SJ 20711-1998 General specification for step-by-step projection exposure machine
Some standard content:
Military Standard for Electronic Industry of the People's Republic of China FL9910
SJ20711—1998
General specification for step and repeat exposure systems
Published on March 18, 1998
Implementation on May 1, 1998
Approved by the Ministry of Electronics Industry of the People's Republic of China 1 Scope
.1 Subject matter
1.2 Scope of application
1.3 Classification
2 Referenced documents
3 Requirements
3.1 Qualification appraisal
3.2 Appearance quality,
3.3 Structure
3.4 Structural performance...
3.5 Safety requirements
Reliability requirements
3.8 Environmental requirements
4 Quality assurance regulations
Inspection responsibilities
Inspection classification...
Inspection conditions
4.4 Identification inspection
Quality consistency inspection
Inspection methods
5 Delivery preparation
5.1 Sealing and packaging
5.3 Transportation and storage,
5.4 Marking
6 Notes
Intended use
Contents of ordering documents
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General specification for step and repeat exposure machine, military standard for the electronics industry of the People's Republic of China
General specification for step and repeat exposure machine systems1Scope
1.1Subject content
SJ20711—1998
This standard specifies the classification, requirements, quality assurance regulations and equipment of step-by-step projection exposure machines (hereinafter referred to as exposure machines).
1.2Scope of application
This standard applies to very large scale integrated circuits (VLSI) and application specific integrated circuits (ASIC) and other microlithography equipment. Other types of exposure machines can also be used for reference. 1.3Classification
Exposure machines can be divided into: g-line, i-line, and far ultraviolet (DUV) according to the spectral line, and exposure machines can be divided into: contact, proximity, scanning, and projection according to the irradiation method. Reference documents
GB191—90 Pictorial symbols for packaging, storage and transportation
GB3768--83 Determination of sound power level of noise source-simple methodGB5080.7-86 Equipment reliability test Failure rate and mean time between failures under the assumption of constant failure rateVerification test plan
5 Transport packaging, receiving and shipping labels
GB638886
3 Requirements
3.1 Qualification appraisal
The exposure machine submitted in accordance with this specification shall be a product that has been appraised and approved for qualification or finalization. 3.2 Appearance quality
The outer surface of the equipment shall be free of dents, bumps, cracks, deformation, etc. The coating shall not bubble, crack or fall off. Metal parts shall not be rusted or have other mechanical damage. Fasteners shall not be loose. 3.3 Hook
The transmission parts of various transmission mechanisms should be flexible and stable, and the movements should be accurate and coordinated. Ministry of Electronics Industry of the People's Republic of China 1998-03-18 Issued 1998-05-01 Implementation
3.4 Performance characteristics
3. 4. 1 Workbench
SJ 20711—1998
3.4.1.1 The movement speed of the workbench shall not be less than 50mm/s.3.4.1.2 The stroke of the workbench is determined according to the size of the silicon wafer. Its specific value is specified in the detailed product specifications. 3.4.2 Lens
The resolution of the projection lens depends on the different exposure spectra, which are: g-line exposure machine: 2um0.8μm;
i-line warm light machine: 0.8um~0.35μm
DUV line light machine: 0.35μm~0.18μm
3.4.3 Exposure system
3.4.3.1 The exposure system should have a light intensity adjustment device, the exposure should be uniform, the light source adjustment should be convenient, accurate and reliable. 3.4.3.2 The exposure uniformity of the exposure system depends on the resolution requirements, and generally should not be higher than 2.5%. 3.4.4 Focusing and leveling system
3.4.4.1 The exposure machine should focus the entire wafer or field by field, and the focusing accuracy should be 0.5μm~0.1μm. 3.4.4.2 When the line width design rule is less than or equal to 1μm, a leveling system must be used with a leveling accuracy of 0.5um~0.1μm; when the line width design rule is less than or equal to 0.5μm, a field-by-field leveling system must be used. 3.4.5 Mask light bar system
The exposure machine should have a mask light bar, which is generally composed of four separate shielding plates and can be adjusted to any size at any position.
3.4.6 Mask
3.4.6.1 The mask should be protected by a double-sided film and placed in a plate box. 3.4.6.2 The plate library should usually be able to accommodate 6 to 10 plates. 3.4.7 Capsule reduction table
The light machine should be equipped with a shock-absorbing device (such as an air spring) and have an automatic leveling function, and should ensure that it does not affect the various operating accuracies of the exposure machine.
3.4.8 Alignment system
The alignment method of the exposure machine can be coaxial alignment or off-axis alignment. 3.4.9 The whole machine
3.4.9.1 The overlay accuracy of the exposure machine is 1/3 to 1/5 of the line width design rule. 3.4.9.2 Silicon wafers generally adopt the back transfer method. 3.4.9.3 The capacity of the wafer box is generally 25 wafers.
3.4.9.4 The productivity of the exposure machine should not be less than 20 wafers/h. 3.4.9.5 The exposure machine should have a clean room. The clean room is divided into two types: the local clean room with the machine and the external clean room. The clean level is determined according to the chip line width design rule, generally level 100, level 10, and level 1. 3.5 Safety requirements
3.5.1 The whole exposure machine must be equipped with grounding screws and obvious grounding marks. 3.5.2 The insulation resistance of the power circuit and control circuit to the housing should be no less than 2MQ3.5.3 The laser light path and the light source of the exposure machine should have protective devices to avoid damage to human eyes and skin. 3.6 Noise
The noise of the exposure machine should be less than 50dB when it is running. 3.7 Reliability requirements
The exposure machine should specify reliability indicators. Specific requirements are specified in the detailed product specifications. 3.8 Environmental requirements
The exposure machine should be able to work normally under the following environmental conditionsa. Ambient temperature: 20c~24°C:
b, relative humidity: ≤50%
c. Power supply: 380/220V±5%:www.bzxz.net
d. Frequency: 50 Hz + 1 Hz
e. Amplitude: ≤8 μm.
4 Quality Assurance Provisions
4.1 Inspection Responsibility
Unless otherwise specified in the contract or order, the contractor shall be responsible for completing all inspections specified in this specification. If necessary, the ordering party or the superior appraisal agency has the right to inspect any inspection item described in the specification. 4. 1.1 Conformity Responsibility
All products must meet all requirements of Chapters 3 and 5 of this specification. The inspections specified in this specification shall become an integral part of the contractor's entire inspection system or quality management. If the contract includes inspection requirements not specified in this specification, the contractor shall also ensure that the products submitted for acceptance meet the contract requirements. Quality consistency sampling does not allow the submission of products that are known to be defective, nor can the ordering party be required to accept defective products. 4.2 Inspection classification
The inspections specified in this specification are divided into:
a. Identification inspection;
b. Quality consistency inspection
4.3 Inspection conditions
Unless otherwise specified, all inspections specified in this specification shall be carried out under the following normal conditions: a. Temperature: 20℃~24°C:
b. Relative humidity: 50%
4.4 Identification inspection
SJ 207111998
Identification inspection is generally carried out when the equipment is designed and finalized and the production is finalized. When there are major changes in the design, process, parts and materials of the product, which may affect the results of the identification inspection, identification inspection should also be carried out. Identification inspection is generally carried out by the contractor, and may also be separately stipulated in the contract or carried out in a place approved by the superior identification agency.
4.4.1 Number of samples
The number of identification inspection samples is generally 1 set. 4.4.2 Inspection Items
The identification inspection items are shown in Table 1.
4.4.3 Qualification criteria
When all inspection items meet the requirements of Chapter 3 and Chapter 5 of this specification, the appraisal inspection is judged to be qualified. If any inspection item does not meet the specified requirements, the inspection should be suspended. The contractor should analyze the unqualified items, find out the causes of the defects, and take corrective measures. After that, the unqualified items can be inspected. At this time, if all inspection items meet the specified requirements, the appraisal inspection is still judged to be qualified; if there are still inspection items that do not meet the specified requirements, the appraisal inspection is judged to be unqualified. 4.4.4 Maintenance of qualification for appraisal
In order to maintain the qualification for appraisal inspection, the contractor should provide product test data or qualification certification data as required by the ordering party or the superior appraisal agency. 4.5 Quality consistency inspection
Inspection group
Inspection items
Appearance quality
Performance characteristics
Safety requirements
Reliability
Environmental requirements
Identification inspection
Quality consistency inspection
Note: "O" indicates items that must be inspected; "II" indicates items that do not need to be inspected. Quality consistency inspection is divided into Group A and Group D. 4.5.2 Sampling plan
Requirement Article
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Inspection method
Article number
Group A inspection: Full quantity inspection is adopted.
SJ 20711--1998
Group D inspection: The MTBF and test cycle of the reliability bundle sample inspection are specified in the detailed specification. 4.5.3 Inspection Items
The quality consistency inspection grouping and inspection items shall be carried out in accordance with the provisions of Table 1. 4.5.4 Qualification Criteria
According to the inspection results, a qualified or unqualified judgment can be made. For the unqualified items, they can be repaired. For the equipment that fails the inspection of Group A (Group D), the contractor shall analyze the batch of equipment, find out the cause of the defect and take corrective measures, and then re-inspect the unqualified items. If the new inspection is qualified, the inspection of Group A (Group D) of the batch of equipment is judged to be qualified: if the re-inspection is still unqualified, the inspection of Group A (Group D) of the group of equipment is judged to be unqualified.
4.6 Inspection Methods
4.6.1 Appearance Quality Inspection
Use visual inspection to inspect the appearance quality.
4.6.2 Structural Inspection
Manual inspection according to the requirements of 3.3.
4.6.3 Performance characteristics inspection
4.6.3.1T. Workbench inspection
a. Use special test software to measure the speed of the workbench: b. Use a ruler to measure the stroke of the workbench
4.6.3.2 Lens inspection
Select a number of silicon wafers of a certain size, determine the process conditions, and perform exposure and development. Use a scanning electron microscope and a line width measuring instrument to detect the resolution of the projection lens. 4.6.3.3 Optical system inspection
a. Use a light intensity meter to inspect according to the requirements of 3.4.3.1. b. Use special test software and a light intensity detector to inspect according to the requirements of 3.4.3.2: Automatically measure a certain number of test point data evenly distributed within the image field, and display the test results. 4.6.3.4 Focusing and leveling system inspection
Use special test software, inductive micrometer (0.1um), input the defocus amount (random), start the automatic focusing system, and reply. Repeat five times. The maximum error of the response should not exceed the specified focusing accuracy (see 3.4.4.1). The leveling accuracy shall be tested by the smelling method and shall comply with the provisions of 3.4.4.2. 4.6.3.5 Check the shutter system
Inspect visually and manually according to the requirements of 3.4.5. 4.6.3.6 Check the mask
SJ 20711--1998
Inspect by daily measurement method according to the requirements of 3.4.6.1 and 3.4.6.2. 4.6.3.7 Check the vibration reduction table
Inspect the vibration reduction table visually and measure the leveling performance of the vibration reduction table with a pneumatic sensor. 4.6.3.8 Check the alignment system
Inspect the object according to the requirements of 3.4.8.
4.6.3.9 Whole machine inspection
a. Determine the process conditions, align the universal vernier test plate, select two silicon wafers with zero layer marks, automatically load the wafers, automatically align the silicon wafers, automatically unload the plate, and automatically unload the silicon wafers. After moving the X and Y worktables a certain distance, repeat the above process and develop. Read the X and Y vernier deviations of each pattern under the microscope, calculate the overlay error, and use the lowest accuracy of the two wafers as the overlay accuracy of the exposure machine: b. Use the national measurement method to check according to the requirements of 3.4.9.2: c. Use the measurement method to check according to the requirements of 3.4.9.3; d. Actual tape-out, calculate the productivity:
e. Use an ion counter to detect the purification level. 4.6.4 Safety inspection
4.6.4.1 Use visual inspection to check whether there are grounding screws and marks. 4.6.4.2 Use a 500V megohmmeter to test the insulation resistance of the power circuit and control circuit to the housing. 4.6.4.3 Use visual inspection to check the actual object according to the requirements of 3.5.3. 4.6.5 Noise inspection
The blasting machine is running at no load, and the noise of the whole machine is checked according to the method specified in GB3768. 4.6.6 Reliability requirement inspection
The reliability of the blasting machine is inspected according to the test method specified in GB5080.7-86. The specific requirements are specified in the detailed product specifications.
4.6.7 Environmental requirements inspection
According to the requirements of 3.8, the on-site working environment conditions of the equipment are inspected. 5 Delivery preparation
5.1 Sealing and packaging
5.1.1 The packaging of the exposure machine should be "moisture-proof", "anti-corrosion" and "dust-proof". 5.1.2 The moving guide rails, driving screws, grinding and scraping surfaces of each part of the main machine should be cleaned before packaging and sealed with butter (after dehydration treatment) and anti-rust paper. 5.2 Packing
5.2.1 The exposure machine is packed in wooden boxes, and rain and moisture-proof measures must be taken. 5.2.2 The packing list, product certificate, product instruction manual and random documents should be packed in plastic bags and packed into the packaging box.
5.3 Transportation and Storage
5.3.1 Transportation
SJ 20711-—1998
The exposure machine should be stable during transportation, especially in road transportation, excessive impact acceleration should be avoided as much as possible; special attention should be paid to handling with care during lifting. 5.3.2 Storage
The exposure machine must be stored in a clean room that is moisture-proof, dust-proof and shock-proof. During storage, spot checks should be conducted once every six months, and after one year, a comprehensive inspection should be conducted to remove rust and spots, and then the box should be sealed for storage. 5.4 Marking
5.4.1 The packaging box of the exposure machine should be marked with at least five packaging, storage and transportation graphic signs: "Handle with Care", "Upward", "Park", "Center of Gravity", and "Lift from Here" in accordance with the provisions of GB191. 5.4.2 The packaging box of the exposure machine shall be marked with at least "product name and specification", "weight", "volume", "shipping and receiving location and unit", "transportation number" and other transport packaging shipping and receiving marks in accordance with the provisions of GB6388. 5.4.3 The product mark shall at least contain the following contents: a. Manufacturer name; b. Product name; c. Factory number: d. Manufacturing date. 6.1 Intended use The step-by-step projection exposure machine specified in this specification is intended to be used for the exposure of various ultra-large-scale integrated circuits and special integrated chips in military equipment. 6.2 Definition 6.2.1 Step and repeat exposure systems Step and repeat exposure systems are equipment that projects the pattern on the primary plate directly onto the silicon wafer in a step-by-step and repeat manner at a certain magnification for exposure.
6.2.2 Resolution
The minimum physical and geometric value that a device can distinguish, or the minimum graphic size that can produce a clear image. 6.2.3 x-Y stage
A mechanical table that moves in two dimensions at high speed in the XY direction and can carry workpieces. 6.2.4 Line width
The distance between the two boundaries of the line material at a specific height above the interface between the line layer and its bottom layer on a given cross section of the line.
SJ 20711--1998
6.2.5 Exposure uniformity of exposure The degree of inconsistency in the amount of light received by each point of the photoresist material within the effective irradiation area in one irradiation. 6.2.6 Exposure
The process of making the photosensitive material layer selectively withstand light energy or other radiation energy. 6.2.7 Throughput
Also known as the tape-out rate, it is the number of wafers that can be processed by one device per unit time. 6.2.8 Overlay precision Overlay precision When the exposure equipment completes a series of exposures of an integrated circuit, the relative position deviation of the corresponding patterns of each layer on the chip.
6.2.9 Off-axis alignment Off-axis alignment Indirect alignment using the marks on the alignment microscope or camera with the mask marks and wafer marks respectively 6.2.10 On-axis alignment Using light with a wavelength different from that of the daylight, the relative position between the mask and wafer alignment marks is observed through the optical axis of the imaging lens, and the mask is directly aligned with each chip pattern on the wafer by moving the wafer stage. 6.2. 1t Chip
The area on the wafer used to manufacture independent circuits, 6.3 Contents of ordering documents
The following contents should be stated in the contract or order: a: The name and number of this specification:
b. Equipment type:
Model:
d. Quantity:
e. Sealing, packaging and packing level.
Additional remarks:
This specification is under the jurisdiction of China Electronics Technology Standardization Institute. This specification was drafted by the 45th Institute of the Ministry of Electronics Industry. The main drafters of this specification are Huang Yan, Tu Zhongren, Wang Jiachu, Yue Huaike. Project code: B64004,
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