SJ 20642-1997 General specification for semiconductor photovoltaic modules
Some standard content:
Military Standard of the Electronic Industry of the People's Republic of China FL5980
SJ20642-97
General Specification for Semiconductor Opto-electronic Modules
Issued on June 17, 1997
Implemented on October 1, 1997
Approved by the Ministry of Electronics Industry of the People's Republic of China Military Standard of the Electronic Industry of the People's Republic of China General Specification for Semiconductor Opto-electronic Modules
Semiconductor opto-electronic moduleGeneral specificatlon for
1 Scope
1.1 Subject Content
SI 20642-97
This specification specifies the general requirements for semiconductor opto-electronic modules (hereinafter referred to as products). The specific requirements and characteristics of the products are specified in the relevant detailed specifications.
This specification specifies two quality assurance levels for the products, from low to high, M1 and M2. Products with a higher assurance level may replace products with a lower assurance level. 1.2 Scope of application
This specification applies to the development, production and procurement of products. 2 Referenced documents
GB 7408-87
GJR 33 - 85
GJB 128 - 86
GJB 150 - 86
GIB 179 -86
GJB 360 - 87
GIB 546 - 88
GJB 548 - 88
GJB 915 - 90
GJB 1209 - 91
Week number
General specification for discrete semiconductor devices
Test methods for discrete semiconductor devices
Environmental test methods for military equipment
Counting sampling procedures and tables
Test methods for electronic and electrical components
Quality assurance guidelines for electronic components
Test methods and procedures for microelectronic devices
Fiber optic test methods
Test methods and procedures for certification of microcircuit production lines GJB2439-95 Certification requirements for hybrid microcircuit production facilities and production lines GIB2835-97 General specification for microcircuit packaging
3 Requirements
3.1 General
The contractor who supplies goods in accordance with the provisions of this specification shall have or be able to use the production and inspection equipment of other units and shall formulate and implement corresponding product quality assurance guidelines to ensure compliance with all requirements of this specification and relevant detailed specifications. Whether the product meets the requirements of this specification shall be determined by the appraisal agency. Only products that have been tested and meet the requirements of this specification and relevant product detailed specifications can be marked with military inspection marks or certification marks (see 3.5.2.1). 3.1.1 Detailed Specifications
The specific requirements of the product shall comply with the provisions of the detailed specifications. If the source or document is not indicated, the term "as specified" used in this specification refers to the provisions of the relevant product detailed specifications. 3.1.2 Priority
When the requirements of this specification conflict with the requirements of the detailed specifications or relevant documents, the requirements shall be determined in the following order of priority.
a, relevant detailed specifications;
b, this specification;
c. Documents referenced in Chapter 3.
3.2 Qualification
Submitted in accordance with this specification The product should be a qualified product. 3.3 Product Assurance Requirements
Products submitted in accordance with this specification shall comply with the quality assurance provisions of Chapter 4 and be delivered in accordance with the provisions of Chapter 5. 3.3.1 Products supplied in accordance with this specification must have complete design documents, process documents, in-service inspection parts, detailed specifications, inspection and test records before obtaining qualified inspection qualifications. 3.3.2 During the development and production of products, a complete set of quality assurance, management and control systems must be established in accordance with GJB546, which should at least include:
a. Convert user requirements into internal specifications of the contractor b. Training and assessment of staff; c. Inspection of incoming materials, facilities and processed parts; d. Quality control work; e. Quality assurance work; f. Standards and procedures for design, process, rework, tools and materials; g. Purification and environmental control of the work area; h. Maintenance and calibration of tools, gauges and test equipment; i. Analysis and data feedback of failure and non-conforming products; corrective measures and their evaluation; 1. Incoming materials, processed parts and control of the delivery list; m, schematic diagram,
The above system shall be promulgated and implemented in the form of documents, and the implementation status shall be recorded. 3.4 Design, structure and material requirements
The design, structure and materials of products supplied in accordance with this specification shall comply with the provisions of this specification and relevant detailed specifications. 3.4.1 Design
When designing products, the following requirements shall be considered: a, this specification and detailed specifications;
h, actual user requirements;
c, quality information feedback from users of similar products produced by this contractor. 2
SJ 20642 -- 97
3.4.2 Packaging
Products supplied in accordance with this specification shall be packaged in metal; shells shall have the specified airtightness (see Table 5). 3.4.3 Components
Products supplied in accordance with this specification shall use components that meet the requirements of this specification and relevant detailed specifications, and products listed in the QPI table shall be preferred.
Before assembling the product, the components used shall be evaluated according to the component characteristics specified in Article 4.9 and the corresponding detailed specifications or the contractor's documents.
3.4.4 Structure and appearance quality
The structure of the product shall meet the requirements of the relevant detailed specifications. The metal surface of the product shall be free of burrs, cracks or scratches, as well as cavities, bubbles, cracks or sand holes that can be identified by the naked eye. The surface coating must be even, smooth and free of defects, and free of air grooves, peeling and shedding. 3.5 Marking
All types of products shall have markings that meet the requirements of this specification and the detailed specifications. The markings on the product shall be clear and distinct and shall remain clear after all tests. Damage to the markings caused by mechanical test fixtures shall not be used as a basis for batch rejection, but products with damaged markings shall be reworked to ensure that the markings are complete and clear at the time of delivery. Unless otherwise specified, each product shall include the following markings: a. Positioning points (see 3.5.1);
e.g. Product identification number (3.5.2);
, inspection lot identification code (see 3.5.3); d. Product serial number (see 3.5.4);
: laser exit, adjustment position marking (see 3.5.5); f. Contractor name and/or trademark (3.5.6); g. Special marking (see 3.5.7).
3.5.1 Positioning points
The marking points, tabs or other markings for the lead number or the starting position of the mechanical orientation shall be marked as specified, and such markings shall be visible after the product is installed in the normal structure.
3.5.2 Product Identification Number
Each product shall be marked with a product identification number according to the following example. 」or
Military mark or certification mark (3.5.2.1)
3.5.2.1 Military mark or certification mark
Product model (3.5.2.2)
Product grade (3.5.2.3)
Military mark or certification mark (according to the military electronic component quality certification regulations) indicates military products or certified qualified products produced in accordance with the requirements of this specification and relevant detailed specifications. 3.5.2.2 Product model mark
The module model shall be indicated by letters and numbers. 3.5.2.3 Product grade mark
The product grade shall be marked in accordance with the requirements of this specification and relevant detailed specifications. 3.5.3 Inspection batch identification code
The product shall be marked with an inspection batch identification code. The first two digits of the identification code are the last two digits of the year, and the third and fourth digits are the week number of the batch of products submitted for inspection. The week number should comply with CJB7408.3
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3.5.4 Serial number
SJ 20642 97
Serial number is used to distinguish products in a batch for easy tracking. The serial number should be immediately after the inspection batch identification code. 3.5.5 Marking of laser outlet and various interface adjustment parts The laser outlet and various interface adjustment parts shall have obvious markings to explain their functions and ensure safe use. 3.5.6 Name and/or trademark of the manufacturer
The name and/or trademark of the manufacturer shall be marked in accordance with the requirements of this specification and relevant detailed specifications. 3.5.7 Special markings
If special markings are used, they shall not be mixed with other markings required by this specification. 3.5.B Packaging markings
Except for 3.5.4 and 3.5.5, all markings specified in 3.5 and detailed specification numbers shall be marked on the packaging for delivery.
4 Quality assurance provisions
4.1 Inspection responsibilities
Unless otherwise specified, the manufacturer shall be responsible for performing all inspections specified in this specification and detailed specifications. The relevant competent authorities have the right to conduct any inspection specified in this specification and relevant detailed specifications, including performance inspections and inspections on the implementation of product quality assurance plans to ensure that the products meet the requirements of the specifications. 4.2 Procedures for Products Stored for More Than 36 Months
Products that have passed the qualification inspection or quality consistency inspection and have been stored at the manufacturer for more than 36 months shall be re-inspected by the manufacturer before delivery according to the requirements of the full inspection of Group A inspection and the solderability of Group B7. If the re-inspection fails, all products shall be 100% inspected for the unqualified group. Products that do not meet any of the requirements shall be removed from the lot. 4.3 Inspection Classification
The inspections specified in this specification are divided into:
a. Component evaluation (see 4.9);
h. Screening (see 4.10);
c. Qualification inspection (see 4.11);
d. Quality consistency inspection (see 4.12). 4.4 Batch Composition
4.4.1 Production Batch
Products shall be divided into identifiable production batches to meet the requirements of production control and inspection. A production batch shall consist of products of the same model produced on the same production line, using the same materials and components, under different manufacturing technologies and controls. The production batch shall be formed when all preparatory work for product manufacturing is completed or before the first manufacturing process. 4.4.2 Inspection batch
Products shall be organized into inspection batches to meet the quality assurance inspection and test requirements of this specification. The inspection batch shall consist of one or more production batches. The inspection batch shall consist of a certain number of products of one model (Group A inspection) or similar modules of several models (see 6.3.2) (only for Group B, C and D inspection). All products of each inspection batch shall be completed within the same cycle of no more than 13 weeks. The inspection batch shall be traceable and identifiable from its formation to receipt, and its traceability shall start from the formation of the production batch. 4.5 Handling of samples
Products that have undergone destructive tests or failed in a test shall not be delivered as qualified products. If the appraisal or quality consistency inspection is qualified, and the samples have undergone the non-destructive tests specified in 4.5.2 and other tests proved to be non-destructive tests (see 4.5.1) during the inspection, and the characteristics after the test meet the qualification criteria of Group A, they can be delivered as qualified products.
4.5.1 Destructive Tests
Unless otherwise specified, the following tests are all destructive tests at the beginning of the test: Internal visual inspection and mechanical inspection:
Bond strength:
Chip shear strength;
Solderability;
Pigtail, tension load;
Lead firmness.
4.5.2 Nondestructive tests
Unless otherwise specified, the following tests are nondestructive tests: Steady-state life;
Sealing;
External visual inspection;
Aging test;
Physical dimensions:
Particle impact noise detection test:
Solubility resistance;
High temperature test;
Low temperature test;
Low air pressure.
Items specified as screening and Group A inspections in this specification and relevant detailed specifications shall be considered nondestructive. 4.6 Sharp failures caused by equipment failure or operator error When it is determined that a failure is caused by equipment failure or operator error, the sharp failure should be recorded in the test record, which should be kept for reference together with all the information that confirms that such failure should not be considered as unqualified for the product. At this time, samples should be re-taken from the inspection batch of products for all tests of the test group. 4.7 Resubmission of unqualified batches
When any inspection batch submitted for quality assurance inspection does not meet the requirements of any group in the inspection group A, B, C or D, the unqualified inspection group should be resubmitted for inspection after corrective measures are taken according to the cause of the unqualified. The resubmitted batch should be separated from the new batch and can be clearly identified as the resubmitted batch. The re-inspection of group A should be 100%, and the re-inspection of groups B, C and D should be doubled (0 If failures are still found after re-inspection, the batch shall be rejected. If the failure analysis shows that the similar mechanism is caused by some poor workmanship, some basic design error, or a defect that cannot be screened out, the batch shall not be resubmitted.
4.8 Test methods
When the contractor can prove to the certification body that other test methods can be used instead of the test methods specified in this specification without relaxing the requirements of this specification, the alternative test methods may be used with the consent of the certification body. 4.9 Component evaluation
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SJ20642--97
Table 1 specifies a summary of the evaluation of components used in photovoltaic modules. 4.9.1 General requirements
4.9.1.1 Test sequence
The group tests in Tables 2 to 5 can be performed in any order, but the tests in a group should be completed in the specified order.
4.9.1.2 Samples should be randomly selected. The minimum number for evaluation is given in the sample column of Tables 2 to 5, and the corresponding acceptance number is in brackets.
4.9.1.3 Product level requirementsbzxZ.net
The "x\" in the vertical column of the evaluation table indicates that the test is required for this level. 4.9.1.4 Component evaluation location
Component evaluation can be completed at the component manufacturer or at the optoelectronic module manufacturer. 4.9.1.5 Characteristics
The characteristics to be checked should be those required by both the component specifications and the assembly process, and at least those characteristics that cannot be checked after assembly but may cause functional failure. 4.9.1.6 Electrostatic discharge protection
Appropriate precautions and grounding measures should be adopted to prevent electrostatic discharge from causing accidental damage to components. 4.9.1.7 Photoelectric test requirements
Photoelectric test parameters, values, limit values (including ^ values when applicable) and conditions shall comply with the provisions of the applicable detailed specifications or procurement documents.
Table! Component evaluation summary
Components
Microcircuits and semiconductor chips
Passive components
Film-forming substrates
4.9.2 Microcircuits and semiconductor chips
Microcircuits and semiconductor chips include discrete device chips, integrated circuit chips, and optoelectronic device chips. Microcircuits and semiconductor chips should be evaluated according to the requirements of Table 2.
Table 2 Microcircuit and semiconductor chip evaluation requirements
Chip photoelectric test
Chip inspection
! Internal inspection
20731)
GJB 548
Use section
4.9.2.4.2
Stability bake
Temperature cycle
Machine shock
or constant acceleration
Intermediate electrical test
Photoelectric sputtering test after aging
Steady-state life
Final photoelectric test
Wire bonding evaluation
SJ20642-97
Continued Table 2
GJBS48
Scanning electron microscope (SEM)
Radiation test
Dose rate and lock-in
Total dose
Neutron radiation
Note: 1) GJE 128 method.
C, Y, direction
B, Y direction
240h, at least
T/Te=70
Lead 10(0) or
Lead 20(1)
See 2018
referenced sections
4.9.2.4.3
4.9.2.4.3
4.9.2.11 Group 100% chip (optical) electrical test Each chip should be (optical) electrical tested. When the chip is separated from the wafer, if all defective products can be identified and removed, the (optical) electrical test can also be performed on the wafer. At least static testing should be performed at 25°C (for microcircuits, see Group 1 of Table I of GJB548 Method 5005; for semiconductor discrete devices, see Group A 2 of GJB33). 4.9.2.22 Group 100% chip monthly inspection
Each chip should be scanned and should comply with the requirements of GJB548 Method 2010, GJB128 Method 2072 and 2073 and relevant detailed specifications.
4.9.2.3 Evaluation of Packaged Chip Samples
4.9.2.3.1 Test Samples
Samples drawn from each wafer lot shall be evaluated according to Groups 3 to 7 (when applicable) in Table 2 and the provisions of 4.9.3.2 to 4.9.7.2.
4.9.2.3.2 Test Sample Preparation
The test sample shall be sealed into an appropriate package, and the chip assembly method and conditions shall be similar to those during normal assembly. 4.9.2.43 Groups and 4 Groups
4.9.2.4.1 Sample Size
Three chips shall be drawn from each wafer for M2-level products, and at least 10 chips shall be drawn from each wafer lot. For M1 grade products, at least 10 chips shall be taken from each wafer lot
4.9.2.4.2 Internal monthly inspection
Each sample shall be visually inspected after assembly and shall comply with the applicable requirements of GJB548 Method 2010, GJB128 Method 2072 and 2073 and relevant detailed specifications. TTKAONKAa-
4.9.2.4.3 (Photo)electrical test
SJ20642-97
The minimum requirements for intermediate (photo)electrical measurements of microcircuits and semiconductor chips, endpoint (photo)electrical tests after aging and final (photo)electrical tests shall include the following three static tests at different speeds: a. 2st;
Office. c, the minimum rated operating temperature; b. If the end-point (optical) electrical test requirements specified in the burn-in meet the final (optical) electrical test requirements, the final (optical) electrical test does not need to be repeated. 4.9.2.55 Grouping 4.9.2.5.1 Sample size At least 5 chips shall be selected from each batch of products, and at least 10 bonding wires shall be collected as samples. 4.9.2.5.2 Wire bond strength test The requirements for the wire bond strength test are: a. Destructive batch force test shall be conducted on at least 10 bonding wires (including chip to package, chip to chip or chip to substrate bonding). Each chip sample shall test the same number of bonding wires. b. 5 chips shall be tested for wire bonding and flip chip bonding. c. If no failure occurs, the metallization layer of the chip is qualified. If only one bonding wire fails, another sample should be selected according to 4.9.2.5.1 and evaluated in groups. If there is no failure in the second sample, the result of the bonding test is qualified; if the second sample contains one or more failures, or there is more than one failure in the first sample, the batch of chips is rejected.
d, if the failure is not caused by the defect of the chip gold corrosion layer, the rejected wafer batch can be resubmitted and evaluated in groups.
4.9.2.66 Grouping
4.9.2.6.1 Sample selection and rejection criteria
Sample selection and rejection criteria should be in accordance with the requirements of GJB548 Method 2018. 8 chip samples can be randomly selected from each wafer for SEM testing. When there are many chips and the product area is large, the appraisal agency may approve other alternative sample selection plans.
4.9.2.7 Grouping
4.9.2.7.1 Sample size
The sample size for M2-level products is 3 chips per wafer and at least 10 chips per wafer lot. 4.9.2.7.2 Radiation test requirements
When applicable, the product shall be subjected to radiation test
. When the dose rate and lock-in, photocurrent and lock-in effects are related to the circuit structure, they shall be simulated during the test. b. The samples that have completed the dose rate and lock-in tests shall be divided equally into methods 1017 and 1019 of GJB548. 4.9.3 Source components
Each passive component inspection lot shall be evaluated according to Table 3 and 4.9.3.1~4.9.3.6. When the components are purchased according to military specifications with reliable performance indicators in the QPL table, no evaluation is required. 4.9.3.1 Group
Each passive component shall be electrically tested at 25°C as specified in the component procurement documentation. 4.9.3.22 Group
SJ 20642-97
Passive components shall be visually inspected and shall comply with the applicable requirements and detailed specifications including GJB548 Method 2032. a. Each passive component for M2 grade products shall be rechecked. b. Components for M1 grade products shall be sampled and inspected with a sample size (acceptance number) of 22(0). 4.9.3.33 Preparation of test samples for groups and groups 4 Passive component test samples shall be assembled into appropriate packages and the assembly methods and conditions of the components shall simulate the methods and conditions of normal assembly.
4.9.3.4 Electrical testing of passive component samples
Passive component samples shall be tested for the following electrical characteristics at least at 25°C: Resistors: DC resistance.
Capacitors: Ceramic capacitors—Dielectric withstand voltage, insulation resistance, capacitance and dissipation factor. Button capacitors—DC leakage current, capacitance and dissipation factor. Metal insulated semiconductor capacitors—DC leakage current, capacitance, dielectric withstand voltage.
Inductors: DC resistance, inductance and Q value: 4.9.3.5 Visual inspection
Components should be visually inspected to check whether there is corrosion or damage caused by testing and process. 4.9.3.6 Wire bond strength test
In the product assembly process, components using wire bonding should be subjected to bond strength test. The sample should contain at least 10 bonding wires of 5 components.
a. At least 10 bonding wires connecting components to substrates, packages or components should be subjected to destructive tensile test. The number of bond wires tested for each sample should be the same. b. If no failure occurs, the metallization layer of the component should be accepted. If only one bonding wire fails, a second sample should be selected from the components remaining in the evaluation test and tested according to item a above. If there is no failure in the second sample, the results of the bonding test and the component batch can be accepted. If the second sample contains one or more failures, or there is more than one failure in the first sample, the component batch should be rejected. C. If the failure is not caused by a defect in the component metallization layer, the batch of components can be resubmitted for evaluation. Table 3 Passive component evaluation requirements
Complete electrical test
Stability baking
Temperature cycle
Mechanical shock
or constant acceleration
Pressure treatment or
Aging [Capacitor]
Electrical test
Wire bonding evaluation
GJB548
Method clause
B, Y1 direction
A, YL direction
Minimum sample
/Number of acceptances
Wire 10 (0)
or wire 20 (1)
Referenced chapter
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4.9.4 Film substrate evaluation
SJ 20642--97
The film-forming substrates shall be evaluated in accordance with Table 4 and 4.9.4.1 to 4.9.4.5. 4.9.4.1 Composition of inspection batches
The test batch of film-forming substrates used for evaluation shall consist of the same batch of film-forming substrates with the same number of layers and manufactured using the same equipment, process, materials and vacuum deposition, plating or printing technology. 4.9.4.2 Electrical test parameters
The electrical test parameters, values, limits and conditions shall be specified in the applicable detailed specifications or procurement documents. 4.9.4,3 1 Grouping
The detailed specifications or procurement documents shall specify whether each substrate shall be subjected to electrical testing under 25 °C. 4.9.4.4 2 Grouping
Each film-forming substrate shall be self-inspected in accordance with GJB548 Method 2032 and the relevant requirements of the appropriate detailed specifications or procurement documents.
4.9.4.53 Group, 4 and 5 test requirements Each film substrate inspection batch shall be randomly sampled for evaluation. When approved by the purchaser, destructive testing may be completed on test samples that meet the test requirements. The test samples must be made of the same material used to manufacture the test batch and should be processed at the same time as the test batch.
4.9.4.5.13 Group
At least 5 samples must be submitted for the 3-group test. 4.9.4.5.1.1 Physical Dimensions
Inspect in accordance with GJB548 Method 2016 and applicable detailed specifications or procurement documents. 4.9.4.5.1.2 Visual Inspection
Inspect in accordance with G)B548 Method 2032 and applicable detailed specifications or procurement documents. 4.9.4.5.1.3 Electrical Tests
The film-forming substrate shall be electrically tested for at least the following properties at 25°C, and the requirements shall be specified in the applicable detailed specifications or procurement documents.
a: Resistors: DC resistance
b. Capacitors: Capacitance If specified in the applicable detailed specifications or procurement documents, dielectric withstand voltage, insulation resistance and dissipation width tests may be performed.
c: Multilayer substrates: Continuity tests shall be completed to verify the conductor interconnection performance specified in the applicable detailed specifications or procurement documents.
4.9.4.5.2 4 Grouping
At least 3 samples that have been subjected to and passed the 3-grouping test shall be submitted for the 4-grouping test. 4.9.4.5.2.1 Conductor Thickness
Measure the conductor thickness in accordance with the applicable detailed specification. The conductor thickness shall meet the requirements specified in the applicable detailed specification or procurement documents.
4.9.4.5.2.2 Conductor Resistivity
Measure the conductor resistivity in accordance with the applicable detailed specification or procurement documents. The conductor resistivity shall meet the requirements specified in the applicable detailed specification or procurement documents.
4.9.4.5.2.3 Film Adhesion
Complete the film adhesion test in accordance with GJB1209 Method 4500. There shall be no obvious peeling or flaking of the substrate and film. — 10
4.9.4.5.2.4 Solderability
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Substrate solderability testing shall be performed in accordance with the applicable detail specification or procurement document only when specified by the applicable detail specification or procurement document.
4.9.4.5.35 Grouping
A minimum of 2 samples that have been subjected to and passed the 3-grouping test shall be submitted for the 5-grouping test. 4.9.4.5.3.1 Temperature Coefficient of Resistance (TCR) When specified by the detail specification or procurement document, the Temperature Coefficient of Resistance (TCR) test shall be completed in accordance with GJB360 Method 304. The TCR shall meet the requirements specified in the applicable detail specification or procurement document. Thick Film Type: Test at least 2 resistors made of each square resistive paste, namely 1 resistor of the smallest and 1 resistor of the largest area. Test at -55°C and 125°C, with a base temperature of 25°C, or as specified in the detail specification. b, Thin film type: at least test the temperature coefficient of the maximum resistance value. Test at 125℃, the reference temperature is 25, or the temperature specified in the detailed specification or procurement document. If specified in the applicable detailed specification procurement document, the tracking temperature coefficient test shall also be carried out. The tracking temperature c
coefficient shall meet the requirements specified in the applicable detailed specification or procurement document. 4.9.4.5.3.2 Wire bond strength
For substrates with bonded wires, the wire bond strength test shall be completed in accordance with GJB548 method 2011. The sample shall include at least 10 wires from two substrates. For the gold layer of the substrate of M2 grade products, if it is scheduled to be bonded with aluminum wires, the aluminum wires shall be evaluated as specified in the detailed specification or procurement document, and these wire bond samples shall be placed in air or atmosphere gas for 300 °C and 1 h before the wire bond strength test. a. Destructive tensile testing is performed on at least 10 substrate-to-substrate bonding wires. The same number of bonds shall be tested on each substrate sample.
b. If there is no failure, the substrate metallization is acceptable. If one wire fails, a second sample with at least 20 wires shall be tested. The wire type, size and bonding equipment used for this sample shall be the same as those used for the failed sample. If one or more wires fail in the second sample, or more than one wire fails in the first sample, the substrate inspection lot shall be rejected.
c. If the failure is not caused by a defect in the substrate metallization, the substrate inspection lot may be resubmitted for evaluation. 4.9.4, 5.3.3 Die Shear Strength
The die shear strength test is completed in accordance with GJB548 Method 2019. At least two chips shall be bonded and tested on each substrate for each die attach method as specified in the applicable detailed specification or procurement document. If failure occurs at less than the specified force and is not due to a substrate material defect, the lot shall be resubmitted for die shear evaluation and a failure isolation report shall be provided.
HKAONTKAca3 Die Shear Strength
The die shear strength test is completed in accordance with GJB548 Method 2019. For each die bonding method, at least 2 dies shall be bonded and tested on each substrate as specified in the applicable detailed specifications or procurement documents. If failure occurs at a force less than the specified force and is not caused by a defect in the substrate material, the batch shall be resubmitted for die shear evaluation and a failure interruption report shall be provided.
HKAONTKAca3 Die Shear Strength
The die shear strength test is completed in accordance with GJB548 Method 2019. For each die bonding method, at least 2 dies shall be bonded and tested on each substrate as specified in the applicable detailed specifications or procurement documents. If failure occurs at a force less than the specified force and is not caused by a defect in the substrate material, the batch shall be resubmitted for die shear evaluation and a failure interruption report shall be provided.
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