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JB/T 5842-1991 Die locating ring for power semiconductor devices

Basic Information

Standard ID: JB/T 5842-1991

Standard Name: Die locating ring for power semiconductor devices

Chinese Name: 电力半导体器件用管芯定位环

Standard category:Machinery Industry Standard (JB)

state:Abolished

Date of Release1991-10-24

Date of Implementation:1992-10-01

Date of Expiration:2005-09-01

standard classification number

Standard Classification Number:Electrical Engineering>>Power Transmission and Transformation Equipment>>K46 Power Semiconductor Devices and Components

associated standards

alternative situation:Replaced by JB/T 5842-2005

Publication information

other information

Introduction to standards:

Replaced by JB/T 5842-2005 JB/T 5842-1991 Die locating ring for power semiconductor devices JB/T5842-1991 Standard download decompression password: www.bzxz.net

Some standard content:

Mechanical Industry Standard of the People's Republic of China
JB/T 5842-1991
Die Locating Ring for Power Semiconductor Devices
Published on October 24, 1991
Implemented on October 1, 1992 by the Ministry of Machinery and Electronics Industry of the People's Republic of China
Mechanical Industry Standard of the People's Republic of China
Die Locating Ring for Power Semiconductor Devices
Subject Content and Applicable Scope
JB/T5842-1991
This standard specifies the dimensions, models, technical requirements and inspection rules of die locating rings for power semiconductor devices. This standard is used for die locating rings for power semiconductor devices (hereinafter referred to as locating rings). Cited standards
GB2423.22
GB7137
HG2~234
Models and classifications
3.1 Models
Basic test methods for low-voltage electrical appliances
Basic environmental test regulations for electric and electronic products Test B: High temperature test method
Basic environmental test regulations for electric and electronic products Test N, temperature change test method
Test method for particle size of polytetrafluoroethylene resin
Polytetrafluoroethylene resin (suspension particle size). DH
Indicates the type of locating ring
Indicates the height of the locating ring
Indicates the maximum outer diameter of the locating ring
Indicates the locating ring
3.2 Classification
According to the technical data, the different structures of the locating ring are divided into A, B, C and protruding types. The detailed structure is shown in Figures 1 to 3.
Approved by the Ministry of Machinery and Electronics Industry on October 24, 1991, Type A grid drawing
Implementation on October 1, 1992
Overall dimensions and allowable deviations
JB/T5842-1991
Type B structure drawing
Type C structure drawing
4.1The overall dimensions and allowable deviations of Type A locating rings shall comply with the provisions of Table 1. Table 1 | | tt | ×3A
DHS6X3A
DH38×3A
DH49×1 3A
DH45×3A
DH50X3A
DH50X17,5A
DH55×3A
DHS5×4A
DHS5×4A
D76X3A
DHaOx4A
DH0x3A
JB/T5842—1991
Size code
The overall dimensions and deviation of B-type fixed ring shall conform to the requirements of the table. Table 2
Dimension code
DH9XSB
DHI4X5B
DH30×4B
DH22×4B
DH26×4B
@Di+·1
@D2*·
DH28×4B
DR28×9B
D3 0×4B
DH30X7B
DH32×6B
DH34×6B
DH34×10B
DI35×4B
D3×9B
DI3 8 × 4R | | tt | | DH38 × 7B | ×7B
DHSOXSB
DH52×10B
3854×12B
DHS4×8B
DH54×4B
DE55×7B
JB/T 58421991
Continued Table 2
Heart code
30(29)
86(35)bZxz.net
33(36)
36(35)
20(25)
36(37)
Se(35)
42(egg 4)
DH5x16B
Di80x10 B
DH6S×SB
DH68×B
DHGSX2B
DH:5X8B
DE80x8R
DH10SX7B
JB/T5842—1991
Continued Table 2
72(70)
The overall dimensions and allowable deviations of C-type locating rings shall conform to the provisions of Table 3. Table 3
DH34×15C
DH×15C
DH48X12C
D50X15C
DH4×15C
DH64×1EC
5 Technical requirements
5.1 Appearance
ΦD1±0.95
63(60)
$D2±0.05
The surface of the positioning ring should be flat, smooth, without cracks, and the edge should be free of burrs. The surface of the positioning ring should be color-free and without spots. 5.2 Surface quality
The positioning ring has a stability parameter Ra of: 1.0um. 5.3 Material
The positioning ring adopts the brand SFX-1 polyvinyl fluoride resin (film float method). Insulation strength
The insulation illumination of the fixed reliability should not be less than 10V. mm
Inspection regulations
JB/T58421991
The inspection of positioning rings is divided into two categories: quality plate consistency inspection and identification inspection. 6.1 Quality consistency inspection
6.1.1 Group A inspection (batch by batch)
Each batch of positioning rings must be inspected according to the items specified in Table 4. Inspection items: Overall dimensions Surface quality Inspection method: Vernier caliper Full scale According to relevant standards and regulations, etc. Comply with Article 5.1, Article 2 Sampling control plan AQL Standard level Note: See Appendix A for the specific interpretation of AQL. If the batch inspection fails for the first time, it can be re-inspected once according to the strict inspection method, and can only be submitted once. 6.1.2 Maintenance inspection (cycle) The positioning rings produced by plastic molding must be inspected every six months according to the items specified in Table 5. Table
Identification test
Test items
Ultimate strength
Test method
GB7187 and
FG 2--34--78
Metal type
Conform to Article 5.3
Conform to Article 5.4
According to the plan
The purpose of identification test is to determine whether the manufacturer is capable of producing products that meet the requirements of the standard. When the design, process, and materials are changed or when the production is resumed after suspension, the identification test should be carried out. For the normal batch production of the finalized design, at least one batch of identification tests should be carried out every three years. The identification test items shall be carried out in accordance with Article 6.1 and Table 6. G
Test Items
High Temperature Test
Temperature Environment
Acid Control Method
GB2423.2(B)
17516h
GR 2423.22(N)
-40℃, +150℃ respectively
30min Transfer Time
2~3min, Three Environments
Qualified Criteria
Including Article 4
Special 5.1
and Article 5.2
Sampling Plan
Note: ① In the sampling plan, C and C are the number of samples and the number of qualified judgments respectively. If the first sampling test fails, the test can be repeated according to the method of forced sampling B, and only one additional test can be conducted. 6
7Packaging, transportation, purchase and storage, marking
7.1 Packaging
JB/T 58421991
The positioning rings are packaged after they have passed the inspection and obtained the certificate of conformity. When packaging, first wrap the positioning rings with paper according to different specifications, and then put them into wooden boxes and nail them.
7.2 Transportation
The positioning rings should be strictly prevented from violent movement and collision during the installation process to avoid damage. 7.3 Storage
The positioning rings should be stored in a dry, ventilated place without acid and alkali gas corrosion. 7.4 Marking
The following marks should be marked in a conspicuous place outside the packaging box; a, product name
b, product number and specification.
, manufacturing extension,
manufacturing date or production batch number.
7.5 Acceptance
The supplier should conduct an acceptance search within three months after receiving the positioning rings. If any problems are found, they should be raised to the supplier in a timely manner and handled by negotiation between the supply and demand parties.
Wholesale range
91~150
151~280
281~500
501~1200
3201~3200
3201~10000
Sample size
JB/T5842—1991
AQL (Qualified Quality Level) (Supplement)
Initial sample
Additional sample
Additional number
Additional explanation:
JB/T5842-1991
Appendix B
Additional sampling table
Supplement)
This standard was proposed and managed by the Xi'an Power Electronics Technology Research Institute of the Ministry of Electronics Industry. This standard was drafted by Liang'an Power Electronics Technology Research Institute and North China Rectifier Device Factory. The main drafters of this standard are Du Jimei and Song Xibo. 18
Number of determinations
People's Republic of China
Mechanical Industry Standard
Die Locating Ring for Power Semiconductor Devices
JB/T 58421991
Published by the China Academy of Mechanical Science
Printed by the China Academy of Mechanical Science
(No. 2 Shouti South Road, Beijing
Postal Code 100044)
Number of words XXX,XXX
Format 880×1230
Sheet X/X
Edition X, XX, 19XX
Printing X, XX, 19XX
Number of prints 1-XXX
Price XXX.XX Yuan
XX-XXX
Mechanical Industry Standard Service Network: http://www.JB.ac.cn1661_8
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