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GB 4724-1992 Copper-clad epoxy paper laminate for printed circuits

Basic Information

Standard ID: GB 4724-1992

Standard Name: Copper-clad epoxy paper laminate for printed circuits

Chinese Name: 印制电路用覆铜箔环氧纸层压板

Standard category:National Standard (GB)

state:in force

Date of Release1992-07-08

Date of Implementation:1993-04-01

standard classification number

Standard ICS number:Electronics >> 31.180 Printed circuits and printed circuit boards

Standard Classification Number:Electronic Components & Information Technology>>Electronic Components>>L30 Printed Circuit Board

associated standards

alternative situation:GB 4724-1984

Procurement status:≈IEC 249-2-87

Publication information

publishing house:China Standards Press

other information

Release date:1984-10-20

Review date:2004-10-14

drafter:Lin Zhenru

Drafting unit:Guangzhou Electrical Science Research Institute of the Ministry of Machinery and Electronics Industry

Focal point unit:Guangzhou Electrical Science Research Institute of the Ministry of Machinery and Electronics Industry

Proposing unit:Ministry of Machinery and Electronics Industry of the People's Republic of China

Publishing department:State Bureau of Technical Supervision

competent authority:Ministry of Information Industry (Electronics)

Introduction to standards:

This standard specifies the electrical, mechanical and other performance requirements of copper-clad epoxy paper laminates for printed circuits. This standard applies to copper-clad laminates made of cellulose paper impregnated with epoxy resin, with or without alkali-free glass cloth on both sides, and copper foil on one or both sides, which are made by hot pressing. Hereinafter referred to as foil-clad laminates GB 4724-1992 Copper-clad epoxy paper laminates for printed circuits GB4724-1992 Standard download decompression password: www.bzxz.net

Some standard content:

UDC621.316.616-415:621.3.049.75190
National Standard of the People's Republic of China
GB/T4721-472292
GB 4723~-4725—92
Copper-clad laminated sheets for printed circuits
Copper-clad laminated sheets for printed circuits
Published on July 8, 1992
National Technical Supervision Bureau
Implemented on April 1, 1993
National Standard of the People's Republic of China
Epuride cellulose paper copper-clad laminated sheets for printed circuits
GB 4724—92
Replaces GB24—81
This standard adopts the International Electrotechnical Commission standard IEC2492 (193V> metal-coated substrates for nanocircuits, Part 1: Standards for the design of corresponding types of circuits.
1 Subject matter and scope of application
This standard specifies the electrical, mechanical and other performance requirements of copper foil epoxy laminates for printed circuits. This standard is used to make standard laminates (hereinafter referred to as laminates) that are wetted with epoxy resin on the fiber end, with or without glass fiber reinforced plastic on both sides, and are heat-treated and laminated. 2 References to the international standard
GB/T4721 Printed Circuit Boards The copper foil laminate is applicable to GB/T4722 Test method for printed circuit board iB=230 copper foil
3 Product classification
3.1 Type characteristics
The main specifications and properties included in this standard are shown in Table 1. Table:
LHFP-ZRFt.
CIPCP(G)-23T
1) CEPCP-22F or 242FV type
CEPCP(C)3F or IF24F
3.2 Materials and structures
The board is made of copper foil on one side or both sides. 3.2.1 Insulation base material
Electrical insulation laminate with epoxy resin as binder, fiber support paper and fiber support paper and cloth as reinforcement material. 3.2.2 Foil
The electrolytic steel mold used for the accompanying board shall comply with the technical requirements of 5230. 3.3 Product marking
The product marking shall comply with the provisions of GB/T4721, Section 12.1. Approved by the State Bureau of Technical Supervision on July 8, 1992 and implemented on April 1, 1993
4 Technical requirements
4.1 Electrical properties of the cladding board
\GB4724-92
The cladding board should have the electrical properties listed in Table 2, Table 2
The foil is not too thick, M0 is not too thin, the copper surface resistance is not too thin, M is not too thin, the surface resistance ... |tt||Bed resistance level, M gate·m
not less than
constant wet and cold treatment
for use)
after fixed wet and hot treatment recovery
at 1 hour
constant cooling treatment recovery medium
and effective
my thickness is 0.7mm
resistance to fixed wet and hot treatment recovery medium
topology loss factor is taken
meter circle distance
side parameter level
positive not inferior to
negative not inferior to
formula risk method
tiHF 4722—92
in the hope
20 600
:1) CECP (G5-23F type as standard, the dielectric thickness of the base should be smaller than the nominal thickness. 4.2 Non-electrical end of the foil board
4.2.1 Appearance
4.2.1.1 Appearance
The end surface of the foil board should be neat and free of delamination and cracking. CEPCP (G)
Here is the non-corrosive material| |tt||The laminated surface is not allowed to have bubbles, wrinkles, pinholes, deep scratches, pits and glue spots that affect the use. Any discoloration or dirt can be removed by replacing the hydrochloric acid solution with a concentration of 1.02g/cm* or a suitable organic solvent. The laminated surface is not allowed to have defects such as bubbles, pits, scratches, lack of glue and foreign impurities that affect the use. 4.2.7.2 High-quality mother surface appearance (for selection) CR 4724-92wwW.bzxz.Net
When the purchaser has requirements for the appearance of high-quality mother surfaces, the supplier and the customer can negotiate to add this item. The requirements shall be in accordance with Article 6.2 of CR 4721.
4. 2. 2 4.2.2.1 The recommended nominal area and deviation of the panel board shall comply with the provisions of Table 3. Table 3 recommends standard (x more) and guarantees that if there are any differences, the supply and demand parties can negotiate and make adjustments. 4.2.2.2 The nominal thickness and single point deviation shall be tested according to GB/T4722 No. 23. The value shall comply with Table 3. The single point deviation shall be tested according to GB/T4722 No. 23. The value shall comply with Table 3. The non-nominal thickness shall be manufactured by the supply and demand parties through negotiation. The deviation shall be based on the thickness. The most effective way to implement it is to test the verticality of the pump foil according to the 24th test of GB/T4722. Its value is in accordance with the requirements of Table 5. Table 5: 000X1000X1200X14.2.4 Curvature: The curvature and distortion values ​​of the solidified board shall be tested according to Chapter 14 of GB/T4722. When the box board is changed to = 1090mm, the value shall not exceed the requirements of Table 6. Each thickness shall be above 1.6 and above 3.2. 472492
Double pressure plate
70 jrm
CEPP(G)
Single or effective
Twisted d
Double and shoe
CEFCPIG?
Note: The maximum phase bending requirement is only for single tubes. The size and g of the cut are not less than m. This table is applicable to the same year standard. 4.2.5 Other non-electrical
Foil plate should comply with the table? The dead place must be non-electrical performance, table
relocation method
method Yue Qianghu,
index name
color separation sequence, V:mm
5man card after
10report right clean
35m steel file
piece 3 pin sink
uu blue after
1am adjustment
to three-think system gas after
35m wave road
12yr.Frequency sink
natural resistance electrical connection system after treatment
survivability "3
moisture test
plate call 0. 5 mm to 1. 6 mm
recovery1. 6 m to 6. 4m
GB/T 4722--92
inspection
not distinguishing the end, not starting
CEPCP(G)
not distinguishing the original, not setting standards
honorary name
card inquiry test
CB4724-92
light table?
test guide station
13/3 4722-99
Note: 11 The use of agents other than trichloroethylene can be negotiated by both parties, L:F:PCP
according to the agreement of the supplier
21 When the full-scale board is greater than 70m and the board is greater than 6.4m, the wetting and wetting are determined by the supplier. 4.3 After all the residual materials are removed, the non-electrical properties of the base material are 4.3.1. The base material is not allowed to have any impurities that affect the use of the material (including the assimilated wood fetus), the color is uniform, and a small amount of color change is allowed. 4.3.2 According to the provisions of G/14722 English Chapter 3, after all the copper foil is removed, the performance of the insulation material shall meet the requirements of Table 8. 1.6 ran
Flammability, Grade
Note
Water absorption·
I. 2 mr..
Not less than
GH/T-4T22
|Note:) Thickness is the actual average value, non-circular thickness, can be the largest value of the first level of navigation. 5 Inspection rules
Inspection rules should be in accordance with GM/T4721 Chapter 1U regulations:
6 Marking, packaging, transportation and storage
GB 4724-92
Marking, packaging, transportation and storage should be in accordance with GB/T4721 Chapter 11 regulations, additional instructions:
This standard was proposed by the People's Republic of China Kaihui Electronic Industry Bank, this standard is under the jurisdiction of the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry, and this standard is under the responsibility of the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry. The main drafter of this standard is Lin Hairu.
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