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Ministry of Machinery and Electronics Industry of the People's Republic of China Standard Terminology for Soft Soldering Fluxes
Definition of terms for soft soldering fluxes SJ8204—89
This standard is basically formulated with reference to the relevant contents of the draft standard of the Secretariat document "Soft Soldering Fluxes" of the Technical Committee for Soldering Standardization of the International Organization for Standardization ISO/TC44/SC12. 1 Subject content and scope of application
1.1 Subject content
This standard specifies the terminology for soft soldering fluxes, including commonly used basic terms, definitions classified by flux components, and major special terms in flux testing technology. 1.2 Scope of application
The terminology for soldering fluxes specified in this standard is mainly used in the electronic product welding technology industry. 2 Terminology
2.1 Soft soldering (soldering) soldering
The process of connecting molten solder to metal surfaces below 450°C, that is, the operation of melting another fusible metal with a lower melting point than the base metal without melting the base metal, so that they penetrate and bond together. 2.2 Soft solder (solder) Metal alloys with a melting point below 450°C, also known as low-temperature solder. The vast majority of soft solders are tin alloys. The most commonly used are tin-lead and tin-lead-silver series solders, which can wet metals and bond with metal surfaces.
2.3 Soft soldering flux (Flux) An active substance that can remove oxide films and other surface films on base metals and solders through chemical and physical actions to achieve the necessary cleanliness of the welding surface. It can make the molten solder wet the surface to be welded, and can also prevent the surface from re-oxidation during welding and reduce the interfacial tension between the solder and the base metal. Referred to as flux (Flux). 2.4 Flux cored solder fluxcoredsolder is a filament or ribbon solder that is filled with flux in the form of one or more cores along the space. 2.5 Solder paste solderpaste (soldercream) is a paste made by mixing powdered solder alloy, flux and some fillers that can act as a paste. 2.6 Solid flux solidflux
is a non-metallic solid substance whose melting temperature is lower than that of soft solder. When heated to a certain temperature, it can dissolve rust and contaminants on the surface of the base metal to be welded, and prevent the welding surface from being oxidized and contaminated again. 2.7 Liquid flux liquidflux
Solid flux is made by dissolving in an appropriate solvent. It is often used for dip soldering. It needs to be dried after dipping, otherwise the flux will splash during welding. Therefore, alcohol-soluble flux that is easy to volatilize is generally used, but it is flammable and has a certain anesthetic property. It must be stored in a sealed container and isolated from heat and fire sources. Liquid flux containing water requires a longer drying time. 2.8 Paste flux fluxpaste
A flux prepared in a foetid form that can have special uses, such as surface mounting technology and coaxial connection technology.
2.9 Resin flux resinflux
A general term for fluxes with natural and synthetic resins as basic components. It is divided into two categories: rosin-based and non-rosin-based. Electronic products mostly use rosin-based resin flux. 2.10 Inorganic flux inorganic flux
It is divided into two categories: salt and acid. It is very active. The residue is hygroscopic and very corrosive. Therefore, it must be cleaned after welding. The degree of cleanliness has a great influence on the electrical insulation performance of the weldment, and sometimes it will cause electrical discharge. It is rarely used in the electronics industry.
2.11 Organic flux organic flux
Refers to organic flux composed of organic acids, bases, salts or their derivatives other than resins. It is divided into water-soluble and non-water-soluble. Compared with inorganic flux, its disadvantage is poor thermal stability and short activation time. Once heated, it will decompose rapidly, and as a result, it may leave inactive residues. However, the hygroscopicity of the residue is weaker than that of inorganic flux. 2.12 Flux activity flux activity
The level or degree to which a given flux promotes the wetting of the molten solder surface, that is, the performance of the flux to minimize the contact angle between the molten solder and the base metal surface. It can be measured by a certain test method for the solderability of the surface to be soldered.
2.13 Activator.s
is a substance that promotes the activity of flux. It is usually an organic halogen compound or halogen salt that is easily decomposed by heat and inorganic acids, amines, and heat. Its main function is to remove oxides on the surface of the base metal. 2.14 Flux efficiency
refers to the ability of the flux to make the molten solder wet the surface of the base metal within a specified time, including the ability to transfer heat and the ability to chemically clean. It is directly related to the activity of the flux. 2.15 Activated flux
refers to the flux made by adding an activator. Its characteristics vary depending on the type of activator and the addition and combination state of the activator with the flux.
2.16 Non-activated flux refers to a flux made of natural resin and synthetic resin that does not contain an activator to increase activity. 2.17 Resin
A commonly used term for natural and synthetic resin products. 2.18 Colophony (Rosin)
A hard natural resin extracted from the rosin of pine trees. Its main components are rosin acid and its isomers, some organic esters and olefins. It is usually extracted by wood-like and rubber-like methods. Its color can be divided into several grades. In the production of solder flux in the electronics industry, the most widely used is WW grade water-white rosin. 2.19 Synthetic resin2
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It refers to the general term for chemically treated natural resins and similar synthetic organic materials used to prepare rosin-based and non-rosin resin-based fluxes. For example, polymerized and hydrogenated natural resins, synthetic rosins, etc. 2.20 Colophony (rosin) flux Active or inactive flux based on rosin. The reason why it is widely used in the electronics industry is that it has some good properties. It can purify the oxidized metal surface at the welding temperature and form a good insulating layer after welding. 2.21 Activated colophony (rosin) flux is a mixture of rosin and a small amount of organic halide or organic acid (i.e. activator) that can improve the ability of pure rosin to remove oxide film. It can be made into liquid, solid or paste for use. 2.22 Water-soluble flux watersoluble flux means that the residue of the flux can be dissolved in water and can be washed with water. It does not mean that the composition of the flux must contain water. Solvents such as alcohol or ethylene glycol or water-soluble polymers can also be used. It is usually very active, but the flux residue is highly corrosive and conductive and must be completely removed. 2.23 Aqueous flux
refers to a non-standard term for flux whose basic components are soluble in water or organic matter (organic acid, amine halogen acid salt, polyethylene glycol, polyol, etc.) but not inorganic. It is also called organic acid flux and water-soluble flux. 2.24 Water-soluble flux Water non-soluble flux refers to flux that can be concentrated in organic solution. Solvent is needed to clean the residue. 2.25 Solvent
Liquid that can dissolve other components. It is used as a medium when measuring ionic contamination, and is used to remove flux residue and as a cleaning agent. The solvents used are polar, non-polar, binary, azeotropic and other types. 2.25 Ionic contaminants (ionizable contaminants) refer to the residues of the welding process, such as flux activators, fingerprints, corrosion products and salts in electroplating solutions, which will reduce insulation when they exist or dissolve in the form of ions. 2.27 Residues
Any form of contamination left by the welding process that is visible or measurable. 2.28 Contaminants
Is foreign impurities, often caused by unknown causes, which may be harmful, such as corrosion inhibitors or residual flux ions, which can reduce its weldability. It may also be harmless, such as only affecting its appearance. 2.29 Flux residues
The form of contamination remaining on the surface after welding due to the use of flux. 2.30 Non-volatile matter is only applicable to liquid and paste resin flux without activator, that is, the weight percentage of solid matter after removing volatile matter.
2.31 Halide content
The ratio of the mass of free halide to the mass of solid components of flux. Expressed as the mass percentage of free chloride ion. 2.32 Acid value
The number of milligrams of potassium hydroxide required to neutralize the non-volatile free acid in 1g flux. 3
2.33 Color
SJ3204-89
To identify the color of liquid flux, it can be compared with color standard solution, or tested with photoelectric colorimeter or spectrophotometer.
2.34 Corrosion
Chemical corrosion or electrolytic corrosion caused by flux, including flux residue, on the base metal. 2.35 Corrosive flux usually refers to inorganic flux or water-based flux (organic acid and amine halide flux). 2.36 Copper mirror test coppermirrortest is a method used to test the corrosion of flux to vacuum copper film (thickness 0.024μm) on glass plate. 2.37 Conductivity
is conductivity (conductivity). The conductivity of a water extract or solvent extract of flux on a sample or actual printed circuit board is used as a measure of ion contamination. This contamination is usually caused by incomplete removal of flux residues, expressed in μs/cm or 1/μQ.cm.
2.38 Insulation resistance insulationresistance The resistance of the insulating material when a pair of contacts, wires or grounds are in various combinations under specified environmental and electrical conditions. It is one of the most important parameters for determining the impact of flux residue on electrical reliability, expressed as 9. 2.39 Comb pattern
A group of interdigitated comb wires consisting of two to five evenly arranged copper or tinned wires are made on the printed circuit insulating substrate. It is used to test the influence of flux and its residue on the reliability and life of printed circuits. 2.40 Resistivity
The reciprocal of conductivity, expressed in cm. (See conductivity) 2,41 Reliability·reliability
A general term that indicates the performance and life characteristics of actual electrical and electronic equipment or components. In welding technology, its reliability is mainly measured by insulation resistance and ion contamination. 2.42 Basis metal
Refers to the metal used in various types of soft soldering parts, such as copper, copper alloys, etc. 2.43 Base materials
Various materials used in soft soldering parts including base metals. Such as polymers, insulating materials on printed circuit boards, etc.
2.44Tinning
General term for the process of coating the base metal with tin or solder alloy for corrosion protection and to ensure solderability. .45Aging
refers to the process of performance deterioration over time. Here the emphasis is on the change of solderability over time. 2.46Accelerated agingA special test that simulates long-term natural aging conditions and takes accelerated environmental or chemical treatments on the specimen. 2.47Interfacial tensionSurface tension (interfacial tension) is the inherent physical force acting on the interface between liquid and solid. It can make the liquid solder spread on the surface of the base metal. The extent to which the liquid solder spreads on the surface or flows into the gap between two or more surfaces is directly related to the surface tension acting on the interface.
2.48 Menicus
The contour formed on the solder surface due to the effect of surface tension during the wetting process. 2.49 Contact angle
The angle between the tangent plane of the liquid surface and the two planes of the liquid-solid interface at the intersection of the liquid and the solid is the contact angle. The value of the contact angle between the base metal, the molten solder and the flux is inversely proportional to the activity of the flux. 2.50 Wetting
Refers to the phenomenon of interaction between the liquid solder and the surface of the base metal to be soldered. That is, the phenomenon that the molten solder expands on the surface of the base metal to form a complete and uniform covering layer. 2.51 Wettability
Refers to the ability of the molten solder to wet the surface of the base metal. 2.52 Wetting degree
Is the cosine value of the contact angle. When the contact angle tends to zero and the cosine value is close to 1, the solder is completely wetted on the surface. When the contact angle increases to 180° and the cosine value approaches -1, there is no wetting at all. Because the cosine value can only use one significant digit, it is a better way to measure the degree of wetting. The contact angle expressed in degrees contains two significant digits (one of which is false). 2.53 Good wetting goodwetting
A uniform, complete, smooth, crack-free, and well-adhesive solder is left on the surface of the base metal, that is, the contact angle approaches zero (generally less than 20°) and the cosine value approaches 1. 2.54 Weak wetting (wetting retraction) dewetting The molten solder retracts after initially wetting the covered surface area, leaving a thin solder film on the surface with scattered irregularly shaped solder clumps on it. The typical contact angle is 50 to 90°. 2.55 Poor wetting
The contact angle of the solder on the base metal surface is large, and the solder cannot fully wet the entire surface, that is, some parts of the surface are wetted, and other parts are not wetted. Generally, the contact angle is greater than 90°, and the cosine value is less than zero. 2.56 Non-wetting
It means that the solder does not wet the base metal surface. The contact angle tends to 180° and the cosine value tends to -1. 2.57 Solderability
Under a given set of conditions, the ability of molten solder to wet the base metal surface is measured according to the specified test method, that is, the degree of wetting achieved and the time required to complete wetting. It can be evaluated by solder spread test, wetting weighing test, etc.
2.58 Solder spread test Solder spread test is a relative measure of the effectiveness of the flux. Place a standard weight of solder on a specially prepared and fluxed metal surface under specified conditions (temperature, time, flux type), heat until it melts, and measure the area of its expansion. 2.59 Wetting balance is an instrument used to measure wettability and solderability. When the sample or weldment is immersed in the molten solder bath, this wetting balance can measure the function of the change of wetting force over time. The curve of wetting force and wetting time obtained can provide data on wetting time, wetting rate and wetting force to determine the solderability of the sample or weldment and the effectiveness of the soldering flux. 2.60 Dryness (tackiness) refers to the dryness of the surface of the flux or flux residue. 2.61 Flux splash test is a test method for evaluating the process performance of flux, which can be measured by the amount of splashed flux and solder. It is mainly suitable for measuring flux core solder.
Non-volatile matter·
Poor wetting
Non-wetting·
Residue·
Conductivity·
Resistivity.
Non-active flux
Non-water-soluble flux
Corrosiveness…
Corrosive flux…
Dryness
Paste flux
Solid flux·
Flux residue
Flux activity…
Flux effectiveness
Flux core solder
Flux spatter test
Solder paste
Solder spread rate Test
Aqueous flux…
Synthetic resin
SJ3204-89
Appendix A
Chinese index
(Supplement)
.·2.44
..·2.34
..2.61
..·2.23
Activator·
Active flux…
Active rosin flux
Contact angle
Accelerated aging
Base metal
Interfacial tension (surface tension)
Insulation resistance.....
Solderability·
Reliability
Wettability·
Ionic contamination
Good wetting
Halide content·
Soft solder:
Soft solder.
Soft solder flux
Solvent·
Degree of wetting
Wetting scale
Wet wetting (wetting retraction)
Rosin·
Rosin-based flux
Resin·
SJ3204-89||t t||.·2.15
..2.46
.·2.47
Resin-based flux
Comb-shaped pattern
Water-soluble flux
Copper mirror testbZxz.net
Meniscus·
Inorganic flux
Contaminants·
Liquid flux
Organic flux·
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...·2.48
.-2.11
Accelerated ageing..
Acid value.
SJ3204-89
Attached B
English index
(supplement)
Activated colophony(Rosin)flux...Activated flux.
Activitors.
Aqueous flux
Base materials..
Basis metals...|| tt | flux | |tt | ||Fluxpaste
Flux residues...
Flux spatter test...
Good wetting
Halide content
Inorganic flu
Insulationresistance
SJ3204—89
Ionic contaminants(Ionizable contaminants)L
Liquid flux
Meniscus
Non-activatedflux.
Non-volatile matter...
Non-wetting...
Organic flux
Poor wetting
Reliability
Resinflux:
Resistivity
.·2.38 ||tt | |tt||Solid flux.
Solvent
Surface tension(Interfacial tension)Synthetic resin
Tinning
Water solubleflux
Waternon-solubleflux
Wettability
Wetting
Wetting balanc
Wetting degre
Organic flux
Poor wetting
Reliability
Residues
Resinflux:
Resistivity
.·2.38||tt ||.·2.17
…,2.9
Soft solder(solder).\.
SJ8204-89
Soft soldering flux(flux)..||tt ||Solaerability.
Solder paste(solder crcam)
Soldering...
Solder spread test...
Solid flux.||tt| |Solvent
Surface tension(Interfacial tension)Synthetic resin
Tinning
Water solubleflux
Waternon-solubleflux
Wettability
Wetting
Wetting balanc
Wetting degre
Organic flux
Poor wetting
Reliability
Residues
Resinflux:
Resistivity
.·2.38||tt ||.·2.17
…,2.9
Soft solder(solder).\.
SJ8204-89
Soft soldering flux(flux)..||tt ||Solaerability.
Solder paste(solder crcam)
Soldering...
Solder spread test...
Solid flux.||tt| |Solvent
Surface tension(Interfacial tension)Synthetic resin
Tinning
Water solubleflux
Waternon-solubleflux
Wettability
Wetting
Wetting balanc
Wetting degre
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