SJ 20794-2000 General Specification for Surface Mount Film Fixed Resistor Networks SJ20794-2000 Standard download decompression password: www.bzxz.net

FL5905, Military Standard for Electronic Industry of the People's Republic of China
SJ 20794---2000
General Specification for Surface Mount Film Fixed Resistor Networks
Published on 2000-10-20
Implemented on 2000-10-20
Approved by the Ministry of Information Industry of the People's Republic of China Military Standard for Electronic Industry of the People's Republic of China General Specification for Surface Mount Film Fixed Resistor Networks , Fixed , Film , Surface Mount ,general specificationfor
t.1 Subject Content
This specification specifies the general requirements for surface mount film fixed resistor networks. 1.2 Scope of Application
$J 20794—2000
This specification applies to surface mount film fixed resistor networks (hereinafter referred to as resistor networks) with or without reliability indicators. The resistor network includes hermetically sealed and non-hermetically sealed ones: 1.3 Classification
1.3.1 Model specification
The model specification of the resistor network involved in this specification shall be composed as shown in the following example: RN5161
Nominal resistance of lead terminal Allowable resistance deviation diagram (1.3.1.1) (1.3.1.2) (1.3.1.3) (1.3.1.4) 1. 3. 1. 1 Model
(1.3.1.5)
(1.3.1.6)
Failure Rate Level
(1.3.1.7)
The model is represented by two letters "RN\ followed by four digits. The letters represent the resistor network, the first digit is "5", which means "surface mount", the second and third digits represent the number of leads, and the fourth digit represents the serial number. 1.3.1.2 Characteristics
The characteristics are as specified in Table 1. One letter indicates. Ministry of Information Industry of the People's Republic of China issued TKANrKAca- on October 20, 2000. Implementation on October 20, 2000. Test items. Characteristic code. Resistance temperature characteristic (3.13) 10~/K. Tracking characteristic of reference resistor. Maximum ambient temperature for power consumption (3.6)℃. Maximum ambient temperature for power consumption in season. SJ 20794—2000
Table Characteristics
Maximum resistance change (4R): Earth (
Temperature shock (3.8) and
Power aging (3.9)
Temperature shock (see 3.8)
Low temperature operation (3.14)
Short-term overload (3.15)
Terminal strength (3.17)
Resistance to soldering heat (3.20)
Resistance to moisture (3.21)
Shock [specified pulse) (3 .22）
High frequency vibration（3.23）
Life span（3.24）
High temperature exposure（3.25）
Low temperature storage（3.26）
Steady state damp heat（3.21））
Insulation resistance（3.19）
Resistance tolerance and resistance ratio when applicable Quasi-iodine degree（Table 7）2)
10:000
%R+0.012): Resistance ratio accuracy maximum value(4Ra)0.25
10 000
10 000
10 000
Note: 1) Hermetically sealed resistor network. 2) See 3.10.3.
3) Not applicable,
1.3.1.3 Lead terminals
SJ 20794—-2000
The material of the lead terminals shall be indicated by a letter as specified in Table 2. Table 2 Lead terminals
Tin-lead"
Heat loss 5
Note: 1) The base material of the lead terminals shall meet the requirements of GJB1437—92 "Leads of electronic components". 2) Applicable to resistor networks with leads.
3) See 3.5.6.
Termination type
No lead single side*
No lead wrapped surface*)
With leads 2)
No lead lead coating 4)
No lead single side“)
No lead wrapped surface
With leads?”
No lead lead coating
No lead single side*
No lead wrapped surface”
With leads 2
No lead lead coating“
4) There is a nickel plating layer between the substrate and the outer plating of the lead end, and its thickness is at least 1.27μm. 5) For the code 52 in GJB1437, the maximum thickness of the outer plating is 5μm, which is not applicable. 1.3.1.4 Nominal resistance
The nominal resistance is expressed in ohms () and is expressed in three or four digits: the E12 and E24 series values ​​with two significant digits of nominal resistance are expressed in three digits; the E48, E96 and E192 series values ​​with three significant digits of nominal resistance are expressed in four digits, of which the first two or three digits represent the significant digits of the nominal resistance and the last digit represents the multiplier (multiplier). For the E12 and E24 series, when the resistance is less than 10, and for the E48, E96 and E192 series, when the resistance is less than 100Ω, the letter "R" is used to replace one significant digit and represent the decimal point, and the digits before and after the letter are all significant digits.
The minimum and maximum resistance values ​​shall comply with the regulations (see 3.1). The nominal resistance series adopts the E12, E24, E48, E96 or E192 series in GB/T2471 as shown in Table 3. 3-
iiKAoNrKAca
Permissible resistance deviation
SJ 20794--2000
Nominal resistance series
Nominal resistance series
E1921)
Note: 1) For resistors with permissible resistance deviations of ±0.1% and ±0.5%, any value may be used within the specified resistance range (see 3.1), but it is best to use the E192 series.
1.3.1.5 Permissible resistance deviation
Permissible resistance deviation is indicated by one letter according to Table 4 Table 4 Permissible resistance deviation
1.3.1.6 Simplified diagram
The simplified diagram of the resistor network is indicated by one letter according to the detailed specification (see 3.1). 1.3.1.7 Product grade
Permitted deviation of resistance
Product grade is indicated by a letter according to Table 5. The letter indicates the product grade of the qualified resistor network (see 4.4.4).
The failure rate level of the resistor network with reliability indicators involved in this specification is 1x10-5~1×10-/h. These failure rate levels are based on life tests and are determined with an identification confidence level of 60%. Table 5 Product grade
Product grade code
Referenced documents
5 Pictorial marking for packaging, storage and transportation
GB 191-85
GB/T 2471—1995
Priority number system for resistors and capacitors
Product grade
%/1000h
No quality index
SJ20794-2000
GJB150.10—86Environmental test methods for military equipmentFungus testGJB360A-96Test methods for electronic and electrical componentsGJB546A-96Quality assurance outline for electronic componentsGJB1437-92Leads for electronic components||t t||GJB2118—94 Marking of military electronic components GJB2649—96 Sampling plan and procedure for failure rate of electronic components GJB2712—97 Quality assurance requirements for measuring equipment Metrological confirmation system GJB282397 Method for assessing average quality level of electronic components GJB3014—97 Statistical process control system for electronic components 3 Requirements
3.1 Detailed specifications
The requirements of each resistor network shall comply with the provisions of this specification and the corresponding detailed specifications. When the requirements of this specification conflict with the requirements of the detailed specifications, the detailed specifications shall prevail. 3.2 Qualification appraisalbZxz.net
The resistor network provided in accordance with this specification is a product that has been qualified or approved by the appraisal. 3.3 Quality assurance system
The resistor network provided by the contractor in accordance with this specification shall be appraised and maintained in accordance with the provisions of GJB546A (for all grades of products) and GJB2649 (only for products with reliability indicators). In addition, the contractor shall also comply with 3.3. and 3.3.2. Establish a statistical process control system (SPC system) and a product average quality level assessment method system (PPM system) according to the provisions of GJB546A.
3. 3. 1 SPC system
As part of the quality assurance system established in accordance with GJB546A, the contractor shall establish an SPC system in accordance with GJB3014 (except for special circumstances, such as when the production batch is small or non-continuous production, the SPC system may not be established in accordance with GJB3014 with the approval of the appraisal agency). Typical manufacturing processes using SPC include film formation; cap/lead welding; laser trimming: packaging; final processing of the lead end and welding strength. In addition, the contractor shall also verify the control of the resistance temperature characteristic (RTC) during the processing.
3. 3.2 PPM system
As part of GJB546A, the contractor shall establish a PPM system in accordance with the data exclusion method of GJB2823 and 4.6.4 with the approval of the appraisal agency. At the end of each month, the PPM system shall give the PPM value based on the average value every six months. Each model of product shall be evaluated for DC resistance, and the report shall include the combination of product models with and without reliability indicators.
3.4, Materials
The materials shall comply with the provisions of this specification. However, when no specific materials are specified, materials that enable the resistor network to meet the performance requirements specified in this specification shall be used. The acceptance and approval of any component materials shall not be regarded as a guarantee of acceptance of the finished product.
3.5 Design and Construction
The design, construction and dimensions of the resistor network shall comply with the regulations (see 3.1). Each resistor network shall consist of a film resistor body with lead terminals.
3.5.1 Housing
TKANiKAca-
SJ20794-—2000
The resistor network shall have a good package so that it can withstand the specified environmental tests. There shall be no pores that expose the internal circuit. 3.5.2 Lead terminals
The lead terminals shall be free of contaminants and meet the specified solderability. If the visual inspection meets the requirements, the lead terminals shall be judged to be free of contaminants.
3.5.2.1 Re-tinning of leads
For products provided in accordance with this specification, the contractor may re-tin the lead terminals, but the tinning process must be approved by the appraisal agency.
3.5.2.t.1 Approval of the appraisal agency
The batch of tinning processes shall be carried out in accordance with one of the following provisions: e. When the outer plating of the lead wire that has passed the original appraisal meets the mark No. 52 in GJB1437, the contractor shall re-plate it using the diffuse tinning process used when the product was originally manufactured. b. When the outer plating of the lead wire that was originally qualified does not adopt 3.5.2.1.1a, the tinning process used shall be approved on the basis of the following test procedures:
-30 samples of each model and each type of lead wire outer plating with any resistance value are tinned according to the contractor's tinning process. After tinning, the resistors shall be subjected to DC resistance test (and other electrical tests of Group A), and no defective products are allowed:
-10 of the 30 samples are then subjected to solderability test, and no defective products are allowed. 2 The remaining 20 samples are subjected to humidity resistance test after soldering heat resistance test. 3.5.2.1.2 Selection of tinning (re-tinning) The contractor may select tinning (re-tinning) according to the following regulations: a After the 100% screening test of Group A, a re-tinning test is carried out, requiring 100% electrical measurement of the batch according to Group A1. The allowable value of the percentage defective rate of electrical measurement shall comply with the provisions of Group A1 test. b. If the batch fails the solderability test of Group A, corrective action shall be taken. After the CA group inspection is completed, the batch shall be 100% retested according to the electrical measurements required for the 100% screening test of Group A1 after tinning. The allowable value of the percentage defective rate of electrical measurements shall comply with the provisions of the Group A1 test. After these tests, the contractor shall conduct a Group A solderability test on the batch in accordance with 4.8.6. 3.5.3 Metallization resistance
The metallization resistance of the longest path in the medium resistance network shall not exceed the range specified in Table 6. Table 6 Metallization resistance
Nominal resistance
R≤1000
1000
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