Encapsulation materials of phenolic series for use in electronic components
Some standard content:
ICS31-030
Record number: 695-1997
Electronic industry standard of the People's Republic of China
SJ/T11126-1997
Encapsulation materials of phenolic seriesfor use in electronic components
Issued on September 3, 1997
Implemented on January 1, 1998
Ministry of Electronics Industry of the People's Republic of China
Issued on March 3
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This standard is formulated to meet the needs of phenolic series dip coating encapsulation materials for electronic components. Since there is no corresponding international standard to follow, this standard is based on the data and experience accumulated by major domestic production and use units for many years in terms of technical indicators and test methods, and refers to the main technical parameters of Japan PR-16382. It has certain advancement and mature implementation conditions. This standard is written in accordance with GB/T1.1-1993<Guidelines for Standardization Work Unit 1: Rules for Drafting and Presentation of Standards Part 1: Basic Regulations for Standard Writing. The test methods involved are as far as possible adopted from the published national industry standards.
Appendix A of this standard provides two types of wet sample preparation that are consistent with the actual use status and easy-to-operate dry sample preparation. Appendix A of this standard is the appendix of the standard.
This standard is under the jurisdiction of the Standardization Research Institute of the Ministry of Electronics Industry. This standard was drafted by the Standardization Research Institute of the Ministry of Electronics Industry and the State-owned Beijing Third Radio Equipment Factory. The main drafters of this standard are: Wang Yongming, Li Xiaoying, and Han Yanfen. rYkAoNrKAcas
1 Scope
Electronic Industry Standard of the People's Republic of China
Encapsulation materials of phenolic seriesfor usein electronic components
Encapsulation materials of phenolic seriesfor usein electronic componentsSJ/T11126-1997
This standard specifies the classification, requirements, test methods, inspection rules, packaging, marking, transportation and storage of phenolic series encapsulation materials for electronic components (hereinafter referred to as encapsulation materials). This standard is applicable to the phenolic series encapsulation materials required for the outer encapsulation of electronic components such as ceramic capacitors, resistors and inductors. 2 Referenced standards
The provisions contained in the following standards constitute the provisions of this standard through reference in this standard. When this standard is published, the versions shown are valid. All standards will be revised, and the parties using this standard should explore the possibility of using the latest version of the following standards.
GB254—77
GB1036-89
GB1408--89
GB1409—88
GB1410—89
GB2411--80
GB6554—86
SJ3262—89
Classification and naming
White paraffin
Determination method of linear expansion coefficient of plastics||tt| |Test method for power frequency electrical strength of solid insulating materials Test method for relative dielectric constant and dielectric loss factor of solid insulating materials at power frequency, audio frequency and high frequency (including meter wavelength)
Test method for volume resistivity and surface resistivity of solid insulating materials Test method for Shore hardness of plastics
Test method for electrical insulation coating powder
General technical conditions for encapsulation materials for electronic components Product models and representation methods shall comply with the provisions of Chapter 3 of SJ3262-89. 4 Requirements
4.1 Powder properties
4.1.1 Under bright but indirect natural light, the encapsulation material appears to be powdery. The color is uniform and there is no lumps or other impurities that affect the use effect.
4.1.2 The residue on the 120 mesh sieve should not be more than 5%. Approved by the Ministry of Electronics Industry of the People's Republic of China on September 3, 1997
Implementation on January 1, 1998
SJ/T11126—1997
4.1.3 The volatile matter content (including water) should be less than 1%. 4.2 Properties of cured products
4.2.1 The encapsulated product should be flat and free of bubbles after curing. 4.2.2 No damage or cracking after temperature shock. 4.2.3
The properties of cured products should meet the requirements of Table 1.
Test method
Average linear expansion coefficient
Hardness (Shore hardness)
Dielectric constant (IMHz)
Normal volume resistivity
Normal 10°Hz dielectric loss tangent
Electrical strength
3×10-8
≥1×10/4
Unless otherwise specified, the sample preparation and pretreatment in the test method shall be carried out in accordance with Appendix A (Appendix to the standard). 5.1 Powder
5.1.1 Visual inspection shall be used for appearance.
5.1.2 Particle size shall be inspected in accordance with 1.3 of GB6554-86. 5.1.3 The volatile content is tested as follows: Take about 50g of the sample, put it on a glass, weigh it accurately, and then dry it in an electric blast oven at 110℃ for 2h. Take out the sample and put it in a desiccator filled with silica gel to cool to room temperature. Take out the sample and weigh it quickly and accurately with an analytical balance, and calculate the volatile content according to the following formula: Volatile content = sample weight before drying sample weight after drying × 100% sample weight before drying
5.2 Cured product
5.2.1 Visually inspect the appearance of the cured product.
5.2.2 Perform five temperature shock tests on 18 encapsulated products (20mm×1mm) under the following conditions, and visually inspect the appearance.
-55-C-
0.5h≤1min0.5h
5.2.3 The average linear expansion coefficient is tested according to GB1036. 5.2.4 Hardness is tested according to GB2411.
5.2.5 Dielectric constant is tested according to GB1409.
5.2.6 Normal volume resistivity is tested according to GB1410. 5.2.7 Normal 108Hz dielectric loss tangent is tested according to GB1409. 5.2.8 Dielectric strength is tested according to GB1408.
5.3 Packaging and marking are inspected by daily testing. 2
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Inspection rules
6.1 Inspection responsibilities
SJ/T11126-1997
6.1.1 Products shall be inspected by the supplier's technical supervision department to ensure that the product quality meets the requirements of this standard and fill in the product certificate.
6.1.2 The purchaser may inspect the products received. If the inspection results do not comply with the provisions of this standard, the purchaser shall submit the matter to the supplier within one month from the date of receipt of the product, and the two parties shall negotiate to resolve the issue. 6.2 Batch
Each submitted batch consists of products of the same model and produced under the same process conditions (with barrels as unit products). Each submitted batch shall not exceed 5te
6.3 Sampling
Three barrels shall be randomly selected from each submitted batch, and the total sample volume shall not be less than 1kg. The samples shall be mixed evenly. 6.4 Inspection classification
Product inspection is divided into delivery inspection and routine inspection. 6.4.1 Delivery inspection item 1 shall be carried out in accordance with the provisions of Table 2. Table 2
Inspection or test items
Appearance of powder
Powder particle size
Volatile content
Appearance of chemical
Required article number
Test method article number
If one item of delivery inspection is unqualified, double sampling should be carried out for re-inspection of the unqualified item. If the re-inspection result is still unqualified, the batch of products is unqualified.
Routine inspection items shall be carried out as specified in Table 3.
Inspection or test items
Appearance of powder
Powder particle size
Volatile content
Appearance of cured product
Resistance to temperature shock
Average linear expansion coefficient
Dielectric constant
Normal volume resistivity
Normal dielectric loss tangent
Electric strength
Required chapter number
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Test method chapter number
SJ/T11126-1997
6.4.4 Routine inspections shall be conducted every six months. Routine inspections shall also be conducted when there are major changes in materials, processes, equipment, etc. 6.4.5 Routine inspection samples shall be selected from the products produced this year and qualified after delivery inspection according to 6.3. If any item is unqualified during sampling and inspection, the routine inspection will be deemed unqualified. At the same time, the products within the cycle will be stopped from being delivered and the reasons should be analyzed and measures should be taken. Production can only be resumed after re-inspection.
7 Packaging, marking, transportation and storage
7.1 Packaging
7.1.1 The products should be first packed into polyethylene plastic bags, heat-sealed, and then packed into plastic barrels or fiberboard barrels. The outer packaging should be marked with "moisture-proof" and "heat-resistant". The weight of each package shall not exceed 30kg, and can also be stipulated by agreement between the supply and demand parties, but the net weight of each package shall be the same.
7.1.2 Each barrel of product shall be accompanied by a certificate of conformity, which shall state: a) product name and trademark;
product model;
net weight, kg
number of this standard:
date of manufacture and manufacturer;
validity period;
production number and inspector's mark;
h) main parameters of the product.
7.2 Marking
Each outer package of the product shall be affixed with a label, which shall indicate: a) product name and trademark;
b) product model:
net weight, kg:
d) number of this standard;
e) date of manufacture and manufacturer's name;
inspector's mark.
7.3 Transportation
The product should be transported in a place that avoids direct rain, snow, sunlight and mechanical damage, especially in high temperature seasons. If conditions permit, it should be transported at a temperature below 5°C. 7.4 Storage
The product should be sealed and stored in a dry warehouse at a temperature of about 25°C. The storage period is half a year. 4
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A1 Apparatuses required for sample preparation
SJ/T11126-1997
Appendix A
(Appendix of the standard)
Sample preparation method for phenolic encapsulation materials for electronic componentsa) Balance: Sensitivity 0.1g;
Beaker: Select the beaker capacity according to the sample volume;b)
c) Measuring cylinder;
Oven: Temperature fluctuation range is not more than ±2℃; One set of vacuum degassing equipment;
Mold.
Environmental conditions
Temperature: 15℃~35℃:
Humidity: Relative humidity is 45%~75%.
A3 Sample preparation method and requirements
Sample preparation methods are divided into wet method and dry method. A3.1 Wet method (arbitration method)
A3.1.1 Steps
a) Use a balance to weigh an appropriate amount of encapsulation material and put it into a beaker; b) Prepare the solvent according to the requirements of the product manual, use a measuring tube to measure an appropriate amount of solvent and pour it into the beaker, stir it to make the liquid in the beaker a viscous liquid without lumps and gels, and age it for 2d to 3d; c) After the aging is completed, stir it evenly and perform vacuum degassing to remove bubbles in the liquid; d) Prepare the mold, adjust the mold plane until it is horizontal, evenly apply silicone oil on the mold plane, lay a layer of polyethylene or polypropylene film, and use a soft brush to brush it. Brush the film flat until there are no wrinkles, arrange the frame and fix it to make it sealed around the edges; e) Pour the vacuum degassed liquid into the mold to make it naturally level and remove the bubbles on the surface; f) Place it at room temperature for more than 48 hours. After it is basically dry, remove the plate and cut out the specimens according to the standard size required for the test before curing:
g) Stack the cut specimens, place polyethylene or polypropylene film between the layers for isolation, and place a heat-resistant flat plate on the last layer. Press an appropriate weight on the plate to ensure that the specimen does not warp or deform during heating and curing, and then place it in an oven for heating and curing. The curing conditions shall be as specified in the product manual.
A3.2 Method
A3.2.1 Steps
a) Weigh the specified amount of material with a flat surface and put it into the mold; b) Press and refractory according to the conditions in Table 1:
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Specimen form
$100±1×4±0.2
$50±0.2×4±0.2
Mold temperature control is based on the smoothness and firmness of the pressed sample. SJ/T111261997
Low-temperature pressing and refractory conditions
Material amount
Pressure holding time
When necessary, the sample can be pre-baked before low-temperature pressing and refractory. Pre-baking conditions: temperature not exceeding 80℃, time not exceeding 1h. e) Place the pressed cold molded product in an oven for heating and curing. The curing conditions are shown in Table 2: Table 2
Room temperature—80℃
Raise the temperature evenly for half an hour to
80t, keep warm for 1h
80-120www.bzxz.net
Raise the temperature evenly for half an hour to
120℃, keep warm for 1h
120℃-→+170℃
Raise to 170℃ in half an hour
170℃—room temperature
Keep warm for 2h, then cool to
Note: When curing at high temperature, strictly control the heating speed. It should not be too fast, otherwise the sample will bubble. The samples should be placed individually on a clean and flat heat-resistant glass, otherwise it is easy to bubble and deform.
d) Wax immersion of the sample, first put 125 ozokerite (in accordance with GB254) in a porcelain cup, heat it on an electric furnace to (160±5)C, then immerse the solidified sample in the melted paraffin, keep it for 10 minutes, take it out and dry it for later use. A4 Pretreatment of samples
For samples to test the performance parameters of the solidified material, the samples should be placed in the environmental conditions of Chapter A2 so that their surfaces are exposed to the environment as much as possible. The placement time depends on the product performance parameter requirements. The pretreatment time for samples of different thicknesses () is as follows: d<0.25mm, not less than 4h;
0.25mm≤d≤2mm, not less than 8h;
d>2mm, not less than 16h.
rYKAOMrKAa1 Steps
a) Use a balance to weigh an appropriate amount of encapsulation material and put it into a beaker; b) Prepare the solvent according to the requirements of the product manual, use a measuring tube to measure an appropriate amount of solvent and pour it into the beaker, stir it, so that the liquid in the beaker becomes a viscous liquid without lumps and gels, and age it for 2d to 3d; c) After the aging is completed, stir it evenly and perform vacuum degassing to remove bubbles in the liquid; d) Prepare the mold, adjust the mold plane to a horizontal level, evenly coat the mold plane with silicone oil, lay a layer of polyethylene or polypropylene film, use a soft brush to brush the film flat until there is no wrinkle, and place it on the mold. e) Pour the vacuum degassed liquid into the mold to make it level naturally and remove bubbles on the surface; f) Place it at room temperature for more than 48 hours. After it is basically dry, remove the plate and cut out the specimens according to the standard size required for the test before curing:
g) Stack the cut specimens, place polyethylene or polypropylene film between the layers to isolate them, and place a heat-resistant flat plate on the last layer. Press an appropriate weight on the plate to ensure that the specimen does not warp or deform during heating and curing. Then place it in an oven for heating and curing. The curing conditions shall be as specified in the product manual.
A3.2 Method
A3.2.1 Steps
a) Weigh the specified amount of material with a flat surface and put it into the mold; b) Press and refractory according to the conditions in Table 1:
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Specimen form
$100±1×4±0.2
$50±0.2×4±0.2
Mold temperature control is based on the smoothness and firmness of the pressed sample. SJ/T111261997
Low-temperature pressing and refractory conditions
Material amount
Pressure holding time
When necessary, the sample can be pre-baked before low-temperature pressing and refractory. Pre-baking conditions: temperature not exceeding 80℃, time not exceeding 1h. e) Place the pressed cold molded product in an oven for heating and curing. The curing conditions are shown in Table 2: Table 2
Room temperature—80℃
Raise the temperature evenly for half an hour to
80t, keep warm for 1h
80-120
Raise the temperature evenly for half an hour to
120℃, keep warm for 1h
120℃-→+170℃
Raise to 170℃ in half an hour
170℃—room temperature
Keep warm for 2h, then cool to
Note: When curing at high temperature, strictly control the heating speed. It should not be too fast, otherwise the sample will bubble. The samples should be placed individually on a clean and flat heat-resistant glass, otherwise it is easy to bubble and deform.
d) Wax immersion of the sample, first put 125 ozokerite (in accordance with GB254) in a porcelain cup, heat it on an electric furnace to (160±5)C, then immerse the solidified sample in the melted paraffin, keep it for 10 minutes, take it out and dry it for later use. A4 Pretreatment of samples
For samples to test the performance parameters of the solidified material, the samples should be placed in the environmental conditions of Chapter A2 so that their surfaces are exposed to the environment as much as possible. The placement time depends on the product performance parameter requirements. The pretreatment time for samples of different thicknesses () is as follows: d<0.25mm, not less than 4h;
0.25mm≤d≤2mm, not less than 8h;
d>2mm, not less than 16h.
rYKAOMrKAa1 Steps
a) Use a balance to weigh an appropriate amount of encapsulation material and put it into a beaker; b) Prepare the solvent according to the requirements of the product manual, use a measuring tube to measure an appropriate amount of solvent and pour it into the beaker, stir it, so that the liquid in the beaker becomes a viscous liquid without lumps and gels, and age it for 2d to 3d; c) After the aging is completed, stir it evenly and perform vacuum degassing to remove bubbles in the liquid; d) Prepare the mold, adjust the mold plane to a horizontal level, evenly coat the mold plane with silicone oil, lay a layer of polyethylene or polypropylene film, use a soft brush to brush the film flat until there is no wrinkle, and place it on the mold. e) Pour the vacuum degassed liquid into the mold to make it level naturally and remove bubbles on the surface; f) Place it at room temperature for more than 48 hours. After it is basically dry, remove the plate and cut out the specimens according to the standard size required for the test before curing:
g) Stack the cut specimens, place polyethylene or polypropylene film between the layers to isolate them, and place a heat-resistant flat plate on the last layer. Press an appropriate weight on the plate to ensure that the specimen does not warp or deform during heating and curing. Then place it in an oven for heating and curing. The curing conditions shall be as specified in the product manual.
A3.2 Method
A3.2.1 Steps
a) Weigh the specified amount of material with a flat surface and put it into the mold; b) Press and refractory according to the conditions in Table 1:
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Specimen form
$100±1×4±0.2
$50±0.2×4±0.2
Mold temperature control is based on the smoothness and firmness of the pressed sample. SJ/T111261997
Low-temperature pressing and refractory conditions
Material amount
Pressure holding time
When necessary, the sample can be pre-baked before low-temperature pressing and refractory. Pre-baking conditions: temperature not exceeding 80℃, time not exceeding 1h. e) Place the pressed cold molded product in an oven for heating and curing. The curing conditions are shown in Table 2: Table 2
Room temperature—80℃
Raise the temperature evenly for half an hour to
80t, keep warm for 1h
80-120
Raise the temperature evenly for half an hour to
120℃, keep warm for 1h
120℃-→+170℃
Raise to 170℃ in half an hour
170℃—room temperature
Keep warm for 2h, then cool to
Note: When curing at high temperature, strictly control the heating speed. It should not be too fast, otherwise the sample will bubble. The samples should be placed individually on a clean and flat heat-resistant glass, otherwise it is easy to bubble and deform.
d) Wax immersion of the sample, first put 125 ozokerite (in accordance with GB254) in a porcelain cup, heat it on an electric furnace to (160±5)C, then immerse the solidified sample in the melted paraffin, keep it for 10 minutes, take it out and dry it for later use. A4 Pretreatment of samples
For samples to test the performance parameters of the solidified material, the samples should be placed in the environmental conditions of Chapter A2 so that their surfaces are exposed to the environment as much as possible. The placement time depends on the product performance parameter requirements. The pretreatment time for samples of different thicknesses () is as follows: d<0.25mm, not less than 4h;
0.25mm≤d≤2mm, not less than 8h;
d>2mm, not less than 16h.
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