This standard deals with rigid-flex double-sided printed boards with through-connections and has nothing to do with their manufacturing methods. This standard will serve as the basis for contracts between supply and demand. This standard specifies the properties and test methods to be evaluated and establishes uniform requirements for identification of properties and dimensions. The term "relevant specifications" used in this standard refers to these agreements. This standard does not apply to flat cables. GB/T 4588.10-1995 Printed boards Part 10: Specification for rigid-flex double-sided printed boards with through-connections GB/T4588.10-1995 Standard download decompression password: www.bzxz.net

GB/T4588.10—1995
This standard is formulated in accordance with the International Electrotechnical Commission standard IEC326-10 Printed boards Part 10 Specification for rigid-flexible double-sided printed boards with through-connections (1991 edition), and is equivalent to it in terms of technical content and writing format. In order to meet the needs of national standard trade and economic exchanges, this standard has the following changes in the arrangement of clauses compared with the original text: 1) In the "Table 1 Basic Performance" of this standard, "6.2.1.1 Plated-through hole resistance change" in IEC326-10 is deleted, which is repeated in 6.6.1.3 in Table 2. As a result, the original clauses 6.2.1.2 and 6.2.1.3 in IEC32610 are changed to 6.2.1.1 and 6.2.1. 2.
2) 6.3.1.1 in IEC326-10 is merged into 6.3.1, and the original 6.3.1.2 and 6.3.1.3 are changed to 6.3.1.1 and 6.3.1.2 respectively.
3) The test numbers of 6.8.2.3 and 6.8.2.4 in IEC 326-10 are incorrect, and 19 and 19a should be changed to 19a and 19 respectively. c. This standard was proposed by the Ministry of Electronic Industry of the People's Republic of China. This standard is under the jurisdiction of the National Technical Committee for Printed Circuit Standardization. This standard was drafted by Shangyou Radio Factory No. 20. The main drafters of this standard are: Xu Jilan and Zheng Caijuan. GB/T4588.10—1995
IEC Foreword
1) IEC (International Electrotechnical Commission) formal resolutions or agreements on technical issues are formulated by technical committees participated by national committees with special concerns about these issues, and represent the international consensus on the issues involved as much as possible. 2) These resolutions or agreements are provided for international use in the form of recommended standards and are recognized by the national committees in this sense. 3) In order to promote international unification, IEC hopes that national committees will adopt the text of IEC standards as their national standards if national conditions permit. The differences between IEC standards and corresponding national standards should be indicated in the national standards as much as possible. This standard was prepared by the 52nd Technical Committee of IEC The text of this standard is based on the following documents: 6 months method
52(CO)311
Voting report
52(CO)327
2 months method
52(C0)332
Voting approval Details of this standard can be found in the voting report listed in the table above. IEC Introduction
IEC 326 deals with printed boards prepared for mounting components, regardless of their manufacture. Method of manufacture. Voting report
52(CO)341
This standard is divided into several independent parts, including information for designers, recommendations for specification developers, and test methods and requirements for various types of printed boards (such as single-sided, double-sided, multi-layer and flexible printed boards). 1 Scope
National Standard of the People's Republic of China
Printed boards
Part 10:
Specification for flex-rigid-fd double-sided printed boards with through connections GB/T 4588.10
idt [EC 326-10:1991
This standard deals with flex-rigid-fd double-sided printed boards with through connections, regardless of their method of manufacture. This standard shall serve as the basis for contracts between the supplier and the purchaser. This standard specifies the properties and test methods to be evaluated, and establishes uniform requirements for identifying properties and dimensions. The term "relevant specifications" used in this standard refers to these agreements. This standard does not apply to flat cables. 2 Referenced standards
The provisions included in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and parties using the standards should explore the possibility of using the latest versions of the following standards. IEC and ISO member countries maintain a directory of currently valid standards.
GB/T2423.34-86 Basic environmental testing procedures for electrical and electronic products Part 2: Test Z/AD: Temperature/humidity combination cycle test method (idtIEC 68238:1974)IEC68.23:1985 Basic environmental testing procedures for electrical and electronic products Part 2: Test Ca: Steady-state heatIEC682.20:1979 Basic environmental testing procedures for electrical and electronic products Part 2: Test T: SolderingIEC194t1988 Printed circuit term definition
IEC321:1970 Guide for the design and use of components mounted on printed circuit boards Printed boards Part 2: Test force method
IEC 326 2:1990
IEC 326-3:1991
3 General
Printed boards Part 3: Design and use of printed boards The following tables specify all important properties and the applicable tests cited to verify these properties. 4 Test specimens
Tests are preferably carried out on production boards. When it is agreed to use test coupons, the test specimens should be prepared in accordance with 4.2.A of JEC 326-2. Suitable comprehensive test patterns are shown in Figures 1a and 1b. 5 Relevant specifications
The relevant specifications should include all information necessary to clearly and completely identify the printed boards and should comply with the requirements recommended by IEC326-2.
Approved by the State Administration of Technical Supervision on December 21, 1995 and implemented on August 1, 1996
CB/T 4588.10-1995
Care should be taken to avoid unnecessary requirements. Permissible deviations should be indicated where necessary. When it is sufficient to specify the nominal value without deviation or a single maximum or minimum value, only these values ​​should be given. When strict regulations must be adopted in certain areas or parts of the printed board, they should be limited to strict regulations in these areas or parts. If there are several indications or deviation levels, some provisions of the TFC326-3 standard should be selected. 6 Properties of printed boards (see Table 1 or Table 2). Table 1 Basic properties (must be evaluated) TEC 326-2 6.1 General inspection 6.1.1 Visual inspection 6.1.1.1 Conformity and identification symbols 6-1.1. 2
Appearance and
Workmanship quality
6.1.1.3 Plated holes
6.1.1.4 Board edge
Test number
Related specifications
Specified additional
Test details
Comprehensive test
Graphic sample
Finished board
Comprehensive test
Finished board or
Comprehensive test
Finished board or
Comprehensive test
Graphics, logos, identification symbols, materials and coatings shall comply with relevant specifications!
standard, there should be no obvious defects
The board should show that it is skillfully and carefully processed using the current good general technology
The plated holes should be clean and free of any impurities that affect the insertion and solderability of components
The total area of ​​the voids should not exceed 10% of the total area of ​​the hole wall, and the maximum size in the horizontal plane should not exceed 25% of the circumference. In the vertical plane, the maximum size should not exceed 25% of the board thickness
There should be no electroplating voids at the interface between the hole wall and the conductive shape of the plated hole
The interface is a distance extending from the board surface to the hole
equivalent to 1.5 times the total surface copper thickness. Copper in plated holes shall not have ring breaks or delamination. Plated holes shall not exceed 5% of the total number of plated holes. Finished board or comprehensive test. Edges and internal cuts of the board shall be neat and free of tears or nicks. 6.1.1.5 Hollow rivets 6.1.1.6 Bonding of conductor to substrate 6.1.1.7 Bonding of cover to pattern and substrate 6.1.1.8 Conductor defects 6.1.1.9 Residuals between conductors 6.1.2 Dimensional inspection 6.1.2.1 Board:
IEC 326-2
Test No.
1b or 1c
GB/T 4588.10-1995
Table 1 (continued)
Related specifications
Specified additional
Test details
Comprehensive test
Graphical specimen
Finished board
or comprehensive test
Trial shape
Finished board or
Comprehensive test
Finished board
Finished board or
Hollow rivets should be firmly fixed. Electroplated hollow rivets shall not expose the base metal, and the hollow rivet flange shall not have cracks. The conductor or base around the hollow rivet shall not have damage. Except for the defects allowed by the material specification, there shall be no obvious blistering or wrinkling. The separation of the conductor and the base material shall not appear. The bonding shall be complete and consistent. Minor delamination is allowed in the following parts: a) Leave The conductor is located at the bone and is more than 0.5mm away from the edge of the board. Each delamination area should not exceed 20% of the designed conductor spacing (see Figure 2). The minimum continuous bonding width between adjacent conductors should be 0.5mm. When the conductor spacing is less than 0.5mm, there should be no delamination of the conductor. There should be no cracks or breaks on the surface. As long as the conductor width or the electrical path reduction between the conductor pattern and the finished board or the test pattern does not exceed the requirements of the relevant specifications (such as 20% or 35%), voids or edge defects are allowed (see Figure 3). If necessary, use Test No. 2a for
Perform dimensional inspection
As long as the reduction in the leakage path is not! If necessary, adopt a distance greater than 20% or not less than the circuit voltage requirement. When the distance is greater than 2 days, the residual metal particles between the wires are allowed.
The size and deviation should comply with the relevant regulations.
The nominal thickness of the printed board should comply with the relevant specifications.
The total thickness and deviation of the board should comply with the provisions of IEC
321.
6. 1. 2. 2
Head area plate thickness
6-1.2.3 Hole
6.1.2.4 Clearance hole
6- 1.2. 5 Slot, notch
6. 1.2. 6 Wire width
6. 1. 2. 7 Wire spacing
6.1.2.8 Difference between hole and connection
plate
6. 1. 2. 9 Hole center position deviation IEC326-2 Test number GB/T4588.10-1995 Table 1 (continued) Relevant specifications Additional test details Comprehensive test Graphic specimen Total thickness and deviation of finished board or board shall comply with relevant specifications The nominal diameter and deviation of mounting holes and component holes shall comply with relevant specifications Comprehensive test The nominal diameter of plated-through holes used only for through connections shall comply with relevant specifications The overlap of the clearance hole in the finished board or the relevant connection pad in the substrate includes the influence of the adhesive flowing in the cover layer relative to the connection pad, any of which should not reduce the effective size of the connection pad to less than the recommended hole diameter range and deviation see IEC 326-3 Since the deviation is not significant, it is not necessary to measure accurately. The recommended minimum effective annular width around any point of the hole is: 0.15 mm for non-plated holes and the minimum value specified in the relevant specifications for plated holes (see Figure 4). The size should comply with the relevant specifications. The conductor width should comply with the specific size in the relevant specifications. As long as the reduction in conductor width is not greater than that specified in the relevant specifications, such as 20% or 35%, defects such as voids and edge damage are allowed. The defect length (L) should not be greater than the conductor width (S) or 5mm, whichever is smaller. (See Figure 3)
The spacing should comply with the
specific size in the relevant specifications
The connecting plate should not be damaged, the connecting plate
! There should be no breakage at the connection with the conductor. The center of the hole should be within the tolerance range specified in the relevant specifications. If no tolerance is specified, the roughness specified in the IEC326-3 standard should be used. 6.1.2.10 Flexible circuit and rigid part combination 6.2 Electrical test 6.2.1 Resistance 6.2.1.1 Hollow rivet 6.2.1.2 Short circuit 6.2.2 Insulation resistance 6.2.2.1 Pretreatment 6.2.2.2 Under standard atmospheric conditions 6.2.2.3 Environmental test IEC 68-2-3 or IEC68-2-38 6.2. 2. 4 Tested at high temperature 6.3 Mechanical test 6.3.1 Peel strength (wire on substrate) 6.3. 1.1 Tested at high temperature under standard atmospheric conditions IEC326-2 Test No. GB/T 4588. 10—1995
Table 1 (continued)
Related specifications
Specified additional
Test details
Comprehensive test
Graphic test piece
Finished board or
The bonding of the flexible and female parts should be
complete and even, and the rigid-flexible joint is allowed
Comprehensive test
Finished board or
Comprehensive test
The following conditions exist: The flow of the tree from the joint
to the flexible part should not exceed
2 mm, the unbonded area may also extend from the bonding part to the rigid part up to 2 mm. The insulation resistance shall comply with the relevant specifications. The peel strength shall comply with the relevant specifications. The insulation resistance shall be tested before and after environmental treatment and measured at high temperature as required by the relevant specifications. Applicable conditions shall comply with the relevant specifications. Not applicable to polyester. Not applicable to polyester. 6.3.2 Pull-off strength 6.3.2.1 Unsupported hole connection pad 6.3.3 Pull-out strength 6.3.3. 1 No land
Plated through hole
6.4 Other tests
6.4.1 Plating
6.4.1.1 Plating adhesion
Adhesive tape method
6.4.1.2 Plating thickness
Contact area
6.4.2 Explosion-proof
When the supplier and the buyer agree to use inactive flux
6.4.2.1 Acceptance state
GB/T 4588.10—1995
Table (continued)
Related specifications
IEC326-2
Specified additional
Test number
Test details
Comprehensive test
Graphic test piece
K or printed
During the welding operation, the connecting plate
Flexible test piece shall be supported by
Should not separate, and the pull-off strength shall not be less than the value specified in the relevant specifications of the rigid plate support
The pull-out strength shall not be less than the value specified in the relevant specifications
After the tape is pulled off the chain layer, there should be no trace of adhesion of the coating on the tape except for the protruding edge of the coating. The thickness should meet the relevant specifications. The solder on the wire should be bright and smooth. The area of ​​defects such as pinholes, non-wetting or semi-wetting should not exceed 5% of the total area and should not be concentrated in one area. Solderable: The specimen should wet within 3s; when the specimen uses a coating that protects the wetting performance, the specimen should wet within 4s. Semi-solderable: The specimen should be in contact with the molten solder for at least 5 and at most 6 hours without semi-wetting. Not applicable to ester materials. For polyimide, to ensure solderability, it should be properly dried before soldering. Testing should be carried out in the acceptance state or after accelerated aging as agreed between the supplier and the purchaser. Inactive flux shall be in accordance with the provisions of IFC 68-2-20. 6.4.2.2 Accelerated aging B When the supplier and the purchaser agree to use active flux 6.4.2.3 Acceptance state and accelerated aging 6.4.3 Resistance to solvents and solder 6.4.3.1 Thermal shock analysis 6.4.3.2 Pretreatment Note: * See Chapter 3.
IEC326-2
Test No.
GB/T 4588. 10—1995
Table 1 (end)
Related specifications
Comprehensive test
Specifies additional
Test details
Graphic specimen
Solderable, specimen wetted within 4 s
Semi-solderable: the specimen should be in contact with the molten solder for at least 5 s and at most 6 s without semi-wetting
Flexible printed circuit boards made of thin materials, their solderable or semi-solderable holes (if applicable) should be as consistent as possible with the good solder holes shown in Figure 5
When there is or is no temporary
protective coating on the printed circuit board:
According to IEC 68-2-20 Solderable: The specimen shall be wetted within 3 hours by an active flux Semi-solderable: The specimen shall be in contact with the molten solder for a minimum of 5 9 and a maximum of 6 hours: No semi-wetting The solderable or semi-solderable holes (if applicable) of flexible printed boards made of thin materials shall be as consistent as possible with the good solder holes shown in Figure 5. There shall be no following phenomena: Blistering or delamination The solder mask or printing material is randomly removed and dissolved: · Significant color change. Acceptable: a) The marking is not affected: b) The marking is not clear, but can be identified.
Unacceptable:
a) The marking cannot be recognized:
b) The marking is blurred, that is, similar letters
may be mistaken for R-BP, E-
F, CG-0
There should be no obvious blistering or delamination
Microsectioning shall be performed only when required by the relevant specifications
6.5 Dimensional inspection
6.5.1 Graphics and holes
For reference
6.6 Electrical tests
6.6.1 Resistance
6.6.1.1 Wire resistance
6.6.1. 2 Interconnection resistance
6-6-1.3 Plated hole resistance change
6.6.2 Withstand current
6.6.2.1 Plated hole
6.6.2.2 Withstand current of conductor
6.6.2.3 Withstand voltageWww.bzxZ.net
6.6.2.4 Frequency drift
6.7 Mechanical property test
6.7.1 Bending test
6-7.2 Flatness
6.8 Other tests
6.8.1 Layer #
GB/T 4588. 10—1995
Table 2 Additional performance (assessed only when special requirements are met) IEC326-2
Test number
Related specifications:
Specified additional
Performance details
Comprehensive test
Graphic sample
Finished board or
Comprehensive test
Test shape
Finished board
Should comply with the specific
Should comply with the relevant specifications
Should comply with the relevant specifications
Should comply with the relevant specifications
Should comply with the relevant specifications
At least 5 holes should be tested, and the plating
layer in the hole should withstand IFC 326-2 The specified appropriate current should not be melted or discolored due to overheating. The wire should not be melted or discolored due to overheating. There should be no destructive discharge. The frequency drift should not exceed the limit value specified in the relevant specifications. It is generally not measured because the important thing is the relationship between the pattern and the hole, which determines the ||Minimum radial width
When there are special requirements
, the deviation specified in
TFC326-3 shall be adopted. When
the board finishing
tree size
is specified, the micro-cutting method can be used
Not applicable to polyester
The test pattern and the number of bends
should be negotiated by the supplier and the buyer. Only applicable to the rigid area
6. 8.1.14
Coating adhesion
Friction method
GB/4588.10-1995
Table 2 (end)
Related specifications
IEC326-2
: Test number
6.8.1.2
Coating porosity
Gas exposure method
6.8.1.3
Coating porosity
Electrical imaging method
6.8.1.4 Coating thickness (non-
contact area)
6.8.2 Heat resistance
6.8.2.1 Long-term storage
6.8.2. 2-day inspection
6.8.2.3 Thermal shock
a) Microsection
6.8.2.4 Float solder plated-through hole
a) Microsection
Note: See Chapter 3,
7 Test pattern 1
Test board
Specified as attached
Performance details
Comprehensive test
Graphic specimen
Test pattern definition·See IEC 194 05-02. See IEC 194, 7 for the definition of test pattern and comprehensive test pattern.1 General
The test pattern can be:
Should have no blistering or delamination of the coating
Should comply with relevant specifications
Should comply with relevant specifications
Should comply with relevant specifications
Stored at maximum operating temperature
There should be no delamination of the conductor or covering
Cracks, blistering and
Delamination of the coating and conductors should comply with relevant specifications
The coating should not have cracks
=A part of the conductive pattern (see IEC194, Terminology 01-28) on the product board (see IEC194, Terminology 05-01), a special test pattern specially designed and prepared for test purposes only. The special test pattern may be located on:
The temperature and storage time shall comply with the relevant specifications
Visual verification requirements
Visual verification requirements
On a test coupon (printed board or part of a finished board. The pass strip is cut before the printed board is used, see IEC 194 05-05). On a separate test board (see IEC 194 05-02). 7.2 Application of test patterns and test boards
7.2.1 If comparative tests are to be carried out, such as comparing different materials or different processes and equipment, the same, agreed special test pattern must be used.
For example: capability batch testing (special term in quality assessment system): Applicable comprehensive pass strip patterns are given in Figures 1a, 1b and Table 4. 7.2.2 For other tests, such as quality consistency inspection or incoming inspection, the pass strip is carried out on production boards. Whether the special test pattern used is based on part of the comprehensive test pattern 7.3 of GB/T4588.10-1995
or is specially designed, it can be negotiated by the supplier and the buyer. 7.2. 3 Composite Test Pattern (CTP)
The tests for the items in Table 3 may be performed using a single test board in the composite test pattern (Figures 1a and 1b). Table 3 Specimens and Tests
Solderability of Plated-Through Holes
Pull-Out Strength of Plated-Through Holes without Lands
Pull-Out Strength of Lands of Unsupported Holes
Change in Mutual Resistance of Plated-Through Holes
Insulation Resistance (Surface Layer - Y-Shape)
Clearance of Conductors
Peel Strength and Delamination
Solderability of Conductor Plating
Insulation Resistance (Surface Layer
Comb Pattern)
Plating County, Contact Area (Optional)
Bending Fatigue and Conductor Withstand Current
Insulation Resistance
Coincidence Coupling and CAF Coupons (Anode Cathode Filament) 7.3 Construction of Test Boards
The construction of the test boards shall be as specified in Table 4. Multiple arrangements of comprehensive test patterns (CTP)
Nominal aperture
Nominal land diameter
When the test board is required to be larger than (effective area) a test board with a single comprehensive test pattern (160mm×320mm), the multiple arrangements shown in 7.3 can be used. In multiple arrangements, there should be a comprehensive test pattern at each corner of the effective area of ​​the test board, and the unoccupied area between the comprehensive test patterns should not exceed the size of the comprehensive test pattern, see Figures 1a, 1b and 1c. Table 4 Test board structure
Test board
Total thickness of printed board
Laminate: nominal thickness
Conductive box
Thickness:
Insulation; Number of bonding sheets
Surface coating
Encapsulation area
Benzene standard (1.150mm
Epoxy glass
Second layer conductor
Bonding layer
0.050mmInsulation material
Benchmark 1. 8mm-
Adhesive layer
First conductor coating
Double-sided steel foil (all layers of steel foil start 0.035mm) 2
1.8mm±0.2mm
Not less than 25μm
35rm copper foil double-sided
Insulation material at least 5 μm
Minimum thickness of each piece 25 μ
Except for coupon C., all plated holes
According to relevant specifications
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