Replaced by JB/T 5842-2005 JB/T 5842-1991 Die locating ring for power semiconductor devices JB/T5842-1991 Standard download decompression password: www.bzxz.net
Some standard content:
Mechanical Industry Standard of the People's Republic of China JB/T 5842-1991 Die Locating Ring for Power Semiconductor Devices Published on October 24, 1991 Implemented on October 1, 1992 by the Ministry of Machinery and Electronics Industry of the People's Republic of China Mechanical Industry Standard of the People's Republic of China Die Locating Ring for Power Semiconductor Devices Subject Content and Applicable Scope JB/T5842-1991 This standard specifies the dimensions, models, technical requirements and inspection rules of die locating rings for power semiconductor devices. This standard is used for die locating rings for power semiconductor devices (hereinafter referred to as locating rings). Cited standards GB2423.22 GB7137 HG2~234 Models and classifications 3.1 Models Basic test methods for low-voltage electrical appliances Basic environmental test regulations for electric and electronic products Test B: High temperature test method Basic environmental test regulations for electric and electronic products Test N, temperature change test method Test method for particle size of polytetrafluoroethylene resin Polytetrafluoroethylene resin (suspension particle size). DH Indicates the type of locating ring Indicates the height of the locating ring Indicates the maximum outer diameter of the locating ring Indicates the locating ring 3.2 Classification According to the technical data, the different structures of the locating ring are divided into A, B, C and protruding types. The detailed structure is shown in Figures 1 to 3. Approved by the Ministry of Machinery and Electronics Industry on October 24, 1991, Type A grid drawing Implementation on October 1, 1992 Overall dimensions and allowable deviations JB/T5842-1991 Type B structure drawing Type C structure drawing 4.1The overall dimensions and allowable deviations of Type A locating rings shall comply with the provisions of Table 1. Table 1 | | tt | ×3A DHS6X3A DH38×3A DH49×1 3A DH45×3A DH50X3A DH50X17,5A DH55×3A DHS5×4A DHS5×4A D76X3A DHaOx4A DH0x3A JB/T5842—1991 Size code The overall dimensions and deviation of B-type fixed ring shall conform to the requirements of the table. Table 2 Dimension code DH9XSB DHI4X5B DH30×4B DH22×4B DH26×4B @Di+·1 @D2*· DH28×4B DR28×9B D3 0×4B DH30X7B DH32×6B DH34×6B DH34×10B DI35×4B D3×9B DI3 8 × 4R | | tt | | DH38 × 7B | ×7B DHSOXSB DH52×10B 3854×12B DHS4×8B DH54×4B DE55×7B JB/T 58421991 Continued Table 2 Heart code 30(29) 86(35)bZxz.net 33(36) 36(35) 20(25) 36(37) Se(35) 42(egg 4) DH5x16B Di80x10 B DH6S×SB DH68×B DHGSX2B DH:5X8B DE80x8R DH10SX7B JB/T5842—1991 Continued Table 2 72(70) The overall dimensions and allowable deviations of C-type locating rings shall conform to the provisions of Table 3. Table 3 DH34×15C DH×15C DH48X12C D50X15C DH4×15C DH64×1EC 5 Technical requirements 5.1 Appearance ΦD1±0.95 63(60) $D2±0.05 The surface of the positioning ring should be flat, smooth, without cracks, and the edge should be free of burrs. The surface of the positioning ring should be color-free and without spots. 5.2 Surface quality The positioning ring has a stability parameter Ra of: 1.0um. 5.3 Material The positioning ring adopts the brand SFX-1 polyvinyl fluoride resin (film float method). Insulation strength The insulation illumination of the fixed reliability should not be less than 10V. mm Inspection regulations JB/T58421991 The inspection of positioning rings is divided into two categories: quality plate consistency inspection and identification inspection. 6.1 Quality consistency inspection 6.1.1 Group A inspection (batch by batch) Each batch of positioning rings must be inspected according to the items specified in Table 4. Inspection items: Overall dimensions Surface quality Inspection method: Vernier caliper Full scale According to relevant standards and regulations, etc. Comply with Article 5.1, Article 2 Sampling control plan AQL Standard level Note: See Appendix A for the specific interpretation of AQL. If the batch inspection fails for the first time, it can be re-inspected once according to the strict inspection method, and can only be submitted once. 6.1.2 Maintenance inspection (cycle) The positioning rings produced by plastic molding must be inspected every six months according to the items specified in Table 5. Table Identification test Test items Ultimate strength Test method GB7187 and FG 2--34--78 Metal type Conform to Article 5.3 Conform to Article 5.4 According to the plan The purpose of identification test is to determine whether the manufacturer is capable of producing products that meet the requirements of the standard. When the design, process, and materials are changed or when the production is resumed after suspension, the identification test should be carried out. For the normal batch production of the finalized design, at least one batch of identification tests should be carried out every three years. The identification test items shall be carried out in accordance with Article 6.1 and Table 6. G Test Items High Temperature Test Temperature Environment Acid Control Method GB2423.2(B) 17516h GR 2423.22(N) -40℃, +150℃ respectively 30min Transfer Time 2~3min, Three Environments Qualified Criteria Including Article 4 Special 5.1 and Article 5.2 Sampling Plan Note: ① In the sampling plan, C and C are the number of samples and the number of qualified judgments respectively. If the first sampling test fails, the test can be repeated according to the method of forced sampling B, and only one additional test can be conducted. 6 7Packaging, transportation, purchase and storage, marking 7.1 Packaging JB/T 58421991 The positioning rings are packaged after they have passed the inspection and obtained the certificate of conformity. When packaging, first wrap the positioning rings with paper according to different specifications, and then put them into wooden boxes and nail them. 7.2 Transportation The positioning rings should be strictly prevented from violent movement and collision during the installation process to avoid damage. 7.3 Storage The positioning rings should be stored in a dry, ventilated place without acid and alkali gas corrosion. 7.4 Marking The following marks should be marked in a conspicuous place outside the packaging box; a, product name b, product number and specification. , manufacturing extension, manufacturing date or production batch number. 7.5 Acceptance The supplier should conduct an acceptance search within three months after receiving the positioning rings. If any problems are found, they should be raised to the supplier in a timely manner and handled by negotiation between the supply and demand parties. Wholesale range 91~150 151~280 281~500 501~1200 3201~3200 3201~10000 Sample size JB/T5842—1991 AQL (Qualified Quality Level) (Supplement) Initial sample Additional sample Additional number Additional explanation: JB/T5842-1991 Appendix B Additional sampling table Supplement) This standard was proposed and managed by the Xi'an Power Electronics Technology Research Institute of the Ministry of Electronics Industry. This standard was drafted by Liang'an Power Electronics Technology Research Institute and North China Rectifier Device Factory. The main drafters of this standard are Du Jimei and Song Xibo. 18 Number of determinations People's Republic of China Mechanical Industry Standard Die Locating Ring for Power Semiconductor Devices JB/T 58421991 Published by the China Academy of Mechanical Science Printed by the China Academy of Mechanical Science (No. 2 Shouti South Road, Beijing Postal Code 100044) Number of words XXX,XXX Format 880×1230 Sheet X/X Edition X, XX, 19XX Printing X, XX, 19XX Number of prints 1-XXX Price XXX.XX Yuan XX-XXX Mechanical Industry Standard Service Network: http://www.JB.ac.cn1661_8 Tip: This standard content only shows part of the intercepted content of the complete standard. If you need the complete standard, please go to the top to download the complete standard document for free.