This standard specifies the product classification, requirements, test methods and inspection rules of solder wire for no-clean welding in the electronics industry (hereinafter referred to as "no-clean solder wire"). This standard applies to no-clean solder wire for circuit welding of electronic equipment such as electronics, communications and instruments. SJ/T 11168-1998 Solder wire for no-clean welding SJ/T11168-1998 Standard download decompression password: www.bzxz.net
This standard specifies the product classification, requirements, test methods and inspection rules of solder wire for no-clean welding in the electronics industry (hereinafter referred to as "no-clean solder wire"). This standard applies to no-clean solder wire for circuit welding of electronic equipment such as electronics, communications and instruments.

ICS 33.220.01
Record number: 3914-1999
Electronic Industry Standard of the People's Republic of China
SJ/T11168-1998
Solderwire for soldering cleanout-free1998-03-11Published
1998-05-01Implemented
Published by the Ministry of Electronics Industry of the People's Republic of ChinaTYYKAON KAca
At present, the application of clean-free soldering process in related fields of the electronics industry is becoming more and more extensive, and the clean-free solder wire as a supporting process material product has also been continuously developed and improved. In order to ensure that electronic equipment does not need to be cleaned after welding, and the welding is of high quality and high reliability, this standard has been formulated after combining the actual quality and application of solder wire for clean-free welding in my country and referring to foreign products and their relevant standards. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. The drafting units of this standard are: Standardization Research Institute of the Ministry of Electronics Industry, Tianjin Electronic Materials Research Institute, Hangzhou Yatong Electronics Co., Ltd., Wuxi Qunli Nonferrous Metal Materials Factory, Beijing Chaoyang Soldering Flux Factory, Guangzhou Nonferrous Metals Research Institute and Qunan Tin Industry Company. The main drafters of this standard are: He Xiukun, Tong Xiaoming, Duan Shuguang, Zhu Bingzhong, Gu Xiaolong, Ding Kejian, Yang Jiaji, Zhu Huoqing and He Peiru.
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1 Scope
Electronic Industry Standard of the People's Republic of China
Solderwiresforsloderingcleanout-freeSJ/T11168—1998
This standard specifies the product classification, requirements, test methods and inspection rules of solder wires for soldering cleanout-free in the electronics industry (hereinafter referred to as "clean-free solder wires").
This standard applies to clean-free solder wires used for circuit welding of electronic equipment such as electronics, communications and instruments. 2 Reference Standards
The provisions contained in the following standards constitute the conditions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised. All parties using this standard should explore the possibility of using the latest versions of the following standards.
GB2828-87
GB4677.22--88
GB9491--88
GB10574—89
SJ2659—86
SJ2660-86
3 Classification
Counting sampling procedure and sampling table for batch inspection (applicable to inspection of continuous batches)Test method for ionic contamination on printed board surface
Liquid flux for soldering (rosin based)
Chemical analysis method for tin-lead solder
Resin core solder wire for electronic industry
Test method for resin flux for soft fiber soldering
No-clean solder wire is divided into halogen-containing type and halogen-free type according to whether the solid flux used contains halogen. The halogen-containing type is represented by ML and the halogen-free type is represented by M.
3.1 Brand
3.1.1 Halogen-containing brand
The brand of halogen-containing no-clean solder wire is expressed as: MISn60
-Symbol and content of tin element
-Halogen-containing
No-clean solder pot wire
3.1.2 Halogen-free brand
The brand of halogen-free no-clean solder wire is expressed as. Approved by the Ministry of Electronics Industry of the People's Republic of China on March 11, 1998 YKAONrKAcas
Implementation on May 1, 1998
3.2 Specifications and markings
SJ/T11168—1998
-Symbol and content of tin element
No-clean solder wire
The specifications of no-clean solder wire are composed of brand, flux content and wire diameter. If the tin content is 60%, the wire diameter is 0.8mm, and the flux content is 1.0%, the mark of the halogen-containing no-clean solder wire is: MLSn60d0.8 (1.0%)
4 Requirements
4.1 Appearance quality
The surface of the no-clean solder wire should be smooth and clean, and should not have cracks, oil stains and inclusions. 4.2 Tin-lead alloy and impurities
The chemical composition and weight percentage of impurity content of the no-clean solder wire should comply with the provisions of Table 1. Table 1 Alloy content and impurity content of no-clean solder wire Note:
Alloy content
MLSn63
MLSn60
MLSn55
MLSn50
59.5~60.5
54.5~55.5
49.5~50.5
Impurity content, not more than
Melting temperature
Solidus liquidus
0.002b.0020.010.030.020.081830.030.02
1 The supply and demand parties can agree to provide no-clean solder wire with other tin contents. 2 The supply and demand parties can agree to provide no-clean solder wire with other alloy components. 4.3 Wire diameter size
The wire diameter size of the no-clean solder wire shall comply with the provisions of Table 2. 2
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Nominal wire diameter
SJ/T11168—1998
Table 2 Flux content, wire diameter and allowable deviation of no-clean solder wire Allowable deviation
1 The supplier and the buyer can agree to provide no-clean solder wire with other wire diameters. 2 The supplier and the buyer can agree to provide no-clean solder wire with other flux contents. 4.4 Flux continuity
The internal flux of the no-clean solder wire should be uniform and continuous, and there should be no gaps. 4.5 Flux content and performance
Flux content
The flux content of the no-clean solder wire shall comply with the provisions of Table 2, and its performance indicators shall meet the requirements of Table 3. Table 3 Performance indicators of no-clean solder wire flux Items
Acid value, KOHmg/g
Halogen content, %
Copper mirror corrosion test
Flux content, %
Expansion rate, %
Dryness
Surface insulation resistance after welding, n
Electromigration, n
Ion contamination (NaCI equivalent)
μg/em2
Test method||t t||5.1 Appearance quality
Halogen-containing type
Performance index
Halogen-free type
Copper mirror under flux should not be perforated or fall off
According to the provisions of Table 2
Chalk powder should be easily removed from any direction
When the comb electrode spacing is 0.3mm, ≥1×10x1011
Use a 10x magnifying glass to identify the comb electrode sample, the growth of dendrites shall not be greater than 20% of the wire spacing. The wire is allowed to change color slightly, but it cannot be strongly corroded. 3
According to the requirements of 4.1, the surface of the no-clean solder wire is visually inspected on the unit length of each axis sample drawn as required.
Tin-lead alloy composition and impurity content
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SJ/T11168-1998
According to the requirements of 4.2, the tin-lead alloy composition and impurity content of the no-clean solder wire shall be determined according to GB10574 or atomic absorption and other equivalent instrumental methods.
5.3 Wire diameter
According to the requirements of 4.3, the wire diameter of the no-clean solder wire shall be measured with a dry ruler with a graduation value of 0.01mm. The wire diameter shall be measured at 5mm from both ends and the middle end of the sample after the appearance inspection, and the average value shall be taken, accurate to ±0.01mm. 5.4 Flux continuity
According to the requirements of 4.4, 60cm of no-clean solder wire shall be cut from each axis sample unit drawn according to the specified number, and 6 sections with a length of 10cm shall be cut horizontally to visually observe the continuity of the flux. 5.5 Flux content test
Perform according to 3.10 of SJ2659.
5.6 Dryness test
Perform according to 3.11 of SJ2659.
5.7 Expansion rate test
Perform according to 3.9.1 of SI2660.
5.8 Copper mirror corrosion test
Perform according to 3.10.1 of SI2660.
5.9 Halogen content test
Perform according to 3.11.1 of SJ2660.
5.10 Acid value test
Perform according to 3.12.1 of SJ2660.
5.11 Post-weld surface insulation resistance test
The flux extracted from the no-clean solder wire and constant weight is prepared into a 30% liquid flux with isopropyl alcohol, and the test is carried out according to the provisions of 5.10 of GB9491.
5.12 Impressed voltage humidity resistance test
Prepare the test piece according to the provisions of 5.11, measure its normal post-weld surface insulation resistance, connect a 1MQ resistor in series to the test piece and apply a 45Vd.c. to 50Vd.c. bias between the electrodes, measure in the same test environment as 5.11, take it out after 96h, remove the bias and recover for 1h, measure its surface insulation resistance under the voltage condition of 100Vd.c. and identify the comb-shaped electrode test piece with a 10x magnifying glass, and the test wiring circuit diagram is shown in Figure 1. 1MQ external protection circuit
4sd.csoid.c power supply
comb electrode
Figure 1 wiring diagram of electromigration test
5.13 ion contamination test
The flux extracted from the no-clean solder wire and weighed constant is used to prepare a 3% liquid flux with isopropyl alcohol, and the test is carried out according to GB4
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4677.22.
6 Inspection rules
SJ/T11168-1998
6.1 No-clean solder wire must be inspected and qualified by the technical inspection department of the manufacturer according to the provisions of this standard before it can be shipped out of the factory. Product inspection is divided into delivery inspection and routine inspection. All inspections shall be conducted by the manufacturer or a third impartial party agreed upon by the supply and demand parties. When the manufacturer delivers the goods, each batch of products shall be provided with a product quality certificate, the content of which is the same as the delivery inspection items. 6.2 The user has the right to inspect the product in accordance with the provisions of this standard. If the inspection results do not meet the requirements of the product standards, they shall be provided to the manufacturer within two months from the date of product acceptance, and the two parties shall negotiate to resolve the problem. 6.3 In order to implement the needs of sampling inspection, the clean-free solder wire submitted for inspection in the form of a shaft shall be divided into units of products per shaft, and 10m shall be measured as the sample unit after removing 0.Sm from the beginning. The inspection of various properties shall be sampled within this length. 6.4 The inspection procedures and sampling plan for delivery inspection shall be carried out in accordance with the special inspection level S-2 sampling plan of GB2828. The inspection items, inspection levels and qualified quality levels are shown in Table 4. 6.5 If one item of the delivery inspection is unqualified, the entire batch shall be unqualified. The manufacturer shall conduct 100% inspection on the unqualified items and inspect the qualified parts separately.
6.6 The routine inspection cycle of the no-clean solder wire is one quarter or half a year. The routine inspection samples should be randomly selected from the products that have passed the delivery inspection within the cycle. The inspection items, sample size, and the number of unqualified products allowed are shown in Table 5. 6.7 If the routine inspection fails within this cycle, the products within the cycle will be stopped from being delivered, and the supply and demand parties will negotiate the products to be delivered within the cycle. The manufacturer should find out the reasons and immediately take effective measures in production until the routine test is passed before resuming the delivery inspection.
Table 4 Inspection items and requirements for acceptance of no-clean solder wireTest method
Test sequence
Inspection items
Tin-lead alloy and impurities
Wire diameter
Flux continuity
Flux content
Halogen content
Flux acid value
Requirement clause
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Inspection level
Qualified quality
Dryness
Expansion rate
Inspection items
Surface insulation resistance after welding
Copper mirror corrosion
Electromigration
Ionization Sub-contamination degree
Marking, packaging, transportation and storage
SJ/T11168—1998
Routine inspection items and requirements for no-clean solder wire Requirements and clauses
Test method
Sample size
Permitted non-conformity
Inspection cycle
Three months
Six months
7.1 No-clean solder wire should be neatly wound on a plastic reel. The weight of each reel can be 0.25, 0.5 or 1.0 kg. The following should be indicated: a) Specifications;
b) Net weight;
c) Implementation standard;
d) Production date and manufacturer's name.
7.2 The no-clean solder wire reels shall be packed in cartons or other sturdy boxes, with the net weight of each box not exceeding 20kg, and the following shall be indicated on the packing box:
a) product name;
b) specification;
e) batch number;
d) net weight;
e) manufacturer name.
7.3 The no-clean solder wire packed in the packing box shall be suitable for different modes of transportation, and shall be protected from damage, moisture and chemical corrosion during transportation and storage.
7.4 The effective shelf life of the no-clean solder wire is one year at room temperature (≤35℃). rYKAOMrKAa0kg, the following should be indicated: a) specification;
b) net weight;
c) implementation standard;
d) production date and manufacturer's name.
7.2 The no-clean solder wire reels should be packed in cartons or other sturdy boxes. The net weight of each box should not exceed 20kg, and the following should be indicated on the packing box:
a) product name;
b) specification;
e) batch number;
d) net weight;
e) manufacturer's name.
7.3 The no-clean solder wire packed in the box should be suitable for different modes of transportation. It should be prevented from damage, moisture and chemical corrosion during transportation and storage.
7.4 The effective shelf life of the no-clean solder wire is one year at room temperature (≤35℃). rYKAOMrKAa0kg, the following should be indicated: a) specification;
b) net weight;
c) implementation standard;
d) production date and manufacturer's name.
7.2 The no-clean solder wire reels should be packed in cartons or other sturdy boxes. The net weight of each box should not exceed 20kg, and the following should be indicated on the packing box:
a) product name;
b) specification;
e) batch number;
d) net weight;
e) manufacturer's name.
7.3 The no-clean solder wire packed in the box should be suitable for different modes of transportation. It should be prevented from damage, moisture and chemical corrosion during transportation and storage.
7.4 The effective shelf life of the no-clean solder wire is one year at room temperature (≤35℃). rYKAOMrKAa
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