GB/T 4588.12-2000 Specification for prefabricated inner layer laminates (semi-finished multilayer printed boards)
Some standard content:
GB/T4588.12—2000
This standard is equivalent to IEC60326-12:1992 "Prefabricated inner layer laminate (semi-finished multilayer printed circuit board)". The prefabricated inner layer laminate covered by this standard has been widely used in the international printed circuit board industry. It is a semi-finished product of multilayer printed circuit boards. Its main characteristics are large production volume and low cost. It is particularly suitable for multilayer printed circuit boards with few varieties and large batches. Appendix A of this standard is the appendix of the standard.
This standard is proposed by the Ministry of Information Industry of the People's Republic of China. This standard is under the jurisdiction of the National Technical Committee for Printed Circuit Standardization. This standard was drafted by the North China Institute of Computing Technology. The main drafters of this standard are: Chai Yongmao, Zhang Chunting, and Liu Yun. GB/T4588.12—2000
IEC Foreword
1) Formal resolutions or agreements of the EC (International Electrotechnical Commission) on technical issues are made by technical committees in which national committees with special concerns about these issues participate, and represent the international consensus on the issues involved as far as possible. 2) These resolutions or agreements are provided for international use in the form of recommended standards and are recognized by national committees in this sense. 3) In order to promote international unification, IEC hopes that national committees will adopt the text of IEC standards as their national standards if national conditions permit. Differences between IEC standards and corresponding national standards should be pointed out in national standards as far as possible. This standard was prepared by IEC Technical Committee 52 (Printed Circuits). The text of this standard is based on the following documents: Six-month method
52(CO)367
Voting report
52(CO)382
Voting details of this standard can be found in the voting report listed in the table above. The content of Appendix A is for information only.
IEC Introduction
IEC 60326 deals with printed boards intended for mounting components, regardless of their method of manufacture. This standard is divided into several independent parts, including information for designers, recommendations for specification developers, and test methods and requirements for various types of printed boards (such as single-sided, double-sided, multilayer and flexible printed boards). 1 Scope
National Standard of the People's Republic of China
Specification for prefabricated inner layer laminates
(Semi-manufactured multilayer printed boards)
Specification for laminate panels (semi-manufactured multilayer printed boards) GB/T 4588.12—2000
idtIEC 60326-12:1992
This standard applies to prefabricated inner layer laminates. It specifies the characteristics of prefabricated inner layer laminates, regardless of their method of manufacture, and is intended to serve as the basis for an agreement between the supplier and the purchaser. The term "relevant specifications" used in this standard refers to these agreements. 2 Referenced standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and the parties using this standard should explore the possibility of using the latest versions of the following standards. GB/T12629—1990
Thin copper-clad epoxy glass cloth laminate with limited flammability (for manufacturing multilayer printed boards) (idtIEC60249-2-121987)
GB/T4588.3—1988 Design and use of printed circuit boards (neqIEC60326-3:1980) GB/T4588.4—1996 Sectional specification for multilayer printed boards (idtIEC/PQC91:1990) GB/T18334—2001 Specification for flexible multilayer printed boards with through connections (idtIEC60326-9:1 991) GB/T18335—2001
1 Specification for rigid-flex multilayer printed boards with through connections (idtEC60326-11:1991) SJ/T10723—1996
6 Printed board auxiliary standards - Part 3: Photographic plate guide (neqIEC60321-3:1990) IEC60326-2:1990
Printed boards - Part 2: Test methods
3 General
3.1 Prefabricated inner layer laminateswww.bzxz.net
Printed boards are printed circuits made into a single piece for end users. Prefabricated inner layer laminates consisting of one or more printed boards are finished products ordered from prefabricated inner layer laminate factories. Prefabricated inner layer laminate factories have the ability to mass-produce multilayer boards in batches, thereby saving costs. This standard refers to this type of batch. Prefabricated inner layer laminates are an intermediate production stage of multilayer printed boards. At this stage, the inner layers have been processed and the conductive and insulating layers are alternately laminated to form a finished board. The two outer conductor layers are not processed by the prefabricated inner layer laminate factory, but are drilled and processed by the ordering party. Prefabricated inner layer laminates are semi-finished products used to make multilayer printed boards. Therefore: - They are finished boards consisting of one or several printed boards and insulating layers, with an inner conductor layer, an insulating layer, and two outer layers of the insulating layer without etched copper foil layers, etched according to the data provided by the ordering party, and accurately overlapped. - They are laminated from a stack of single-sided or double-sided etched copper foil substrates, prepreg materials and copper foil. - They include a positioning system that ensures that drilling is carried out in exact overlap with the inner conductor layers. They may have interconnections between the inner conductor layers (buried holes), but not with the outer conductor layers. 3.2 Construction of prefabricated inner layer laminates
State Administration of Quality and Technical Supervision 2000-12-11 batch 2001-06-01 implementation
GB/T4588.12-2000
Usually, the board, printed board and conductor pattern have the same reference axis in the same direction, and the reference points of the printed boards and their conductive patterns are the same. In this case, the prefabricated inner layer laminates should be specified as follows: - The relevant specifications should specify the reference of each etched layer conductor pattern. The position of each printed board on the board is determined by the coordinates of the reference point of the printed board and indicated in the drawings of the relevant specifications (see Figure A4).
If one or more printed boards are positioned differently (rotated or flipped), the drawings of the relevant technical specifications should provide this positioning, indicating the reference axis of each printed board, the X, Y coordinate relationship relative to the board on the board and the X, Y coordinate relationship relative to a printed board (see Figure A5). 3.3 Datum of each layer
The ordering party shall indicate the datum plane and number each conductor layer in accordance with its position in the finished multilayer printed board (see Figure A1). 3.4 Datum plane
The datum plane shall be indicated on each printed board by an eccentric hole or offset slot and specified in the relevant specification. 3.5 Reference datum - positioning system for drilling holes To avoid unclear definitions, reference datums must be specified on the printed board of the prefabricated inner layer laminate, on each printed board of the board, and on all documents describing the conductive layer.
The reference datum is used to specify the precise position of certain specific points of the printed board (such as the center of the pad on the conductive pattern, the hole on the printed board, etc.) on the printed board of the prefabricated inner layer laminate. Examples of reference datums are given in SJ/T10723-1996. The datum point of the printed board on the prefabricated inner layer laminate is the intersection of the two datum axes of the printed board. The coordinates of the datum point shall be specified in the drawings of the relevant specifications.
By agreement between the purchaser and the supplier, the coordinates of the reference points of the printed board on the production board may be modified to be different from the values provided in the drawing, but the coordinates of the same batch of production boards shall be the same. In this case, the ordering party must provide applicable coordinates for each batch. These deviations from the drawing coordinates are used to correct the displacement of certain conductive patterns and the values are very small (a few hundredths of a millimeter). When a modification is agreed, it must be marked in the drawing of the relevant specification (such as with the symbol "F" next to the letters X and Y representing the coordinate axes, see Figure A4). 3.6 Dimension compensation
Taking into account the displacement of the conductive pattern, by agreement between the purchaser and the supplier, dimensional compensation can be made using a photographic plate. 3.7 Marking
Prefabricated inner layer laminates that comply with this standard shall have the following markings: - Relevant specification number;
- Purchaser and supplier
--Marking of the board in production in the ordering party's code. Based on this identification and marking, the contractor shall ensure the traceability of the prefabricated inner layer laminate. 4 Technical description document
4.1 Overview
The technical description document shall consist of all documents (handwritten or computer data) that give the characteristics of the prefabricated inner layer laminate. According to this standard, it shall include:
--Relevant specifications (see 4.2 and Appendix A);--Documents providing conductive patterns (see 4.3);--Documents providing mechanical processing data for printed boards: drilling diagram, hole list, milling outline drawing (see 4.4);--Marking instructions (see 4.5);
-Packing instructions (see Chapter 6);
Special requirements of the ordering party.
This document shall be developed by negotiation between the supplier and the buyer and shall be in accordance with the technical capabilities of the contractor. This document shall be detailed, rigorous, and represented by data and 2
(or) appendices.
4.2 Relevant specifications
GB/T4588.12-2000
The relevant detailed specifications shall provide all the regulations and information required for the production of printed boards. The details listed in Appendix A shall be specified. 4.3 Documents providing conductive patterns
The conductive pattern shall be determined by photographic plates or computer data suitable for automatic photoplotters. In each case, the document shall clearly provide the reference datum of the conductive layer and the reference datum of the printed board on which it is located. The document shall also give the coordinate axes of this conductive pattern (see 3.5). If the conductive pattern is provided by a photographic plate, the quality of the file shall comply with SJ/T10723-1996 or the agreement reached between the supplier and the buyer. 4.4 Subsequent mechanical processing documents
It is necessary for the contractor to understand the subsequent mechanical processing to be performed by the ordering party. For example: - the diameter and position of the plated hole;
- the milling holes and positioning holes required for processing multi-layer printed boards. 4.5 Marking instructions for the board
The marking instructions include the composition of the marking code, the type of marking (such as printing material, etching, label) and the position of the marking. The marking on the board (on one side) should be used to identify:
- an offset groove or positioning hole;
- the relevant specification number:
- the direction of the glass cloth;
- the manufacturing date (or the reference date of the production batch). By agreement between the purchaser and the supplier, the marking of the panels may include a mark indicating the name of the contractor, which can still be clearly seen after etching and milling, and may also include dimensional compensations that vary from batch to batch. 5 Characteristics of prefabricated inner layer laminates
5.1 Specific characteristics and preferred values
These characteristics are specific to specific prefabricated inner layer laminates. They are controlled during the manufacturing process, evaluated after manufacturing, and the values of these characteristics are provided in the relevant specifications. This standard specifies preferred values and deviations for certain characteristics for the purpose of standardization and agreement between the purchaser and the supplier. Different tolerances are specified according to different manufacturing methods, the difficulty of manufacturing specific panels and the needs of the ordering party. These characteristics should be obtained from GB/T4588.31988, GB/T4588.41996, GB/T18334-2001 or GB/T18335-2001, for example:
- The preferred deviation of the length and width of the board
is: ±2mm, ±1mm or ±0.5mm; - The preferred value of the deviation of the verticality of the edge of the board
is: ±2.5mm/m or ±1.5mm/m - The thickness of the board (including the outer copper)
is ±15% if the board thickness is <1.0mm. If there is a plug, the preferred tolerance of the board thickness in the plug area is ±10%, - Flatness (bow and twist)
The preferred tolerance for symmetrical structures and even-numbered layers is +0.5% bow and twist, and the asymmetrical structure and (or) odd-numbered layers is +1% bow and twist;
- Misalignment between conductive patterns
The misalignment between different layers should not exceed the following values: 0.10mm for board length and width <300mm;
0.20mm for board length and width >300mm.
Preferred tolerance: 0.10mm,
- Surface treatment of outer copper
GB/T4588.12-2000
The surface treatment should comply with the provisions of the GB/T12629-1990 series of standards. 5.2 General properties
The base materials (such as thin copper-clad laminates, prepreg materials, copper foil) used to make prefabricated inner layer laminates shall comply with the relevant IEC specifications. Because prefabricated inner layer laminates are used to make multi-layer printed boards, they should have all the characteristics of multi-layer printed boards as described in GB/T4588.4-1996, GB/T18334-2001, and GB/T18335-2001. When it is not possible to add a test coupon to the prefabricated inner layer laminate, it should be agreed upon by both the supplier and the buyer. Prefabricated inner layer laminates should be processed using a method that maintains consistent quality and show no visible dust, foreign matter, grease, fingerprints and other contamination that affects life, assembly performance and performance. Prefabricated inner layer laminates should be free of defects not allowed by this specification. The items specified in Table 1 should be used for inspection. If the prefabricated inner layer laminate has plated-through holes, they shall comply with the requirements for plated-through holes specified in GB/T4588.4-1996, GB/T18334-2001 or GB/T18335-2001. Table 1 Characteristics
Visual inspection and dimensional inspection
Conformity and marking
Appearance and processing quality
Board thickness in plug area
Electrical performance test
Insulation resistance of the same layer (acceptance state)
Interlayer insulation (acceptance state)
Withstand voltage test (when required)
Mechanical test
Flatness
Thermal shock delamination
Note: Coupon test board is under consideration.
Test number in EC60326-2
*or GB/T18334-2001 or GB/T18335-2001. 5.3 Other characteristics to be tested
During or after production, the following characteristics should be tested: - No serious etching defects in the inner layer;
See GB4588.4*
See GB4588.4*
See GB4588.4°
Preferred value ≥500MQ
Preferred value ≥500MQ
|See GB4588.4
Test Coupon
Test Coupon
Test Coupon
Test Coupon
Test Coupon
According to IEC60326-2 test 4a, 4b and (or) optical method, the inner conductive pattern should be free of short circuit and open circuit; the position accuracy and overlap accuracy of the conductive pattern; the specified tolerance of thickness, size and edge verticality; the specified tolerance of the diameter and position of the positioning hole (including offset groove); the specific tolerance of bow and twist;
-the quality of buried holes (when applicable);
Consistency of marking and packaging.
If the supply and demand parties agree, a detailed test report can be attached to each batch of delivery. 6 Packaging
There can only be one batch in each package, and the same batch of boards should be produced under the following conditions: in the same lamination cycle;
-If there is a floating zero point, the coordinates of the reference points of the printed board should have the same correction value (when necessary). The packaging should be able to fully protect the boards to prevent distortion, moisture absorption or other possible damage during transportation. The number of boards in each package should be 4
according to the agreement between the supplier and the buyer.
The following marks should be on the package:
-Relevant specification number;
-Manufacturing date and production batch;
Name or code of the contractor;
-Number of boards in the package.
GB/T4588.12—2000
Relevant detailed specifications:
a) Use digital representation;
b) Provide the names of the supplier and the buyer;
c) The structure of the board should be explained.
1) Number of printed boards on the board;
2) Number of layers;
3) Position of minor components;
4) Thickness of insulating layer and copper layer;
5) Number of each layer (see 3.2).
d) The characteristics of the printed board should be provided:
1) File description for generating conductive patterns;
GB/T4588.12—2000
Appendix A
(Appendix to the standard)
Related detailed specifications
2) Characteristics of conductive patterns (ground layer, mixed layer, signal layer, etc.); 3) Length and width dimensions of the printed board, grid for drilling, and reference datum for drilling and milling. e) The following should be provided:
1) The reference axis and positioning data for drilling holes in accordance with 3.5 (from the reference surface of the drilling hole, see 3.4); 2) The position (shape) of the printed board, indicated by letters or reference numbers using the method of 3.2 when necessary. f) The following should be provided in the drawing:
1) The dimensions of the printed board (nominal values with tolerances) (see 5.1); 2) The allowable deviations of the following values (see 5.1). —Verticality of board edge;
-Bow and twist;
-Position of conductive pattern;
-Overlap of conductive pattern.
g) If necessary, the following should also be provided:
1) Characteristics of offset groove or positioning hole:
2) Line width of photographic plate and inner line width of prefabricated inner layer laminate after side etching. This factor is used to control the impedance of prefabricated inner layer laminate in order to design better wiring; 3) Marking description;
4) Packaging description;
5) Special requirements of the ordering party;
6) Any other information that may be useful (milling cutter diameter, number of boards in each batch, etc.). The detailed specifications on the number of layers, the composition of the boards in production, etc. can be represented by the following legend. 6
Prefabricated inner layer laminate
Ordering party
For identification
For manufacturing
A simple example is as follows
Number of printed boards for each board in production
Printed board number
Conductive pattern
0口口
口口口
日口口
口a口
口口口
口口口
口口C
Printed board length: 土...mm
Printed board width, ±..mim
Grid:
Drilling reference datum:
Milling datum,
GB/T4588.12—2000
GB/T 4588.12
Contractor
As a suggestion
As an agreement
Other examples
Copper box thickness
No.:
Related specifications
Board number
Insulation layer thickness
*Indicates the thickness of the insulation layer after lamination.
Total thickness including outer box. mm
Figure A1 Prefabricated inner laminate (Example 1)
Drawing of the board in process observed from the drilling reference plane Length of the board in process:
Width of the board in process:
Verticality:
Bending and twisting:
Position tolerance:
Superposition tolerance:
GB/T4588.12—2000
GB/T4588.12
Drawing of the board in process
No.:
Related regulations Model
Boards in process of prefabricated inner layer laminate
Number of panels for each board in process
Printed board number
Conductive pattern
GB/T4588.12—2000
GB/T4588.12
Printed board number
Conductive pattern
Figure A3 Prefabricated inner layer laminate (Example 2)
No.:
Related specifications
Board number
Thickness of copper foil
Thickness of insulating layer
*Reference point of the printed board.
No.: 1
X=—108
X=-108
GB/T4588.12—2000
Benchmarks in process
Figure A4 Example of prefabricated inner laminate
Schematic diagram of photographic plate
Example of the same printed board, possibly floating zero point F
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