GB/T 14663-1993 Technical requirements for plastic packaging molds

Basic Information

Standard ID: GB/T 14663-1993

Standard Name: Technical requirements for plastic packaging molds

Chinese Name: 塑封模具技术条件

Standard category:National Standard (GB)

state:Abolished

Date of Release1993-10-16

Date of Implementation:1994-07-01

Date of Expiration:2007-09-01

standard classification number

Standard ICS number:Mechanical Manufacturing>>Chipless Processing Equipment>>25.120.30 Molding Equipment and Casting Equipment

Standard Classification Number:Electrical Engineering>>Electrical Materials and General Parts>>K15 Electrical Insulation Materials and Products

associated standards

alternative situation:Replaced by GB/T 14663-2007

Publication information

publishing house:China Standards Press

other information

Review date:2004-10-14

Drafting unit:Electronic Standardization Institute of the Ministry of Electronics

Focal point unit:National Technical Committee for Mould Standardization

Publishing department:State Bureau of Technical Supervision

competent authority:National Standardization Administration

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Introduction to standards:

This standard specifies the basic performance of plastic molds, assembly technical conditions, testing and acceptance regulations, packaging, transportation, storage, etc. This standard is applicable to plastic molds for integrated circuits, semiconductor discrete devices, and components encapsulated in plastic. The encapsulation material is thermosetting plastic, such as modified epoxy resin, silicone plastic, etc. GB/T 14663-1993 Technical conditions for plastic molds GB/T14663-1993 Standard download decompression password: www.bzxz.net