This standard specifies the electrical, mechanical and other performance requirements of copper-clad epoxy paper laminates for printed circuits. This standard applies to copper-clad laminates made of cellulose paper impregnated with epoxy resin, with or without alkali-free glass cloth on both sides, and copper foil on one or both sides, which are made by hot pressing. Hereinafter referred to as foil-clad laminates GB 4724-1992 Copper-clad epoxy paper laminates for printed circuits GB4724-1992 Standard download decompression password: www.bzxz.net
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UDC621.316.616-415:621.3.049.75190 National Standard of the People's Republic of China GB/T4721-472292 GB 4723~-4725—92 Copper-clad laminated sheets for printed circuits Copper-clad laminated sheets for printed circuits Published on July 8, 1992 National Technical Supervision Bureau Implemented on April 1, 1993 National Standard of the People's Republic of China Epuride cellulose paper copper-clad laminated sheets for printed circuits GB 4724—92 Replaces GB24—81 This standard adopts the International Electrotechnical Commission standard IEC2492 (193V> metal-coated substrates for nanocircuits, Part 1: Standards for the design of corresponding types of circuits. 1 Subject matter and scope of application This standard specifies the electrical, mechanical and other performance requirements of copper foil epoxy laminates for printed circuits. This standard is used to make standard laminates (hereinafter referred to as laminates) that are wetted with epoxy resin on the fiber end, with or without glass fiber reinforced plastic on both sides, and are heat-treated and laminated. 2 References to the international standard GB/T4721 Printed Circuit Boards The copper foil laminate is applicable to GB/T4722 Test method for printed circuit board iB=230 copper foil 3 Product classification 3.1 Type characteristics The main specifications and properties included in this standard are shown in Table 1. Table: LHFP-ZRFt. CIPCP(G)-23T 1) CEPCP-22F or 242FV type CEPCP(C)3F or IF24F 3.2 Materials and structures The board is made of copper foil on one side or both sides. 3.2.1 Insulation base material Electrical insulation laminate with epoxy resin as binder, fiber support paper and fiber support paper and cloth as reinforcement material. 3.2.2 Foil The electrolytic steel mold used for the accompanying board shall comply with the technical requirements of 5230. 3.3 Product marking The product marking shall comply with the provisions of GB/T4721, Section 12.1. Approved by the State Bureau of Technical Supervision on July 8, 1992 and implemented on April 1, 1993 4 Technical requirements 4.1 Electrical properties of the cladding board \GB4724-92 The cladding board should have the electrical properties listed in Table 2, Table 2 The foil is not too thick, M0 is not too thin, the copper surface resistance is not too thin, M is not too thin, the surface resistance ... |tt||Bed resistance level, M gate·m not less than constant wet and cold treatment for use) after fixed wet and hot treatment recovery at 1 hour constant cooling treatment recovery medium and effective my thickness is 0.7mm resistance to fixed wet and hot treatment recovery medium topology loss factor is taken meter circle distance side parameter level positive not inferior to negative not inferior to formula risk method tiHF 4722—92 in the hope 20 600 :1) CECP (G5-23F type as standard, the dielectric thickness of the base should be smaller than the nominal thickness. 4.2 Non-electrical end of the foil board 4.2.1 Appearance 4.2.1.1 Appearance The end surface of the foil board should be neat and free of delamination and cracking. CEPCP (G) Here is the non-corrosive material| |tt||The laminated surface is not allowed to have bubbles, wrinkles, pinholes, deep scratches, pits and glue spots that affect the use. Any discoloration or dirt can be removed by replacing the hydrochloric acid solution with a concentration of 1.02g/cm* or a suitable organic solvent. The laminated surface is not allowed to have defects such as bubbles, pits, scratches, lack of glue and foreign impurities that affect the use. 4.2.7.2 High-quality mother surface appearance (for selection) CR 4724-92wwW.bzxz.Net When the purchaser has requirements for the appearance of high-quality mother surfaces, the supplier and the customer can negotiate to add this item. The requirements shall be in accordance with Article 6.2 of CR 4721. 4. 2. 2 4.2.2.1 The recommended nominal area and deviation of the panel board shall comply with the provisions of Table 3. Table 3 recommends standard (x more) and guarantees that if there are any differences, the supply and demand parties can negotiate and make adjustments. 4.2.2.2 The nominal thickness and single point deviation shall be tested according to GB/T4722 No. 23. The value shall comply with Table 3. The single point deviation shall be tested according to GB/T4722 No. 23. The value shall comply with Table 3. The non-nominal thickness shall be manufactured by the supply and demand parties through negotiation. The deviation shall be based on the thickness. The most effective way to implement it is to test the verticality of the pump foil according to the 24th test of GB/T4722. Its value is in accordance with the requirements of Table 5. Table 5: 000X1000X1200X14.2.4 Curvature: The curvature and distortion values of the solidified board shall be tested according to Chapter 14 of GB/T4722. When the box board is changed to = 1090mm, the value shall not exceed the requirements of Table 6. Each thickness shall be above 1.6 and above 3.2. 472492 Double pressure plate 70 jrm CEPP(G) Single or effective Twisted d Double and shoe CEFCPIG? Note: The maximum phase bending requirement is only for single tubes. The size and g of the cut are not less than m. This table is applicable to the same year standard. 4.2.5 Other non-electrical Foil plate should comply with the table? The dead place must be non-electrical performance, table relocation method method Yue Qianghu, index name color separation sequence, V:mm 5man card after 10report right clean 35m steel file piece 3 pin sink uu blue after 1am adjustment to three-think system gas after 35m wave road 12yr.Frequency sink natural resistance electrical connection system after treatment survivability "3 moisture test plate call 0. 5 mm to 1. 6 mm recovery1. 6 m to 6. 4m GB/T 4722--92 inspection not distinguishing the end, not starting CEPCP(G) not distinguishing the original, not setting standards honorary name card inquiry test CB4724-92 light table? test guide station 13/3 4722-99 Note: 11 The use of agents other than trichloroethylene can be negotiated by both parties, L:F:PCP according to the agreement of the supplier 21 When the full-scale board is greater than 70m and the board is greater than 6.4m, the wetting and wetting are determined by the supplier. 4.3 After all the residual materials are removed, the non-electrical properties of the base material are 4.3.1. The base material is not allowed to have any impurities that affect the use of the material (including the assimilated wood fetus), the color is uniform, and a small amount of color change is allowed. 4.3.2 According to the provisions of G/14722 English Chapter 3, after all the copper foil is removed, the performance of the insulation material shall meet the requirements of Table 8. 1.6 ran Flammability, Grade Note Water absorption· I. 2 mr.. Not less than GH/T-4T22 |Note:) Thickness is the actual average value, non-circular thickness, can be the largest value of the first level of navigation. 5 Inspection rules Inspection rules should be in accordance with GM/T4721 Chapter 1U regulations: 6 Marking, packaging, transportation and storage GB 4724-92 Marking, packaging, transportation and storage should be in accordance with GB/T4721 Chapter 11 regulations, additional instructions: This standard was proposed by the People's Republic of China Kaihui Electronic Industry Bank, this standard is under the jurisdiction of the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry, and this standard is under the responsibility of the Guangzhou Electric Science Research Institute of the Ministry of Machinery and Electronics Industry. The main drafter of this standard is Lin Hairu. Tip: This standard content only shows part of the intercepted content of the complete standard. 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