This standard specifies the classification, requirements, test methods, inspection rules, packaging, marking, transportation and storage of epoxy powder encapsulation materials for electronic components (hereinafter referred to as encapsulation materials). This standard applies to the powder encapsulation materials required for the encapsulation of electronic components such as resistors, high-voltage ceramic capacitors, capacitors and resistor networks. SJ/T 11124-1997 Epoxy Powder Encapsulation Materials for Electronic Components SJ/T11124-1997 Standard download decompression password: www.bzxz.net
This standard specifies the classification, requirements, test methods, inspection rules, packaging, marking, transportation and storage of epoxy powder encapsulation materials for electronic components (hereinafter referred to as encapsulation materials). This standard applies to the powder encapsulation materials required for the encapsulation of electronic components such as resistors, high-voltage ceramic capacitors, capacitors and resistor networks.

ICS31-030
Record number: 693-1997
Electronic Industry Standard of the People's Republic of China
SJ/T11124-1997
Encapsulation materials of expoy series powderforuseinelectroniccomponents1997-09-03Published
1998-01-01Implementation
Ministry of Electronics Industry of the People's Republic of China
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This standard is formulated to meet the needs of external encapsulation materials for electronic components-epoxy series powder encapsulation materials. Since there is no corresponding international standard to follow, this standard is based on the data and experience accumulated by major domestic production and use units for many years in terms of technical indicators and test methods, and refers to the main technical indicators of Japanese Sumitomo, Soma and other companies. It has certain advancement and mature implementation conditions. This standard is prepared in accordance with GB/T1.1-1993 (Guidelines for Standardization Work Unit 1: Rules for Drafting and Presentation of Standards Part 1: Basic Provisions for Standard Preparation). The test methods involved shall adopt the published national industry standards as much as possible.
Appendix A and Appendix B of this standard are both appendices of the standard. This standard is under the jurisdiction of the Standardization Institute of the Ministry of Electronics Industry. This standard was drafted by the Standardization Institute of the Ministry of Electronics Industry, the State-owned Beijing Third Radio Equipment Factory, and the Weihua Electronic Packaging Materials Factory of Shaanxi Huadian Materials Corporation.
The main drafters of this standard are: Wang Yongming, Li Xiaoying, Wang Yugong, Han Yanfen, and Liu Nianjie.YYKANrKAcas
1 Scope
Electronic Industry Standards of the People's Republic of China
Encapsulation materials of expoy series powderforuse in electronic components componentsSJ/T11124-1997
This standard specifies the classification, requirements, test piece method, inspection rules, packaging, marking, transportation and storage of epoxy powder encapsulation materials for electronic components (hereinafter referred to as encapsulation materials). This standard applies to the powder encapsulation materials required for encapsulation of electronic components such as resistors, high-voltage ceramic capacitors, capacitors and resistor networks.
2 Referenced standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and the parties using this standard should explore the possibility of using the latest versions of the following standards.
GB1034-86
GB1036—89
GB 140889
GB1409—88
GB1410—89
GB2411—80
GB 6554—86
SJ3262—86
Test method for water absorption of plastics
Determination method for linear expansion coefficient of plastics
Test method for power frequency electrical strength of solid insulating materialsTest method for relative dielectric constant and dielectric loss factor of solid insulating materials at power frequency, audio frequency and high frequency (including meter wavelength)
Test method for volume resistivity and surface resistivity of peripheral insulating materialsTest method for Shore hardness of plastics
Test method for electrical insulation coating powder||tt| |General Technical Conditions for Encapsulation Materials for Electronic Components SJ/Z9132-87 Flammability Tests for Plastic Materials for Parts in Various Electrical Devices and Equipment 3 Classification and Naming
Product models and representation methods shall comply with the provisions of Chapter 3 of S3262-89. 4 Requirements
4.1 Powder Properties
Approved by the Ministry of Electronics Industry of the People's Republic of China on September 3, 1997 YKAONrKAcas
Implementation on January 1, 1998
Powder properties shall comply with the provisions of Table 1.
Apparent Density g/ml
Softening Point
Gel Time
Horizontal Flow Rate %
Performance of Cured Material
SJ/T11124-1997
Under bright but indirect natural light, the powder shall be uniform in color, free of lumps, debris and other impurities that may affect the use effect. 80 self-screened all passed
50-200
The performance of the powder unencapsulated material should meet the requirements of Table 2. Table 2
Test method
Average linear expansion coefficient
Hardness (Boehm hardness)
Dielectric constant (IMHz)
Normal volume resistivity
Volume resistivity after humidity test
Normal 10\Hz dielectric loss tangent
10*Hz dielectric loss tangent after humidity testElectrical strength
Flame retardancy
Temperature shock resistance
Water absorption
Solvent resistance
Angular coverage
5×10-5
≥1×1014
>11012
UL.-94V-0
No damage, no cracking
No swelling, no cracking
Unless otherwise specified, the sample preparation in the test method shall be carried out in accordance with Appendix A (Appendix to the standard). 5.1 Powder
5.1.1 Visual inspection of appearance.
5.1.2 Particle size shall be inspected in accordance with 1.3 of GB6554. 5.1.3 Apparent density shall be inspected in accordance with 1.1 of GB6554. 2
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SI/T11124-1997
5.1.4 Softening point is tested according to 1.4 of GB6554 or Appendix B (Appendix of the standard). 5.1.5 Gel time is tested according to 1.5 of GB6554, and the hot plate temperature is 160C. 5.1.6 Horizontal fluidity is tested according to 1.6 of GB6554, and the hot plate temperature is 150C. 5.2 Cured material
5.2.1 Average linear expansion coefficient is tested according to GB1036. 5.2.2 Hardness is tested according to GB2411.
5.2.3 Dielectric constant is tested according to GB1409.
5.2.4 Normal volume resistivity is tested according to GB1410. 5.2.5 The volume resistivity after the humidity test is to place the test piece in a humidity chamber at a temperature of 40±2℃ and a relative humidity of 90% to 95%, and then test it according to GB1410 after 504h. 5.2.6 The normal 10°IIz dielectric loss tangent is tested according to GB1409. 5.2.7 The 10°Hz dielectric loss tangent after the humidity test is tested according to GB1409 after the humidity test in accordance with 5.2.5. 5.2.8 The dielectric strength is tested according to GB1408.
5.2.9 The flame retardancy is tested according to UI.94V-0 in SJ/Z9132. 5.2.10 The temperature shock resistance is tested five times with 18 encapsulated products (20mm×1mm) under the following conditions, and the products are visually inspected after the temperature shock.
-55.=125*c
5.2.11 Water absorption rate shall be tested in accordance with GB1034.
5.2.12 Solvent resistance: 10 encapsulated components shall be soaked in a mixed solution of ,,:2 in 1:1 for 1 hour. 5.2.13 Corner coverage rate shall be tested in accordance with 2.17 of GB6554. 5.3 Packaging and marking shall be tested by daily testing, and the results shall meet the requirements of 7.1 and 7.2. 6 Inspection rules
61 Inspection responsibility
6.1.1 The product shall be inspected by the supplier's technical supervision department to ensure that the product quality meets the requirements of this standard and fill in the product certificate.
6.1.2 The purchaser may inspect the received products. If the inspection results do not meet the requirements of this standard, it shall be reported to the supplier within one month from the date of receipt of the product, and the supply and demand parties shall negotiate to resolve the problem. 6.2 Batch
Each batch is composed of products of the same model and produced under the same process conditions (with barrels as unit products). Each batch shall not exceed 500kg.
6.3 Sampling
Three barrels shall be randomly selected from each batch, and the total sample volume shall not be less than 1kg. The samples shall be mixed evenly. 6.4 Inspection classification
Product inspection is divided into delivery inspection and routine inspection. 6.4.1 Acceptance inspection items are to be carried out in accordance with the provisions of Table 3. -3
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Inspection or test items
Gel time
Horizontal flow rate
Dielectric constant
Normal volume resistivity
Normal loss tangent
Electrical strength
SJ/T11124-1997
Required article number
Test method article number
If one of the acceptance inspection items is unqualified, double sampling should be carried out for re-inspection of the unqualified item. If the re-inspection result still fails to meet the requirements of 6.4.2
, the batch of products is unqualified.
Routine inspection items are to be carried out in accordance with the provisions of Table 4.
Softening point
Inspection or test items
Corner coverage
Average linear expansion coefficient
Volume resistivity after humidity test
Dielectric loss tangent after humidity test
Flame retardancy
Temperature shock resistance
Water absorption
Solvent resistance
Required chapter number
Test method chapter number
Routine inspection is carried out every six months. Routine inspection should also be carried out when there are major changes in materials, processes, equipment, etc. Routine inspection samples are drawn from the products produced this year and passed the delivery inspection according to 6.3. If one item is not qualified in the inspection, the routine inspection is considered unqualified. At the same time, the products within this period are stopped from being delivered and the reasons should be analyzed and measures should be taken. They can only be produced after they are re-tested and qualified.
Packaging, marking, transportation and storage
7.1 Packaging
7.1.1 The product should be first packed into polyethylene plastic bags, heat-sealed, and then packed into plastic barrels or fiberboard barrels. The outer packaging should be marked with "moisture-proof" and "heat-resistant". The weight of each package should not exceed 30kg, or it can be stipulated by the agreement between the supply and demand parties, but the net weight of each package should be the same.
7.1.2 Each barrel of product should be accompanied by a certificate of conformity, which should state:4
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Product name and trademark;
Product model;
Net weight, kg;
Number of this standard;
Manufacturing date and manufacturing unit;
Expiration date;
Production number and inspector's mark;||tt ||Main parameters of the product.
SJ/T11124-1997
Each outer package of the product should be affixed with a label, which should indicate: a)
Product name and trademark;
Product model;
Net weight, kg
Number of this standard;
Date of manufacture and name of manufacturer;
Inspector's mark.
7.3 Transportation
The product should be transported in a condition that avoids direct rain and snow, sunlight and mechanical damage, especially in high temperature seasons. If conditions permit, it should be transported at a temperature below 5°C. 7.4 Storage
The product should be sealed and stored in a dry warehouse with a temperature below 25 degrees Celsius. The storage period is half a year. 5
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SJ/T11124-1997
Appendix A
(Appendix to the standard)
Sample preparation method of epoxy powder encapsulation material for electronic components Instruments required for sample preparation
Small vertical injection molding machine;
Transfer injection mold (should be matched with injection molding machine); b)
e) Press machine;
Pre-press cylindrical ring material mold (its diameter is not larger than the diameter of the injection molding machine silo); Oven: temperature fluctuation range is not more than ±1 seven. Sample preparation steps
Before sample preparation, conduct mechanical and power inspection of the injection molding machine; preheat the mold, and perform demolding treatment on the inner surface of the mold. The preheating temperature is generally higher than the softening point of the encapsulation material by 1020C; take an appropriate amount of powder encapsulation material to pre-press or cylindrical bad material at room temperature, and its diameter should be smaller than the mouth of the silo. diameter; put the pre-pressed material block into the hopper;
start the injection machine and close the mold, then inject the material in the hopper into the mold. The injection pressure is selected according to the type of encapsulation material. The encapsulation material injected into the mold must be kept in the mold for a certain time, generally not more than 2 minutes; heat and cure the mold and the injection material body. The curing temperature and time shall be in accordance with the provisions of the product manual. g)
Take out the cured sample from the mold, which is the sample required for the test. YYKAONrKACas
B1 Method principle
SJ/T11124-1997
Appendix B
(Appendix to the standard)
Softening point test method of epoxy powder encapsulation material for electronic components Heat the epoxy powder unencapsulated material and record its initial melting temperature, which is the softening point. B2 Samples and requirements
Samples should be sampled according to the relevant provisions of the product standard, and at least three samples should be taken for each encapsulation material. B3 Apparatus, tools and requirements
Softening point test plate: accurate to ±0.5℃; voltage regulator: 0~250V;
Balance: accuracy of 0.05g;
Thermometer: 0~200℃
Horn spoon, ointment knife.
Test conditions
Ambient temperature is 25±1℃
Relative temperature is less than 65%.
5 Heating rate
Heating rate is 50℃/min below 50℃ and 2℃/min above 50℃. Test steps
Accurately weigh 1g of sample and pile it in the kiln at the center of the softening point measuring plate; a
Connect the measuring plate with the voltage regulator, turn on the power and start heating. The heating rate shall be carried out according to the provisions of B5; b)
Observe the sample and record the temperature T when it starts to shrink from expansion and the color becomes darker. e)
Determination of sample results
Take the lowest value of three measurements as T,℃;
Take the highest value of three measurements as T2℃;
The softening point of the material is (T1～T2)℃. YYKAONrKAcas4 Storage
The product should be sealed and stored in a dry warehouse with a temperature below 25℃. The storage period is half a year. 5
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SJ/T11124-1997
Appendix A
(Appendix of the standard)
Sample preparation method of epoxy powder encapsulation material for electronic components Instruments required for sample preparation
Small vertical injection molding machine;
Transfer injection mold (should be matched with injection molding machine); b)
e) Press machine;
Pre-pressed cylindrical ring mold (its diameter is not larger than the diameter of the injection molding machine bin); Oven: The temperature fluctuation range is not more than ±1℃. Sample preparation steps
Before sample preparation, perform mechanical and power inspection on the injection machine; preheat the mold, and perform demoulding treatment on the inner surface of the mold. The preheating temperature is generally higher than the softening point of the encapsulation material by 1020C; take an appropriate amount of powder encapsulation material and pre-press or cylindrical material at room temperature, and its diameter should be smaller than the diameter of the silo; put the pre-pressed material block into the silo;
Start the injection machine and close the mold. Inject the material in the silo into the mold. The injection pressure is selected according to the type of encapsulation material. The encapsulation material injected into the mold must stay in the mold for a certain time, generally not more than 2 minutes; heat and cure the mold and the injection material body. The curing temperature and time are specified in the product manual. g)
Take out the cured sample from the mold, which is the sample required for the test. YYKAONrKACas
B1 Principle of the method
SJ/T11124-1997
Appendix B
(Appendix of the standard)
Test method for softening point of epoxy powder encapsulation materials for electronic components Heat the epoxy powder unencapsulated material and record its initial melting temperature, which is the softening point. B2 Samples and requirements
Samples should be sampled according to the relevant provisions of the product standard, and at least three samples should be taken for each encapsulation material. B3 Instruments, tools and requirements
Softening point test plate: accurate to ±0.5℃; voltage regulator: 0~250V;
Balance: accuracy of 0.05g;
Thermometer: 0~200℃
Ox horn spoon, ointment knife.
Test conditions
The ambient temperature is 25±1℃
The relative temperature is less than 65%.
5 Heating rate
The heating rate is 50℃/min below 50℃ and 2℃/min above 50℃. Test steps
Accurately weigh 1g of the sample and stack it in the kiln at the center of the softening point measuring disk; a
Connect the measuring disk with the voltage regulator, turn on the power supply and start heating. The heating rate shall be carried out according to the provisions of B5; b)
Observe the sample and record the temperature T when it starts to shrink from expansion and the color becomes darker. e)
Determination of sample results
Take the lowest value of the three measurements as T,℃;
Take the highest value of the three measurements as T2℃;
The softening point of the material is (T1～T2)℃. YYKAONrKAcas4 Storage
The product should be sealed and stored in a dry warehouse with a temperature below 25℃. The storage period is half a year. 5
YYKAONrKAca
SJ/T11124-1997
Appendix A
(Appendix of the standard)
Sample preparation method of epoxy powder encapsulation material for electronic components Instruments required for sample preparation
Small vertical injection molding machine;
Transfer injection mold (should be matched with injection molding machine); b)
e) Press machine;
Pre-pressed cylindrical ring mold (its diameter is not larger than the diameter of the injection molding machine bin); Oven: The temperature fluctuation range is not more than ±1℃. Sample preparation steps
Before sample preparation, perform mechanical and power inspection on the injection machine; preheat the mold, and perform demoulding treatment on the inner surface of the mold. The preheating temperature is generally higher than the softening point of the encapsulation material by 1020C; take an appropriate amount of powder encapsulation material and pre-press or cylindrical material at room temperature, and its diameter should be smaller than the diameter of the silo; put the pre-pressed material block into the silo;
Start the injection machine and close the mold. Inject the material in the silo into the mold. The injection pressure is selected according to the type of encapsulation material. The encapsulation material injected into the mold must stay in the mold for a certain time, generally not more than 2 minutes; heat and cure the mold and the injection material body. The curing temperature and time are specified in the product manual. g)
Take out the cured sample from the mold, which is the sample required for the test. YYKAONrKACas
B1 Principle of the method
SJ/T11124-1997
Appendix B
(Appendix of the standard)
Test method for softening point of epoxy powder encapsulation materials for electronic components Heat the epoxy powder unencapsulated material and record its initial melting temperature, which is the softening point. B2 Samples and requirementsWww.bzxZ.net
Samples should be sampled according to the relevant provisions of the product standard, and at least three samples should be taken for each encapsulation material. B3 Instruments, tools and requirements
Softening point test plate: accurate to ±0.5℃; voltage regulator: 0~250V;
Balance: accuracy of 0.05g;
Thermometer: 0~200℃
Ox horn spoon, ointment knife.
Test conditions
The ambient temperature is 25±1℃
The relative temperature is less than 65%.
5 Heating rate
The heating rate is 50℃/min below 50℃ and 2℃/min above 50℃. Test steps
Accurately weigh 1g of the sample and stack it in the kiln at the center of the softening point measuring disk; a
Connect the measuring disk with the voltage regulator, turn on the power supply and start heating. The heating rate shall be carried out according to the provisions of B5; b)
Observe the sample and record the temperature T when it starts to shrink from expansion and the color becomes darker. e)
Determination of sample results
Take the lowest value of the three measurements as T,℃;
Take the highest value of the three measurements as T2℃;
The softening point of the material is (T1～T2)℃. YYKAONrKAcas
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