a defect of solder paste.
3.4 ​​Tack
The change in adhesion of the solder paste after the device is dried and the time after the paste is applied. 3.5 Wetting
The state of melting the solder paste on the surface of the sample to form a uniform, smooth and unbroken material. 4 Requirements
4.1 Materials
4.1.1 Flux type and inspection
The type of flux used for welding shall comply with the provisions of GB9491 and its performance shall be tested according to GB9491. The type of flux shall be recorded in the test report of the welding paste.
4.1.2 Alloy composition
The chemical composition of the welding paste shall comply with the provisions of Table 1 of GB3131 and its analysis method shall be in accordance with the provisions of GB10574. 1.2 Types of powders Size and shape
Type, size and distribution of powders
The type of welding technology shall be classified according to the size of alloy powders and their distribution type. When testing according to 5.1 and (or: 2), the type, mass, size and distribution of alloy powder in the welding camp shall comply with the provisions of Table 1. 1 Type, mass and size distribution of alloy powder at the end of alloy age shall be less than [%] At least 80% of the mass shall be averaged 150-75 75-45 38-20 25 - 15 Note: "," indicates that the ratio is an adjustable item and needs to be agreed upon by both parties; this requirement may not be required. The maximum quality requirement is 10%. 20
4.2.2、Alloy powders not specified in SH/T11F86-1998
The alloy powder shape should be spherical. Nearly spherical powders with a major axis to minor axis ratio of 1.5 are always allowed. Other shapes of alloy powders can also be specified if the user and the manufacturer reach an agreement. When the alloy shape is determined according to the test method in 5.2, if more than 90% of the alloy powders are spherical and near spherical with a major axis to minor axis ratio of less than 1.5, the alloy powder shape is classified as spherical. 4.3 Alloy powder percentage (mass) content according to 5 .3 When the test method is used, the percentage (weight and profit) of alloy powder in the weld should be 65%-65%. The percentage of alloy powder (containing base) should not deviate from the value specified in the order form by more than 1%. 4.4 The viscosity of the weld paste should comply with the viscosity value specified in the product specification, but the difference between the weld paste viscosity value measured by the test method 5.4 and the viscosity specified in the product specification should not be less than 1%. 4.5 Recommended Unless otherwise specified, when the test method 5.5 (i.e., using templates with two degrees and multiple opening sizes) is used for testing, the test results should comply with 4.5, 1 and 4.5.2. 4.5.1 When the test method of 5.5.3.2 is used to test the 0.60mm×2.00mm weld pattern printed on the 0.20mm original template (see Figure 1), when the spacing is greater than or equal to 0.56mm, there should be no bridging phenomenon between the weld details. When the test method of 5.53.2 is used to test the 0.60mm×2.00mm weld pattern printed on the 0.20mm thick template (see Figure 1), when the spacing is greater than or equal to 0.60mm, there should be no bridging phenomenon between the weld details. When the test method of 5.5.3.2 is used to test the 0.30mm×2.00mm weld pattern printed on the 0.20mm thick template (see Figure 1), when the spacing is greater than or equal to 0.When the thickness of the weld is greater than or equal to 0.25mm, there should be no bridging phenomenon between the weld blue patterns. When the test is carried out using 6) of 5.5.3.2, when the spacing is greater than or equal to 0.30mm, there should be no bridging phenomenon between the weld blue patterns. 4.5.2 Test face with a 0.10mm friction die
When the test method 5.5.3.2 is used to test the 0.30mm×2.0mm weld blue pattern purchased before the 0.10mm thickness (see Figure 2), when the spacing is greater than or equal to 0.25mm, there should be no bridging phenomenon between the weld blue patterns. When the test is carried out using 6) of 5.5.3.2: when the spacing is greater than or equal to 0.30mml, there should be no bridging phenomenon between the weld blue patterns. When the test method (a) of 5.5.3.2 is used to print two 0.30mm×2.0Umm solder joint patterns on a stencil (see T2) with a thickness of 0.10mm, there should be no bridging of solder joint patterns when the spacing is greater than or equal to 0.175mm; when the test method (b) of 5.5.3.2 is used, there should be no bridging of solder joint patterns when the spacing is greater than or equal to 0.201.
4.B Solder ball test requirements
For the solder balls made of various alloys in Table 2, when the test method in 5.6 is used, the evaluation standards of 1 or 2 in Table 2 shall be met.
FYKNhKAa
SJ/T11186-1998
Table 2 Solder ball test evaluation standards
Each solder ball is fused to form a single solder ball, but no more than one independent small solder ball appears on each side of any solder ball.
After the ten solder balls are melted, they form a single solder ball, and the number of independent small solder balls appearing on one side of the solder ball is not more than three at most.
After the ten solder balls are fused again, they form a single solder ball, and the number of independent small solder balls on the side of the solder ball is more than one, but these small solder balls have not yet formed a continuous halo. After the point of incubation, the image is a single bad sample, and there are some small balls on the edge of any particle, forming a semi-continuous halo: or after incubation, a large size of 75 is formed. For the 1.2, 3 or 4 alloy powder, the diameter of each small bad is 1 [1m~75rum: For the weld made of 5 or 6 alloy powder, the diameter of each small war material or becomes 0m-50m4.7, Adhesion
When the test method 5.D is used for the test, the minimum adhesion of the medium and its retention time shall comply with the product standard. 4.8 Wetting
When the device is tested by the test method 5.8, the wettability of the weld shall meet the evaluation standards of level 1 to level 2 in Table 3. Table 3 Wetting evaluation standards
Test method
The present invention provides a sample and the version is outside the scope of the sound. The matrix [test specimen] shall be completely melted in the area of ​​the sample. The matrix [test specimen] shall have some areas of the sample that are not melted. The matrix [test specimen] shall be partially melted and the sample shall be one or more spheres of the sample.
5.1 Powder Size Distribution Test Method
Correction Separation
This test method is applicable to determine the quality, size and distribution of Type 112 and 3 alloy powders. 5.1.1 Test Method
15 g of paste.
5.1.2 Preparation of instruments and materials
a] The vibrating machine specified in B1480, the nominal size of the test sieve holes is [50m, 75, 45m, 25mm and 20m, and the test sieves are provided with special specifications;
The accuracy is 1.11g. The maximum:
500ml measuring cup and porcelain cup:
PVC film (for environmental cup):
e) drop agent;
acetone:
g) scraper (glass).
5.1.3 Preparation of test pieces
Quick temperature
5. 1. 3. 3
SI/T 111$6—1998
The film is used for movement to make the sound uniform.
Weigh about 110g of solder and put it into a clean beaker. Add 50ml of molten metal into the beaker containing solder. Pour the molten metal around for a while. Use a slurry to circulate the beaker for a certain time to achieve the desired precipitation of the alloy. Drain the molten metal in the beaker without losing any alloy powder. Repeat 5.1.3.4.-5.1.3.h for 10,000 times, and add about 5ml of molten metal to the alloy powder in the beaker each time. Stir the sample with a slurry to speed up the drying process. 5.1.3.9 Wait for the alloy powder to precipitate.
Slowly drain the molten metal in the beaker.
Continue to repeat 5.1.3.8~51.3.10. Dry the alloy at room temperature until its quality stabilizes. After the supply and demand sides agree, the alloy powder of the welding center can be selected according to the alloy age in the batch production of the company. 5.1.4 Test
5.1.4.1 The test type can be sent to the test question, and the test frequency is selected as shown in Table 4. 4 Alloy type and sieve size are not in accordance with the industry type
5.1.4.2 Weigh the quality of the test sieve
The first hole is weighed according to the size of the non-standard size from the largest to the smallest. 5.1.4.3 The selected test sieve is placed on the machine according to its standard size from the largest to the smallest, and is installed on the chassis under the test. bzxZ.net
Put the weighed alloy end in the test span at the end of the test. 5.1.4.4
The customer moves the sieve machine, and weighs the alloy powder on each test sieve and the fast plate for about min
. The test age shall be recorded in Table 5 Table 5 Powder quality and size of the test products of the enterprise (thousands of parts method) Type 1 alloy specification Type 2 alloy specification Type 3 alloy quality percentage Yellow family certification Service salt clinical Note "The two technical indicators remain in the specification, and the quality is scanned by the society after the indicator is brought to the quality society, KSKA SJ/T11186-199B 5.2 Test method for alloy powder size and shape determination - Dispenser cleaning This test method is suitable for the research and development of coal bending The size and shape of each powder must be determined, and the size distribution and shape of 4.5 and 6 type alloy powders are used to determine. 5.2.1 The sample is about 1g.
Equipment, instruments and materials
Help:
Glass slide:
30ml cup:
Microscope (total magnification is times
Accurate balance with 0.1g.
The test is carried out in the room, and the scraper is used for non-separation.
The test is carried out in the room, and the scraper is used for non-separation.
The test is carried out in the room, and the test is carried out in the room. 5.2.3.5
5.2.3.6 Cover the small drop of the mixture with a clean glass slide and then gently press a small amount of the mixture between the two slides
5.2.3.7 Use a microscope to measure the size of about 50 alloy particles within the range, measure their major and minor axes, count each particle according to the overall composition, and calculate the total size distribution and its percentage. The surplus is recorded according to Table 6. Table 6 Gold powder size distribution test record (microscope measurement method) Size
1 Type of alloy end
Percentage of impact %
2 Type of alloy end
3 Type of alloy end
4 Alloy end
5 Type of alloy end
Head type alloy end
Maximum content%
Size plate percentage Certificate center
Customer market content%
Item content
Note "+" indicates the nature of the particles left on the sieve"-" indicates the quality of the particles on the production line. + 75
5.2.3.8 According to the length and the test product of the first test, determine the shape of the alloy powder particles and record it. 6
$I/T11186—1998
5.3 Test method for the maximum percentage (mass) content of gold in solder paste
This test method uses the weighing method to determine the percentage (mass) content of gold in solder paste. 5.3.1 Test
About 50g of solder paste.
5.3.2 Equipment, instruments and materials
) Balance with an accuracy of 0.01g:
h) Pump pot or ground cup;
e) Heating equipment (such as electric protection):
d) Flux digging agent.
5.3.3 Test steps
5.3.3.1 Weigh 10g to 50g of the alloy (with an accuracy of 0.01g) and place it in a pre-set alloy cup, and melt, cool and solidify the alloy powder under the condition that the temperature does not exceed 25°C of the alloy powder line temperature. 5.3.3.2 Use flux extractor to extract the remaining flux and dry the test mixture. Use a balance to weigh the sample and determine the white content of the alloy in the weld.
Calculate the white content (mass) of the alloy in the weld at the end of the weld according to the following formula: Alloy mass in the sample
Alloy content (mass) percentage =
×100%
Original sample mass
5.4 Viscosity test method
The determination of viscosity should be carried out according to the rotational viscometer test method specified in GB/T2794 and the following provisions. ) The test medium should be allowed to stand for at least 21 hours under 25°C before the test. b) After the test medium is loaded into the test medium, use a metal mesh to gently stir it in a "\" shape for 1 to 2 minutes to make it uniform. Avoid air from entering during stirring. 3) The container containing the test sample should always be in a constant temperature environment of 23+0.5 during the test. Before the test chamber starts, the standing time of the sample in the constant temperature environment is determined by the supplier and the buyer, but cannot be greater than 21. d) The unit of dynamic viscosity is Pa\s. The unit of 5.5 cal·s is 5.5 cal·s. The test method is determined by the template shown in Figure 2 and Figure 3. The quality of the printed and cut products can be judged by whether there is any contact between the products.
5.5.1 Sample carrier
A frosted film with a size of 76mm×25mm and a thickness of at least 1mm is used as the standard sample carrier, and an alumina epoxy fiber substrate with the same microstructure is also used as the substrate: the number of sample carriers is four.
a) Plate change (printing plate required): press 1, 2 respectively:
scraper (rubber):
controller:
d) microscope.
5.5.3 Test steps| |tt||5.5.3.1 Test specimen preparation
S/111861898
) Use two plates (see system 1 and 2) of different thickness (different opening sizes) to print the sample paste pattern on two carriers to form four test specimens. The printed olefinic ring shape should be evenly spaced, and there should be no weld particles outside the coal pattern: b) Two samples printed by each template are repeated, one of which is 1 and the other is 21. 5.5.3.2 Test
) Two 1 and two 2* printed patterns are placed in a short-term effective 255 and relative rate 50t0)% ring potential. After 10ain20mia. First check whether there is bridge between the two 1*test pieces (1h). Place the two test pieces that have passed 5.5.3.2 in a cooling room at 150°C ±10°C for 10m~15min, then check whether there is any bridge. 5.5.3.3 Record and evaluate
The bridge between the test pieces shall be recorded in Table 7 and Table 1 as the basis for evaluating the soldering performance.
Table 7 Record of soldering pattern bridge using 0.20mm original template printing
0. 60 × 2. 00
(a) Lang figure
(b group figure
0.30 × 2.00
(e) group national shape
Table 8 use 0.1011 yuan original template to print other welding sound reading shape bridge reverse record table u1. 31×2.5CF
(b national temporary
0.20x2.00
(e) figure
(mountain) figure
5/T 111861998
Figure and national shape (each size is .Gm×2.0cmm required 2 use shape (h) each leakage can be divided into quality figure (a) 3) use 8 ruler 03200m
4 use shape () abandon the same distance ruler and its divided same figure (d). The original thickness of the drop test template in the figure is 0.20mm.
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